IP Library › Granted Patent US 11,065,853
Granted Patent B2
US 11,065,853 · App. 16/096,490 · Granted Jul 20, 2021

Polyimide film layered body

Inventors: Shota Hara (Otsu, JP); Toshiyuki Tsuchiya (Otsu, JP); Masahiro Yamashita (Otsu, JP); Tetsuo Okuyama (Otsu, JP); Naoki Watanabe (Otsu, JP)
Assignee: TOYOBO CO., LTD.
B32B27/281B32B7/12B32B27/00B32B2250/05B32B2250/24B32B2255/10B32B2255/24B32B2307/306B32B2307/308
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Quick Facts
Patent No.
US 11,065,853
App. No.
16/096,490
Granted
Jul 20, 2021
Kind
B2
Abstract

A laminate mainly made of polyimide with low thermal expansion, high mechanical strength, and high heat resistance, and a method for manufacturing the same are provided. A surface of a polyimide film is activated and then treated by a silane coupling agent. Subsequently, the obtained silane coupling agent-treated polyimide films are superimposed, and pressure and heat are applied to the superimposed polyimide films so as to manufacture a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure of superimposing polyimide film layers and silane coupling agent condensate layer(s) alternately to each other. Adhesive strength between the polyimide films of the polyimide film laminate of the present invention does not change largely from initial adhesive strength even after heat treatment at 400° C. for 15 minutes. Further, the polyimide film laminate exhibits a high bending elastic modulus and impact resistance.

Claims (12)

1. A polyimide film laminate, comprising a structure of superimposing plural polyimide film layers and silane coupling agent condensate layers alternately to each other, wherein

a thickness of each of the polyimide film layers is 3 μm or more and 250 μm or less,

the number of polyimide film layers is 5 or more,

all of the polyimide film layers in the polyimide film laminate have the same composition,

initial adhesive strength between the polyimide film layers is 0.1 N/cm or more and 20 N/cm or less by a 90° peel method, and

adhesive strength between the polyimide film layers after being heated at 400° C. for 15 minutes is 20% or more and 200% or less of the initial adhesive strength.

2. The polyimide film laminate according to claim 1 , wherein a thickness of the silane coupling agent condensate layer is 5 nm or more and 300 nm or less.

3. A method for manufacturing a polyimide film laminate, the method comprising at least:

(1) producing a silane coupling agent layer on a surface of a polyimide film; and

(2) superimposing 5 or more polyimide films after the production of the silane coupling agent layers, and applying heat and pressure to the superimposed polyimide films,

wherein all of the 5 or more polyimide films in the polyimide film laminate have the same composition.

4. The method for manufacturing a polyimide film laminate according to claim 3 , wherein the step of (1) producing the silane coupling agent layer on the surface of the polyimide film is carried out by exposing the surface of the polyimide film to a vaporized silane coupling agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2018
From: HARA, SHOTA; TSUCHIYA, TOSHIYUKI; YAMASHITA, MASAHIRO; OKUYAMA, TETSUO; WATANABE, NAOKI
To: TOYOBO CO., LTD.
Reel/Frame 047325/0083 →
Priority Claims (1)
JP JP2016-090555 · Apr 28, 2016 · national
Continuity (1)
Related Publication 20190134963A1 · May 9, 2019