IP Library › Granted Patent US 10,638,637
Granted Patent B2
US 10,638,637 · App. 16/092,804 · Granted Apr 28, 2020

Component cooling device

Inventors: Erik Edlinger (Vienna, AT); Dietmar Kieslinger (Theresienfeld, AT); Emanuel Weber (Baden, AT)
Assignee: ZKW GROUP GMBH
H05K7/20127F21S45/47F21S45/49H01L23/467H05K1/0206H05K1/181H05K7/20145H05K2201/09609H05K2201/10022H05K2201/10106H05K2201/10257
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Quick Facts
Patent No.
US 10,638,637
App. No.
16/092,804
Granted
Apr 28, 2020
Kind
B2
Abstract

A component cooling device ( 101 ) comprising: a circuit board ( 102 ), the circuit board ( 102 ) having an upper side ( 103 ) and a lower side ( 104 ) facing away from the upper side ( 103 ); and at least one electronic component ( 106 ) and at least one hollow circuit board opening ( 107 ) for a gaseous cooling medium for cooling the component, wherein on the lower side ( 104 ) of the circuit board ( 102 ) is provided a guide ( 110 ) which forms a flow channel ( 109 ) that has at least one inlet ( 113 ) and at least one outlet, which is formed by the at least one circuit board opening ( 107 ), for at least one convection flow ( 108 ) of the cooling medium.

Claims (27)

1. A component cooling device ( 101 , 201 , 301 , 401 , 501 ) comprising:

a circuit board ( 102 , 202 , 302 , 402 , 502 ), the circuit board ( 102 , 202 , 302 , 402 , 502 ) having an upper side ( 103 , 203 , 303 , 403 , 503 ) and a lower side ( 104 , 204 , 304 , 404 , 504 ) facing away from the upper side ( 103 , 203 , 303 , 403 , 503 ); and

at least one electronic component ( 6 , 106 , 206 , 306 , 406 , 506 ) and at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ) for a gaseous cooling medium for cooling the at least one electronic component,

wherein on the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ) is provided a guide ( 10 , 110 , 210 , 310 , 410 , 510 ) which forms a flow channel ( 109 , 209 , 309 , 409 , 509 ) for a convection flow of the gaseous cooling medium,

wherein the guide has at least one inlet ( 13 , 113 , 213 , 313 , 413 , 513 ) and at least one outlet which is formed by the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ), and

wherein the at least one inlet ( 13 , 113 , 213 , 313 , 413 , 513 ) has a cross-section which is decreasing to a smaller cross-section of the at least one outlet.

2. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the flow channel ( 109 , 209 , 309 , 409 , 509 ) is delimited by the guide ( 10 , 110 , 210 , 310 , 410 , 510 ) and a region of the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ), wherein the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ) is likewise arranged in this region.

3. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein a region of the flow channel ( 109 , 209 , 309 , 409 , 509 ) on the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ) comprises at least one cooling area ( 111 , 311 ), wherein the at least one cooling area ( 111 , 311 ) is delimited substantially by a contour ( 311 a ) of the at least one electronic component ( 6 , 106 , 206 , 306 , 406 , 506 ) on the circuit board ( 102 , 202 , 302 , 402 , 502 ) and is arranged on the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ).

4. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the at least one inlet ( 13 , 113 , 213 , 313 , 413 , 513 ) of the flow channel ( 109 , 209 , 309 , 409 , 509 ) has a rectangular shape, and the flow channel ( 109 , 209 , 309 , 409 , 509 ) has a height ( 114 ) transversely to the circuit board ( 102 , 202 , 302 , 402 , 502 ) that decreases from the at least one inlet ( 13 , 113 , 213 , 313 , 413 , 513 ) to the at least one outlet.

5. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the guide ( 10 , 110 , 210 , 310 , 410 , 510 ) is formed from three adjoining side walls ( 15 , 115 , 215 , 315 , 415 , 515 ) and an adjoining end face ( 16 , 116 , 216 , 316 , 416 , 516 ) and the guide ( 10 , 110 , 210 , 310 , 410 , 510 ), jointly with the region of the lower side ( 104 , 204 , 304 , 404 , 504 ) of the circuit board ( 102 , 202 , 302 , 402 , 502 ) and the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ), forms the flow channel ( 109 , 209 , 309 , 409 , 509 ).

6. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein at least one contact connection area ( 105 a , 205 a , 305 a , 405 a , 505 a , 105 b , 205 b , 305 b , 405 b , 505 b ) on the upper side ( 103 , 203 , 303 , 403 , 503 ) is connected to at least one heat radiation area ( 105 c , 205 c , 305 c , 305 d , 405 c , 505 c ) on the lower side ( 104 , 204 , 304 , 404 , 504 ) by at least one hollow, electrically conductive circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ).

7. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the circuit board ( 102 , 202 , 302 , 402 , 502 ) is formed in one layer and has metal layers on both sides.

8. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein at least one thermal chimney structure ( 418 ) for intensifying the at least one convection flow ( 108 , 208 , 408 ) is arranged on the upper side ( 103 , 203 , 303 , 403 , 503 ) and the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ) leads out into the at least one thermal chimney structure ( 418 ).

9. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 8 , wherein the at least one thermal chimney structure ( 418 ) has a chimney height and a chimney diameter and the chimney height ( 419 ) is greater than the diameter of the hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ), wherein the chimney diameter ( 420 ) corresponds substantially to the diameter of the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ).

10. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 8 , wherein the at least one thermal chimney structure has a chimney height and a chimney diameter and the chimney diameter ( 420 ) at least in part extends in a non-constant manner along the chimney height ( 419 ) or, at one end of the at least one thermal chimney structure ( 418 ) at which a solder connection ( 418 a ) is provided, extends in a widening manner.

11. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 8 , wherein a plurality of chimney structures ( 418 ) are arranged in a row upstream or downstream of the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ) and are made of different materials, which are designed to be mechanically rigid or elastically malleable and jointly form a combined chimney structure.

12. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 11 , wherein the combined chimney structure is connected to at least one further component of a vehicle headlamp.

13. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the circuit board ( 102 , 202 , 302 , 402 , 502 ) in an installed position in a vehicle headlamp is oriented substantially horizontally, with an angle of the circuit board ( 102 , 202 , 302 , 402 , 502 ) to the horizontal in the range of −45° to +45°.

14. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 1 , wherein the component cooling device ( 101 , 201 , 301 , 401 , 501 ) is arranged within a vehicle headlamp and is designed to cool a light source for a main beam light source or a dipped beam light source.

15. A vehicle headlamp having one or more light sources which can radiate light in order to produce a light distribution, with a component cooling device according to claim 1 for cooling the one or more light sources.

16. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 9 , wherein the chimney height ( 419 ) is at least five times greater than the diameter of the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ).

17. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 9 , wherein the chimney height ( 419 ) is at least ten times greater than the diameter of the at least one hollow circuit board opening ( 107 , 207 , 307 a , 307 b , 407 , 507 ).

18. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 11 , wherein each of the plurality of chimney structures ( 418 ) is in the form of a tube.

19. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 18 , wherein the tube is a rubber or plastics tube.

20. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 13 , wherein the angle of the circuit board ( 102 , 202 , 302 , 402 , 502 ) to the horizontal is in the range of −10° to +10°.

21. The component cooling device ( 101 , 201 , 301 , 401 , 501 ) according to claim 13 , wherein the angle of the circuit board ( 102 , 202 , 302 , 402 , 502 ) to the horizontal is in the range of −5° to +5°.

22. The vehicle headlamp according to claim 15 , wherein the light distribution is a main beam or dipped beam light distribution.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2018
From: EDLINGER, ERIK; KIESLINGER, DIETMAR; WEBER, EMANUEL
To: ZKW GROUP GMBH
Reel/Frame 047215/0254 →
Priority Claims (1)
AT A 50317/2016 · Apr 13, 2016 · national
Continuity (1)
Related Publication 20190132988A1 · May 2, 2019
Cited By (1)
US 12,575,058