Curable resin composition, cured product thereof, and semiconductor device

1. A curable resin composition comprising the following components (A), (B), (C) and (D), wherein a content (amount blended) of the component (C) is not less than 0.3 wt % and not more than 20 wt %, based on the total amount (100 wt %) of the curable resin composition:

(A): a polyorganosiloxane represented by the following average unit formula (I):

(SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4   (I)

wherein each R 1 is the same or different and is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms, an alkenyl group having 2 to 8 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a hydroxyl group,

when a percentage of the alkyl group is X mol %, a percentage of the aryl group is Y mol %, and a percentage of the alkenyl group is Z mol % based on the total amount (100 mol %) of R 1 , X is 50 to 98 mol %, Y is 1 to 50 mol %, and Z is 1 to 35 mol %, and

a1, a2, a3, and a4 are numbers satisfying a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1;

(B): a polyorganosiloxane represented by the following average composition formula (II):

R 2 m H n SiO [(4-m-n)/2]   (II)

wherein each R 2 is the same or different and is an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 14 carbon atoms and at least one of R 2 is an aryl group, at least 2 hydrogen atoms are bonded to the silicon atom, and m and n are numbers satisfying 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3;

(C): a straight-chain polyorganosiloxane that is a liquid having a viscosity at 25° C. of 10000 mPa·s or less, represented by the following general formula (III-1):

wherein each R 3 is the same or different and represents an alkyl group having 1 to 10 carbon atoms, and y represents an integer of not less than 1 and not more than 100; and

(D): a hydrosilylation catalyst.

2. The curable resin composition according to claim 1 , wherein the component (A) is a polyorganosiloxane that has a weight-average molecular weight of not less than 500 and not more than 50000 in terms of polystyrene, has a molecular weight distribution of not less than 1 and not more than 4, and is a liquid or solid having a viscosity at 25° C. of 10 mPa·s or more.

3. The curable resin composition according to claim 1 , wherein a ratio of X to Y (X/Y) in the component (A) is 0.5 to 25.

4. The curable resin composition according to claim 1 , further comprising the following component (E):

(E): a polyorganosiloxysilalkylene having a group containing one or more aliphatic carbon-carbon unsaturated bonds in a molecule.

5. The curable resin composition according to claim 1 , further comprising the following component (F):

(F): at least one zinc compound selected from the group consisting of zinc carboxylates and zinc-β-diketone complexes.

6. The curable resin composition according to claim 5 , wherein a content of the component (F) is 0.01 to 1 wt %, based on the total amount (100 wt %) of the curable resin composition.

7. The curable resin composition according to claim 1 , further comprising the following component (G):

(G): a ladder-type polyorganosilsesquioxane having one or more alkenyl groups and one or more aryl groups in a molecule.

8. The curable resin composition according to claim 1 , wherein the component (B) comprises at least two structural units represented by (R 2′ 2 HSiO 1/2 ) where each R 2′ is the same or different and is an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 14 carbon atoms.

9. The curable resin composition according to claim 1 , wherein the component (B) comprises a component (B1) at a content of not less than 1 wt % and not more than 99 wt %,

the component (B1) being represented by the following formula (II-1):

wherein each R 21 is the same or different and represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 14 carbon atoms, at least one of R 21 is an aryl group, and x represents an integer of 0 to 1000, and

the component (B1) being a liquid having a viscosity at 25° C. of 10000 mPa·s or less.

10. The curable resin composition according to claim 1 , further comprising an isocyanurate compound (H) represented by the following formula (2):

wherein R f , R g , and R h are the same or different and each represent a group represented by formula (2a) or a group represented by formula (2b), provided that at least one of R f , R g , and R h is a group represented by formula (2b):

wherein R i is a hydrogen atom, or a straight-chain or branched-chain C 1-8 alkyl group; and

wherein R j is a hydrogen atom or a straight-chain or branched-chain C 1-8 alkyl group.

11. The curable resin composition according to claim 1 , further comprising a silane coupling agent (I).

12. A cured product of the curable resin composition according to claim 1 .

13. The cured product according to claim 12 , wherein a refractive index at 589 nm thereof is not less than 1.46 and not more than 1.54.

14. The curable resin composition according to claim 1 , wherein the curable resin composition is an encapsulating agent.

15. A semiconductor device comprising a semiconductor element and an encapsulant that encapsulates the semiconductor element, wherein the encapsulant is a cured product of the curable resin composition according to claim 14 .

16. The semiconductor device according to claim 15 , wherein a refractive index at 589 nm of the cured product is not less than 1.46 and not more than 1.54.

17. The semiconductor device according to claim 15 , wherein the semiconductor device is an optical semiconductor device.

18. The curable resin composition according to claim 1 , wherein the curable resin composition is a lens-forming resin composition.

19. A semiconductor device comprising a semiconductor element and a lens, wherein the lens is a cured product of the curable resin composition according to claim 18 .

20. A semiconductor device comprising a semiconductor element, an encapsulant that encapsulates the semiconductor element, and a lens,

wherein the encapsulant is a cured product of a curable resin composition comprising the following components (A), (B), (C) and (D), wherein a content (amount blended) of the component (C) is not less than 0.3 wt % and not more than 20 wt %, based on the total amount (100 wt %) of the curable resin composition:

(A): a polyorganosiloxane represented by the following average unit formula (I):

(SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4   (I)

wherein each R 1 is the same or different and is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms, an alkenyl group having 2 to 8 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a hydroxyl group,

when a percentage of the alkyl group is X mol %, a percentage of the aryl group is Y mol %, and a percentage of the alkenyl group is Z mol % based on the total amount (100 mol %) of R 1 , X is 50 to 98 mol %, Y is 1 to 50 mol %, and Z is 1 to 35 mol %, and

a1, a2, a3, and a4 are numbers satisfying a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1;

(B): a polyorganosiloxane represented by the following average composition formula (II):

R 2 m H n SiO [(4-m-n)/2]   (II)

wherein each R 2 is the same or different and is an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 14 carbon atoms and at least one of R 2 is an aryl group, at least 2 hydrogen atoms are bonded to the silicon atom, and m and n are numbers satisfying 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3;

(C): a straight-chain polyorganosiloxane that is a liquid having a viscosity at 25° C. of 10000 mPa·s or less, represented by the following general formula (III-1):

wherein each R 3 is the same or different and represents an alkyl group having 1 to 10 carbon atoms, and y represents an integer of not less than 1 and not more than 100; and

(D): a hydrosilylation catalyst,

and

the lens is a cured product of the curable resin composition according to claim 18 .