IP Library Granted Patent US 10,679,862
Granted Patent B2
US 10,679,862 · App. 16/094,383 · Granted Jun 9, 2020

Contactless electric power supply mechanism and method for rotary table, and wafer rotating and holding device

Inventor: Masato Tsuchiya (Gunma, JP)
Assignee: MIMASU SEMICONDUCTOR INDUSTRY CO., LTD.
H01L21/306H01L21/31H01L21/32055H01L21/683H01L21/68764H01L21/68785H01L21/68792H02J50/12
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,679,862
App. No.
16/094,383
Granted
Jun 9, 2020
Kind
B2
Abstract

Provided are a contactless electric power supply mechanism and method for a rotary table, and a wafer rotating and holding device, which enable a load connected to the rotary table of the wafer rotating and holding device to be contactlessly supplied with electric power. The contactless electric power supply mechanism for a rotary table of a wafer rotating and holding device comprises: a rotary shaft; a rotary table, which is placed on an end of the rotary shaft, and is configured to hold a wafer on an upper surface of the rotary table; a drive motor configured to supply motive power to the rotary shaft; a fixed-side primary coil wound around the rotary shaft; an electric power supply source connected to the fixed-side primary coil; a rotary table-side secondary coil, which is provided so as to correspond to the fixed-side primary coil and be separated from the fixed-side primary coil by a predetermined distance, and is mounted to the rotary table; and a load connected to the rotary table-side secondary coil. In the contactless electric power supply mechanism for a rotary table, the load is supplied with electric power via the secondary coil by electromagnetic induction.

Claims (49)

1. A contactless electric power supply mechanism for a rotary table of a wafer rotating and holding device, the contactless electric power supply mechanism comprising:

a rotary shaft;

a rotary table placed on an end of the rotary shaft, the rotary table being configured to hold a wafer on an upper surface of the rotary table;

a drive motor configured to supply motive power to the rotary shaft;

a fixed-side primary coil wound around the rotary shaft;

an electric power supply source connected to the fixed-side primary coil;

a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and be separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and

a load connected to the rotary table-side secondary coil, wherein the load is supplied with electric power by electromagnetic induction via the rotary table-side secondary coil.

2. A contactless electric power supply mechanism according to claim 1 , wherein the load comprises a wafer processing mechanism for performing processing on the wafer placed on the rotary table.

3. A contactless electric power supply mechanism according to claim 1 , further comprising:

a first resonant capacitor connected to the fixed-side primary coil; and

a second resonant capacitor connected to the rotary table-side secondary coil.

4. A contactless electric power supply method for a rotary table, the contactless electric power supply method comprising:

providing a contactless electric power supply mechanism comprising:

a rotary shaft;

a rotary table placed on an end of the rotary shaft, the rotary table being configured to hold a wafer on an upper surface of the rotary table;

a drive motor configured to supply motive power to the rotary shaft;

a fixed-side primary coil wound around the rotary shaft;

an electric power supply source connected to the fixed-side primary coil;

a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and be separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and

a load connected to the rotary table-side secondary coil;

supplying electric power to the load via the contactless electric power supply mechanism.

5. A wafer rotating and holding device, comprising:

a contactless electric power supply mechanism comprising:

a rotary shaft;

a rotary table placed on an end of the rotary shaft, the rotary table being configured to hold a wafer on an upper surface of the rotary table;

a drive motor configured to supply motive power to the rotary shaft;

a fixed-side primary coil wound around the rotary shaft;

an electric power supply source connected to the fixed-side primary coil;

a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and be separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and

a load connected to the rotary table-side secondary coil, wherein the load is supplied with electric power by electromagnetic induction via the rotary table-side secondary coil.

6. A wafer rotating and holding device according to claim 5 , further comprising a spin processing mechanism.

7. A wafer rotating and holding device according to claim 5 , wherein the load comprises a wafer processing mechanism for performing processing on the wafer placed on the rotary table.

8. A wafer rotating and holding device according to claim 5 , wherein the contactless electric power supply mechanism further comprises:

a first resonant capacitor connected to the fixed-side primary coil; and

a second resonant capacitor connected to the rotary table-side secondary coil.

9. A wafer rotating and holding device according to claim 7 , wherein the contactless electric power supply mechanism further comprises:

a first resonant capacitor connected to the fixed-side primary coil; and

a second resonant capacitor connected to the rotary table-side secondary coil.

10. A contactless electric power supply method according to claim 4 , wherein the load comprises a wafer processing mechanism for performing processing on the wafer placed on the rotary table.

11. A contactless electric power supply method for a rotary table according to claim 4 , wherein the contactless electric power supply mechanism further comprises:

a first resonant capacitor connected to the fixed-side primary coil; and

a second resonant capacitor connected to the rotary table-side secondary coil.

12. A contactless electric power supply method according to claim 10 , wherein the contactless electric power supply mechanism further comprises:

a first resonant capacitor connected to the fixed-side primary coil; and

a second resonant capacitor connected to the rotary table-side secondary coil.

13. A contactless electric power supply mechanism according to claim 2 , further comprising:

a first resonant capacitor connected to the fixed-side primary coil; and

a second resonant capacitor connected to the rotary table-side secondary coil.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2018
From: TSUCHIYA, MASATO
To: MIMASU SEMICONDUCTOR INDUSTRY CO., LTD.
Reel/Frame 047200/0550 →
Priority Claims (1)
JP 2016-085365 · Apr 21, 2016 · national
Continuity (1)
Related Publication 20190148154A1 · May 16, 2019