Silicon carbide semiconductor device and method of manufacturing the same
A silicon carbide semiconductor device includes a silicon carbide substrate and a gate insulating film. The silicon carbide substrate includes a first impurity region, a second impurity region, a third impurity region, a fourth impurity region, a fifth impurity region, and a sixth impurity region. A first main surface of the silicon carbide substrate is provided with a trench defined by a side surface and a bottom portion. The sixth impurity region includes a first region which faces the bottom portion and a second region which faces a second main surface of the silicon carbide substrate. The first region is higher in impurity concentration than the second region. In a direction perpendicular to the second main surface, a fifth main surface of the fourth impurity region is located between a sixth main surface of the second impurity region and the second main surface.
1. A silicon carbide semiconductor device comprising:
a silicon carbide substrate including a first main surface and a second main surface opposite to the first main surface, the silicon carbide substrate including
a first impurity region having a first conductivity type,
a second impurity region which is provided on the first impurity region and has a second conductivity type different from the first conductivity type,
a third impurity region which is provided on the second impurity region as being distant from the first impurity region and has the first conductivity type,
a fourth impurity region which penetrates the third impurity region and the second impurity region, is in contact with the first impurity region, and has the second conductivity type,
a fifth impurity region which is in contact with the first impurity region and located between the first impurity region and the second main surface and has the first conductivity type, and
a sixth impurity region which is in contact with the fifth impurity region and has the second conductivity type,
the first main surface being provided with a trench defined by a side surface which penetrates the third impurity region and the second impurity region and reaches the first impurity region and a bottom portion continuous to the side surface,
the sixth impurity region including a first region which includes a third main surface facing the bottom portion and a second region which is in contact with the first region and includes a fourth main surface facing the second main surface,
the first region being higher in impurity concentration than the second region,
the fourth impurity region including a fifth main surface which faces the second main surface,
the second impurity region including a sixth main surface which faces the second main surface,
in a direction perpendicular to the second main surface, the fifth main surface being located between the sixth main surface and the second main surface;
a gate insulating film in contact with the side surface and the bottom portion;
a first electrode in contact with the third impurity region and the fourth impurity region in the first main surface; and
a second electrode in contact with the second main surface, and wherein
the first impurity region is disposed between the bottom portion and the third main surface.
2. The silicon carbide semiconductor device according to claim 1 , wherein
a maximum value of the impurity concentration in the first region is at least ten times as large as an average value of the impurity concentration in the second region.
3. The silicon carbide semiconductor device according to claim 1 , wherein
the first region is distant from the bottom portion.
4. The silicon carbide semiconductor device according to claim 1 , wherein
in a direction in parallel to the second main surface, a width of the second region is equal to or greater than a width of the bottom portion.
5. The silicon carbide semiconductor device according to claim 4 , wherein
in the direction in parallel to the second main surface, the width of the bottom portion is equal to or greater than a width of the third main surface.
6. The silicon carbide semiconductor device according to claim 1 , wherein
in a direction in parallel to the second main surface, a width of the third main surface is equal to or smaller than a width of the second region.
7. The silicon carbide semiconductor device according to claim 1 , wherein
an angle formed between the side surface and the first main surface is not smaller than 90°.
8. The silicon carbide semiconductor device according to claim 1 , wherein
the impurity concentration in the first impurity region is higher than 2×10 16 cm −3 and lower than 1×10 18 cm −3 .
9. The silicon carbide semiconductor device according to claim 1 , wherein
the first region is higher in impurity concentration than the first impurity region.
10. The silicon carbide semiconductor device according to claim 1 , wherein
the first impurity region is higher in impurity concentration than the fifth impurity region.
11. The silicon carbide semiconductor device according to claim 1 , wherein
the second impurity region is higher in impurity concentration than the first impurity region.
12. The silicon carbide semiconductor device according to claim 1 , wherein
in the direction perpendicular to the second main surface, the first region has a thickness not smaller than 0.1 μm.
13. The silicon carbide semiconductor device according to claim 1 , wherein
the gate insulating film includes a first portion in contact with the side surface and a second portion in contact with the bottom portion, and
the second portion is greater in thickness than the first portion.
14. The silicon carbide semiconductor device according to claim 1 , wherein
in the direction perpendicular to the second main surface, the fifth main surface is located between the sixth main surface and the bottom portion.
15. The silicon carbide semiconductor device according to claim 1 , wherein
in the direction perpendicular to the second main surface, the fifth main surface is located between the bottom portion and the third main surface.
16. The silicon carbide semiconductor device according to claim 1 , wherein
in the direction perpendicular to the second main surface, the fifth main surface is located between the third main surface and a boundary surface between the first region and the second region.
17. A method of manufacturing a silicon carbide semiconductor device comprising:
preparing a silicon carbide substrate including a first main surface and a second main surface opposite to the first main surface, the silicon carbide substrate including
a first impurity region having a first conductivity type,
a second impurity region which is provided on the first impurity region and has a second conductivity type different from the first conductivity type,
a third impurity region which is provided on the second impurity region as being distant from the first impurity region and has the first conductivity type,
a fourth impurity region which penetrates the third impurity region and the second impurity region, is in contact with the first impurity region, and has the second conductivity type,
a fifth impurity region which is in contact with the first impurity region and located between the first impurity region and the second main surface and has the first conductivity type, and
a sixth impurity region which is in contact with the fifth impurity region and has the second conductivity type,
the first main surface being provided with a trench defined by a side surface which penetrates the third impurity region and the second impurity region and reaches the first impurity region and a bottom portion continuous to the side surface,
the sixth impurity region including a first region which includes a third main surface facing the bottom portion and a second region which is in contact with the first region and includes a fourth main surface facing the second main surface,
the first region being higher in impurity concentration than the second region,
the fourth impurity region including a fifth main surface which faces the second main surface,
the second impurity region including a sixth main surface which faces the second main surface,
in a direction perpendicular to the second main surface, the fifth main surface being located between the sixth main surface and the second main surface;
forming a gate insulating film in contact with the side surface and the bottom portion;
forming a first electrode in contact with the third impurity region and the fourth impurity region in the first main surface; and
forming a second electrode in contact with the second main surface, and wherein
the first impurity region is disposed between the bottom portion and the third main surface.
18. The method of manufacturing a silicon carbide semiconductor device according to claim 17 , wherein
the preparing a silicon carbide substrate includes
forming a first epitaxial layer of the first conductivity type,
forming a second epitaxial layer of the first conductivity type on the first epitaxial layer, and
implanting impurity ions which can provide the first conductivity type into the second epitaxial layer,
the second epitaxial layer includes a first portion to be an active region and a second portion which surrounds the first portion and becomes a termination region, and
in the implanting impurity ions, the first impurity region is formed by implanting the impurity ions into the first portion without implanting the impurity ions into the second portion.