IP Library Granted Patent US 11,621,141
Granted Patent B2
US 11,621,141 · App. 16/077,782 · Granted Apr 4, 2023

Ion milling device and ion milling method

Inventors: Toru Iwaya (Tokyo, JP); Hisayuki Takasu (Tokyo, JP); Sakae Koubori (Tokyo, JP)
Assignee: Hitachi High-Tech Corporation
H01J37/20H01J37/08H01J37/265H01J37/30H01J37/304H01J37/3053H01J2237/026H01J2237/202H01J2237/20214H01J2237/20221
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Quick Facts
Patent No.
US 11,621,141
App. No.
16/077,782
Granted
Apr 4, 2023
Kind
B2
Abstract

Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam.

Claims (18)

1. An ion milling device which emits an ion beam to a sample to machine the sample, comprising:

an ion source which emits the ion beam;

a sample holder which holds the sample of which at least a part is shielded by a mask;

a sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam;

a rotation mechanism which rotates and tilts the sample holder around an axis perpendicular to a direction of a sliding movement caused by the sliding mechanism; and

a control unit which controls the sliding mechanism, wherein

while emitting the ion beam, the sample is subjected to the slide reciprocating drive by the sliding mechanism, and a desired machining width is obtained by one time of processing, such that the sample undergoes movement in two opposite directions, and a width equal to the desired machining width is exposed to the ion beam.

2. The ion milling device according to claim 1 , wherein

the sliding mechanism slides the sample with a width wider than a width of the ion beam.

3. The ion milling device according to claim 1 , wherein

the sliding mechanism is installed above the rotation mechanism, and a position of a rotation shaft of the rotation mechanism is constant.

4. The ion milling device according to claim 3 , wherein

the rotation shaft of the rotation mechanism is on a path of the ion beam.

5. The ion milling device according to claim 4 , wherein

the slide movement mechanism slides the sample in a plane perpendicular to the rotation shaft of the rotation mechanism.

6. The ion milling device according to claim 1 , further comprising:

a user interface which sets machining information which is input based on a machining content of the sample, wherein

the control unit controls the sliding mechanism based on the machining information set by the user interface.

Assignments (2)
CHANGE OF NAME Recorded Apr 14, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052398/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 14, 2018
From: IWAYA, TORU; TAKASU, HISAYUKI; KOUBORI, SAKAE
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 046819/0541 →
Continuity (1)
Related Publication 20210193430A1 · Jun 24, 2021
Cited By (1)
US 12,198,892