Synchronized solid-state imaging element, imaging device, and electronic device
There is provided a solid-state imaging element in which a first substrate in which a pixel circuit including a pixel array unit is formed and a second substrate in which a plurality of signal processing circuits are formed are laminated, and a common reference clock is supplied to the plurality of signal processing circuits that are formed on the second substrate.
1. A solid-state imaging element comprising:
a first substrate in which a pixel circuit including a pixel array unit is formed;
a second substrate in which a plurality of separate signal processing circuits are formed, wherein each separate signal processing circuit of the plurality of separate signal processing circuits includes a separate and distinct row decoder and a separate and distinct column decoder, wherein the plurality of separate signal processing circuits are physically separated from each other, wherein the first substrate and the second substrate are laminated; and
a common reference clock supplied to the plurality of separate signal processing circuits that are formed in the second substrate.
2. The solid-state imaging element according to claim 1 , further comprising
a multiplier unit configured to multiply a reference clock supplied to the plurality of separate signal processing circuits,
wherein the plurality of separate signal processing circuits use a clock signal multiplied by the reference clock by the multiplier unit for signal processing.
3. The solid-state imaging element according to claim 1 ,
wherein a reference clock is supplied to one of the plurality of separate signal processing circuits and a signal processing circuit to which the reference clock is supplied supplies the reference clock to another signal processing circuit.
4. The solid-state imaging element according to claim 1 ,
wherein the multiplier unit configured to multiply the reference clock is included in one of the plurality of separate signal processing circuits, and
a reference clock is supplied to the one of the plurality of separate signal processing circuits, and a clock signal multiplied by the multiplier unit is supplied to the a signal processing circuit other than the one signal processing circuit among the plurality of separate signal processing circuits.
5. The solid-state imaging element according to claim 4 ,
wherein the reference clock and the clock signal multiplied by the reference clock are supplied to the plurality of separate signal processing circuits.
6. The solid-state imaging element according to claim 1 , further comprising
a multiplier unit configured to multiply a reference clock supplied to the plurality of separate signal processing circuits,
wherein the signal processing circuit includes
an analog signal processing unit configured to perform analog signal processing on a clock signal multiplied by the reference clock by the multiplier unit, and
a digital signal processing unit configured to perform digital signal processing on a clock signal multiplied by the multiplier unit in another signal processing circuit to which the reference clock is supplied.
7. The solid-state imaging element according to claim 1 , wherein each separate signal processing circuit of the plurality of separate signal processing circuits includes a current source, memory circuitry, data processing circuitry, and an interface.
8. An imaging device comprising:
a first substrate in which a pixel circuit including a pixel array unit is formed;
a second substrate in which a plurality of separate signal processing circuits are formed wherein the first substrate and the second substrate are laminated, wherein each separate signal processing circuit of the plurality of separate signal processing circuits includes a separate and distinct row decoder and a separate and distinct column decoder, wherein the plurality of separate signal processing circuits are physically separated from each other; and
a common reference clock supplied to the plurality of separate signal processing circuits that are formed in the second substrate.
9. An electronic device comprising:
a first substrate in which a pixel circuit including a pixel array unit is formed;
a second substrate in which a plurality of separate signal processing circuits are formed wherein the first substrate and the second substrate are laminated, wherein each separate signal processing circuit of the plurality of separate signal processing circuits includes a separate and distinct row decoder and a separate and distinct column decoder, wherein the plurality of separate signal processing circuits are physically separated from each other; and
a common reference clock supplied to the plurality separate of signal processing circuits that are formed in the second substrate.