Semiconductor device, solid-state image pickup element, image pickup device, and electronic apparatus
The present disclosure relates to a semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus that are enabled to reduce restrictions on materials and restrictions on device configuration. A CSP imager and a mounting substrate are connected together with a connection portion other than a solder ball. With such a configuration, restrictions on materials and restrictions on device configuration are reduced, which has conventionally occurred because it is limited to a configuration in which solder balls are used for connection. The present disclosure can be applied to image pickup devices.
1. An image pickup, device comprising:
a solid-state image pickup element that captures an image, wherein the solid-state image pickup element includes a layered structural body; and
a mounting substrate on which the solid-state image pickup element is mounted,
wherein the solid-state image pickup element is mounted on the mounting substrate with a connection portion,
wherein the connection portion includes a first plurality of conductive pads on a bonding surface of the layered structural body and a second plurality of conductive pads on a bonding surface of the mounting substrate,
wherein each conductive pad in the first plurality of conductive pads is directly bonded to a corresponding conductive pad in the second plurality of conductive pads,
wherein the connection portion includes a junction of an anisotropic conductive member, and
wherein the anisotropic conductive member is provided on one or both of a bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and the bonding surface of the mounting substrate to be bonded with the solid-state image pickup element.
2. The image pickup device according to claim 1 , wherein the anisotropic conductive member is an anisotropic conductive film, or an anisotropic conductive paste.
3. The image pickup device according to claim 1 , wherein the solid-state image pickup element is a chip size package (CSP) imager.
4. The image pickup device according to claim 1 , wherein the first plurality and the second plurality of conductive pads are heated and melted in a state of being provided on one or both of the bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and the bonding surface of the mounting substrate to be bonded with the solid-state image pickup element, and then cooled to bond the solid-state image pickup element and the mounting substrate together.
5. The image pickup device according to claim 4 , wherein the first plurality and the second plurality of conductive pads include a single material film of any of Sn, Ag, Au, Sb, Cu, and Pb formed in a plurality of layers, or a single material film in which an alloy of at least two of the Sn, Ag, Au, Sb, Cu, and Pb is used.
6. The image pickup device according to claim 5 , wherein the first plurality and the second plurality of conductive pads are formed by a sputtering method, a vapor deposition method, or a plating method.
7. The image pickup device according to claim 5 , wherein the first plurality and the second plurality of conductive pads dissipate heat generated from the solid-state image pickup element and the mounting substrate depending on a bonding area of the bonding surfaces of the solid-state image pickup element and the mounting substrate.
8. The image pickup device according to claim 1 , wherein the anisotropic conductive member includes a mixture of a conductive particle responsible for conductivity and an adhesive responsible for fixing.
9. The image pickup device according to claim 8 , wherein the conductive particle is a metal core including Ni simple substance and gold-plated Ni, or a gold-plated resin core including styrene, acrylic, and titanium oxide, and the adhesive is a synthetic rubber, a thermoreversible resin, or a thermosetting resin including an epoxy resin.
10. An image pickup device comprising:
a solid-state image pickup element that captures an image; and
a mounting substrate on which the solid-state image pickup element is mounted, wherein
the solid-state image pickup element is mounted on the mounting substrate with a connection portion having a configuration that does not use a solder ball, wherein the connection portion is a junction of a metal bump, wherein the metal bump is provided on one or both of a bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and a bonding surface of the mounting substrate to be bonded with the solid-state image pickup element, and wherein the metal bump is crimped in a state of being provided on one or both of the bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and the bonding surface of the mounting substrate to be bonded with the solid-state image pickup element, to bond the solid-state image pickup element and the mounting substrate together.
11. An image pickup device comprising:
a solid-state image pickup element that captures an image; and
a mounting substrate on which the solid-state image pickup element is mounted,
wherein the solid-state image pickup element is mounted on the mounting substrate with a connection portion having a configuration that does not use a solder ball, wherein the connection portion is a junction of a conductive resin,
wherein the conductive resin is provided on one or both of a bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and a bonding surface of the mounting substrate to be bonded with the solid-state image pickup element, and wherein the conductive resin is crimped in a state of being provided on one or both of the bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and the bonding surface of the mounting substrate to be bonded with the solid-state image pickup element, to bond the solid-state image pickup element and the mounting substrate together.
12. The image pickup device according to claim 11 , wherein the conductive resin is a mixture of a metal responsible for conductivity and a resin responsible for fixing.
13. The image pickup device according to claim 12 , wherein the metal responsible for conductivity is Ag, and the resin responsible for fixing is an epoxy resin.
14. An image pickup device comprising:
a solid-state image pickup element that captures an image; and
a mounting substrate on which the solid-state image pickup element is mounted,
wherein the solid-state image pickup element is mounted on the mounting substrate with a connection portion having a configuration that does not use a solder ball, wherein the connection portion is a junction of an anisotropic conductive member, and the anisotropic conductive member is provided on one or both of a bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and a bonding surface of the mounting substrate to be bonded with the solid-state image pickup element, and wherein the anisotropic conductive member is crimped in a state of being provided on one or both of the bonding surface of the solid-state image pickup element to be bonded with the mounting substrate and the bonding surface of the mounting substrate to be bonded with the solid-state image pickup element, to bond the solid-state image pickup element and the mounting substrate together.