IP Library Granted Patent US 10,859,417
Granted Patent B2
US 10,859,417 · App. 16/080,767 · Granted Dec 8, 2020

Thermal mass flow sensor, method for manufacturing the thermal mass flow sensor, and thermal mass flow meter using the thermal mass flow sensor

Inventors: Ryu Sasaki (Mie, JP); Mamoru Ishii (Mie, JP)
Assignee: Hitachi Metals, Ltd.
G01F1/6847G01F1/684G01F1/688G01F1/69
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Quick Facts
Patent No.
US 10,859,417
App. No.
16/080,767
Granted
Dec 8, 2020
Kind
B2
Abstract

A thermal mass flow sensor 10 enclosed airtightly in a sealed container 11 under an inert atmosphere for the purpose of suppressing disappearance of a coating layer on sensor wires 13 a and 13 b in association with use at a high temperature, further comprises an air release pipe 16 that is a pipe which brings an internal space and outside of the sealed container 11 in airtight communication with each other through an air release hole 16 a that is a through-hole formed in an outer wall of the sealed container 11 . An end of the air release pipe 16 on an opposite side to the air release hole 16 a is sealed by plastic deformation to form a sealed part 16 b . Thereby, after forming the sealed container 11 under a normal atmosphere, the internal space of the sealed container 11 can be closed airtightly. The sealed part 16 b may be further sealed by welding. The sealed container 11 can be assembled easily and accurately in this way, and degradation in airtightness of the sealed container 11 in association with use at a high temperature can be suppressed.

Claims (65)

1. A thermal mass flow sensor comprising:

a sealed container, a sensor tube which communicates airtightly with an inlet and an outlet formed in an outer wall defining an internal space of said sealed container and is housed in said internal space of said sealed container, a pair of sensor wires wound around said sensor tube, a coating layer covering at least a part of said sensor wires, which are wound around said sensor tube, and a hermetic connector which is disposed on said outer wall and electrically connects both ends of each of the pair of said sensor wires with external electrodes disposed outside said sealed container, and

said internal space of said sealed container is sealed so as to be an inert atmosphere, wherein:

said thermal mass flow sensor further comprises:

an air release pipe that is a pipe which brings said internal space and outside of said sealed container in airtight communication with each other through an air release hole that is a through-hole formed in said outer wall, and

a cap having an opening and an internal space, in which a sealed part can be housed, and

an end of said air release pipe on an opposite side to said air release hole is sealed by plastic deformation to form said sealed part, and

said cap and said air release pipe are further sealed by welding in a state where said sealed part is inserted in said internal space of said cap through said opening.

2. The thermal mass flow sensor according to claim 1 , wherein:

said sealed part is further sealed by welding.

3. A method of manufacturing a thermal mass flow sensor,

said thermal mass flow sensor comprising:

a sealed container, a sensor tube which communicates airtightly with an inlet and an outlet formed in an outer wall defining an internal space of said sealed container and is housed in said internal space of said sealed container, a pair of sensor wires wound around said sensor tube, a coating layer which covers at least a part of said sensor wires, which are wound around said sensor tube, and a hermetic connector which disposed on said outer wall and electrically connects both ends of each of the pair of said sensor wires with external electrodes which are disposed outside said sealed container, and

said internal space of said sealed container is sealed so as to be an inert atmosphere,

said thermal mass flow sensor further comprises;

an air release pipe that is a pipe which brings said internal space and outside of said sealed container in airtight communication with each other through an air release hole that is a through-hole formed in said outer wall, and

a cap having an opening and an internal space, in which a sealed part can be housed, and

an end of said air release pipe on an opposite side to said air release hole is sealed by plastic deformation to form said sealed part, and

said cap and said air release pipe are further sealed by welding in a state where said sealed part is inserted in said internal space of said cap through said opening,

said method including:

a first step where said sensor tube, around which the pair of said sensor wires is wound, is welded to a first member that is a member in which said inlet and said outlet are formed, among a plurality of members constituting said sealed container, such that said inlet and said outlet are in airtight communication with both ends of said sensor tube,

a second step where both ends of each of the pair of said sensor wires are electrically connected to corresponding terminals of said hermetic connector, respectively, in a second member that is a member in which said hermetic connector is disposed, among the plurality of said members constituting said sealed container,

a third step where said air release pipe is welded to a third member that is a member in which said air release hole is formed, among the plurality of said members constituting said sealed container, such that said air release pipe is in airtight communication with said internal space of said sealed container through said air release hole,

a fourth step where the plurality of said members constituting said sealed container is welded with one another to form said sealed container, and

a fifth step wherein said end of said air release pipe on an opposite side to said air release hole is sealed by plastic deformation to form said sealed part, after discharging air from said internal space through said air release pipe, and

in said fifth step, a cap having an opening and an internal space, in which said sealed part can be housed, and said air release pipe are further sealed by welding in a state where said sealed part is inserted in said internal space of said cap through said opening after forming said sealed part.

4. The method for manufacturing a thermal mass flow sensor according to 3 , wherein:

in said fifth step, the end of said air release pipe on an opposite side to said air release hole is sealed by plastic deformation to form said sealed part, after enclosing inert gas in said internal space through said air release pipe after discharging air from said internal space through said air release pipe.

5. The method for manufacturing a thermal mass flow sensor according to claim 4 , wherein:

in said fifth step, said inert gas whose moisture content has been lowered by a moisture reducing means which reduces moisture contained in said inert gas is enclosed into said internal space through said air release pipe, after discharging air from said internal space through said air release pipe.

6. The method for manufacturing a thermal mass flow sensor according to claim 3 , wherein:

in said fifth step, said sealed part is further sealed by welding after forming said sealed part.

7. The method for manufacturing a thermal mass flow sensor according to claim 3 , further including:

an airtightness testing step where a position, to which specific gas for detection is being supplied when said specific gas for detection is detected in gas being discharged from said internal space through said air release pipe, is determined as a fault position, at which airtightness is insufficient, while locally supplying said specific gas for detection to an outer surface of said sealed container, before performing said fifth step.

8. The method for manufacturing a thermal mass flow sensor according to claim 3 , wherein:

said fifth step is performed at a temperature higher than a room temperature.

9. The method for manufacturing a thermal mass flow sensor according to claim 8 , wherein:

said fifth step is performed at a temperature higher than a room temperature and not higher than 200° C.

10. A thermal mass flow meter comprising:

a base which has one installation surface and has a channel for fluid prepared in the inside of said base,

a bypass disposed in the middle of said channel,

a thermal mass flow sensor including:

a sealed container, a sensor tube which communicates airtightly with an inlet and an outlet formed in an outer wall defining an internal space of said sealed container and is housed in said internal space of said sealed container, a pair of sensor wires wound around said sensor tube, a coating layer covering at least a part of said sensor wires, which are wound around said sensor tube, and a hermetic connector which is disposed on said outer wall and electrically connects both ends of each of the pair of said sensor wires with external electrodes disposed outside said sealed container, and

said internal space of said sealed container is sealed so as to be an inert atmosphere, wherein:

said thermal mass flow sensor further comprises;

an air release pipe that is a pipe which brings said internal space and outside of said sealed container in airtight communication with each other through an air release hole that is a through-hole formed in said outer wall, and

a cap having an opening and an internal space, in which a sealed part can be housed, and

an end of said air release pipe on an opposite side to said air release hole is sealed by plastic deformation to form said sealed part, and

said cap and said air release pipe are further sealed by welding in a state where said sealed part is inserted in said internal space of said cap through said opening; and

a sensor circuit including a bridge circuit constituted by said sensor wires and other resistive elements, wherein

said sensor tube is configured so as to branch from said channel on an upstream side of said bypass and to join said channel on a downstream side of said bypass after bypassing outside said installation surface.

11. The thermal mass flow meter according to claim 10 , further comprising:

a heat conductive block which is formed of heat conductive material and is disposed at a position adjacent to said sealed container to contact with said installation surface,

a bottom surface of said heat conductive block and said installation surface are in surface contact with each other, and

at least one of side surfaces of said heat conductive block and a side surface of said sealed container are in surface contact with each other.

12. The thermal mass flow meter according to claim 11 , further comprising:

a temperature adjusting block which is disposed so as to be in contact with a side surface of at least either one of said base and said heat conductive block, and

said temperature adjusting block is formed of heat conductive material, and have a heating element which heats said temperature adjusting block and/or a cooling element which cools said temperature adjusting block.

13. The thermal mass flow meter according to claim 12 , wherein:

said air release hole is arranged at a position symmetrical with respect to the pair of said sensor wires in a heat conduction path in said thermal mass flow sensor.

14. The thermal mass flow meter according to claim 12 , wherein:

through-holes, through which said air release pipe is inserted, are formed in said heat conductive block and said temperature adjusting block, and

the shortest distance between an outside surface of said air release pipe and inside surfaces of said through-holes is 1 millimeter or more.

15. The thermal mass flow meter according to claim 14 , wherein:

heat insulating material is filled between the outside surface of said air release pipe and the inside surfaces of said through-holes.

Assignments (4)
CHANGE OF ADDRESS Recorded Sep 11, 2024
From: HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 068944/0403 →
CHANGE OF NAME Recorded Sep 11, 2024
From: HITACHI METALS, LTD.
To: PROTERIAL, LTD.
Reel/Frame 068944/0827 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 049924 FRAME 0164. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Oct 15, 2020
From: SASAKI, RYU; ISHII, MAMORU
To: HITACHI METALS, LTD.
Reel/Frame 054085/0561 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2019
From: SASAKI, RYU; ISHII, MAMORU
To: HITACHI METALS LTD.
Reel/Frame 049924/0164 →
Priority Claims (1)
JP 2016-048578 · Mar 11, 2016 · national
Continuity (1)
Related Publication 20190178693A1 · Jun 13, 2019