Microelectromechanical system (MEMS) devices

1. A microelectromechanical systems (MEMS) device comprising:

a number of silicon dies overmolded with an overmold material;

a number of active areas formed on the silicon dies, the active areas comprising at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor; and

a fan-out layer coupled to the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the active areas of the silicon dies and allow the fluid to flow to the at least one sensor, the fan-out layer further comprising a number of fluid input/output ports spaced laterally so as to extend beyond a nearest edge of a corresponding silicon die in the overmold material, the input/output ports being fluidly connected through the number of fluid channels of the fan-out layer to the active areas of the number of silicon dies.

2. The MEMS device of claim 1 , wherein two of the fluid input/output ports defined in the fan-out layer are spaced farther apart than a width of a corresponding silicon die to which they are fluidly coupled.

3. The MEMS device of claim 1 , wherein the active areas further comprise a number of actuators to cause the fluid introduced into the fluid channels to interact with the sensors.

4. The MEMS device of claim 1 , wherein the active areas comprise a reagent storage to store a number of reagents to react with the fluid introduced into the fluid channels.

5. The MEMS device of claim 1 , wherein the MEMS device comprises a surface area comprising at least a majority of the overmold material relative to silicon of the silicon dies.

6. The MEMS device of claim 1 , wherein the overmold material is an epoxy mold compound (EMC).

7. The MEMS device of claim 1 , further comprising two input/output ports located on opposite sides of a silicon die to which both of the two input/output ports are fluidly connected via the fluid channels, the two input/output ports being spaced farther apart than a width of the silicone die between them.

8. The MEMS device of claim 1 , wherein the number of fluid channels of the fan-out layer comprise channels that move fluid over a boundary between the overmold material and an edge of one of the silicon dies.

9. The MEMS device of claim 1 , wherein one of the number of silicon dies comprises both an actuator to move fluid and a sensor to sense fluid.

10. The device of claim 9 , wherein the actuator comprises a fluid mixer.

11. The MEMS device of claim 9 , wherein the actuator comprises a fluid pump.

12. A method of forming a microelectromechanical systems (MEMS) device comprising:

overmolding a number of dies with an overmold material to form a coplanar package, the dies comprising a number of electrically active devices; and

forming a fan-out layer on the coplanar package to increase distances between a number of features of the dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the electrically active devices of the dies and cause a fluid to flow to the electrically active devices, the fan-out layer further comprising a number of fluid input/output ports spaced laterally so as to extend beyond a nearest edge of a corresponding die in the overmold material, the input/output ports being fluidly connected through the number of fluid channels of the fan-out layer to the active devices of the number of dies.

13. The method of claim 12 , further comprising:

coupling a carrier to the dies via a releasable adhesive;

overmolding the dies using the carrier to handle the dies;

removing the carrier; and

forming the fan-out layer on the dies.

14. The method of claim 12 , further comprising coupling an electrical redistribution layer (RDL) to the dies between the fan-out layer and the dies to electrically couple the electrically active devices to an external circuit.

15. The method of claim 12 , wherein forming the fan-out layer comprises depositing material via photolithography deposition processes.

16. The method of claim 15 , wherein:

the fan-out layer comprises a radiation-sensitive chemical photoresist; and

the photolithography deposition process comprises:

depositing a layer of the photoresist;

irradiating the layer of the photoresist with a pattern of radiation; and

remove un-irradiated portions of the photoresist using a developer.

17. A lab-on-chip system comprising:

a plurality of silicon dies;

a number of electrically active devices disposed on a first side of the silicon dies;

an overmold material overmolded over all sides of the silicon dies other than the first side;

a fan-out layer coupled to each of the silicon dies, the fan-out layer comprising a number of fluid channels formed therein that interface with the electrically active devices; and

an electrical redistribution layer (RDL) positioned between the fan-out layer and the silicon dies to electrically couple the electrically active devices to an external circuit;

wherein the active devices further comprise a number of actuators and a number of sensors, the number of actuators to cause fluid introduced into the fluid channels to interact with number of sensors.

18. The lab-on-chip system of claim 17 , further comprising a number of reagents disposed within the lab-on-chip system to react with a fluid introduced into the lab-on-chip system.

19. The lab-on-chip system of claim 17 , wherein the number of fluid channels formed in the fan-out layer comprises a plurality of the fluid channels.

20. The lab-on-chip system of claim 17 , further comprising a plurality of fluid input/output ports defined in the fan-out layer coupling the fluid channels to an exterior environment, wherein the fluid input/output ports are spaced out with respect to one another a greater distance than a dimension of a plane of the silicon dies that interfaces with the fan-out layer.