IP Library › Granted Patent US 11,326,025
Granted Patent B2
US 11,326,025 · App. 16/079,810 · Granted May 10, 2022

Polyamideimide copolymer and polyamideimide film comprising the same

Inventors: Bi Oh Ryu (Daejeon, KR); Soon Yong Park (Daejeon, KR); Young Ji Tae (Daejeon, KR); Young Seok Park (Daejeon, KR); Kwan Yeol Paek (Daejeon, KR)
Assignee: LG CHEM, LTD.
C08G73/14C08J5/18C08J2379/08C08J2479/08
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Quick Facts
Patent No.
US 11,326,025
App. No.
16/079,810
Granted
May 10, 2022
Kind
B2
Abstract

The present invention relates to a polyamideimide copolymer and a colorless and transparent polyamideimide copolymer film. The polyamideimide copolymer according to the present invention enables to provide a polyamideimide film having improved UV shielding function while exhibiting excellent scratch resistance and mechanical properties.

Claims (8)

1. A polyamideimide film comprising a polyamideimide copolymer which is an imidization product of polyamic acid comprising copolymerized aromatic diamine monomer, aromatic dianhydride monomer, and aromatic dicarbonyl monomer,

wherein the aromatic dicarbonyl monomer is contained in an amount of 51 mol % or more based on the total moles of the aromatic dianhydride monomer and the aromatic dicarbonyl monomer,

wherein the aromatic dicarbonyl monomer comprises 10 mol % to 50 mol % of 4,4′-biphenyldicarbonyl chloride, 10 mol % to 30 mol % of isophthaloyl chloride, and 40 mol % to 60 mol % of terephthaloyl chloride based on the total moles of the aromatic dicarbonyl monomer, and

wherein the UV-cut slope (dT/dλ) measured for a film specimen having a thickness of 25 to 55 μm according to ASTM E424 is at least 2.88 in the range of 10% to 80% transmittance.

2. The polyamideimide film of claim 1 , wherein the aromatic diamine monomer is 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine.

3. The polyamideimide film of claim 1 , wherein the aromatic dianhydride monomer is 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride.

4. The polyamideimide film of claim 1 , wherein the pencil hardness measured for a film specimen having a thickness of 25 to 55 μm according to ASTM D3363 is 2H or higher.

5. The polyamideimide film of claim 1 , wherein the tensile strength measured for a film specimen having a thickness of 25 to 55 μm according to ASTM D638 is 180 MPa or more.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2018
From: RYU, BI OH; PARK, SOON YONG; TAE, YOUNG JI; PARK, YOUNG SEOK; PAEK, KWAN YEOL
To: LG CHEM, LTD.
Reel/Frame 046697/0969 →
Priority Claims (1)
KR 10-2017-0024908 · Feb 24, 2017 · national
Continuity (1)
Related Publication 20210189067A1 · Jun 24, 2021