Integrated circuit device
An integrated circuit device is disclosed, the device comprising a protective layer and a protected circuit on a substrate, the protective layer being configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate. The device may be configured such that removal of the protective layer causes physical damage that disables the protected circuit. The device may comprise intermediate circuitry protruding into the substrate between the protective layer and the protected circuit, wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry. The device may comprise detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled.
1. An integrated circuit device comprising:
a substrate having a first surface and a second surface opposite the first surface;
a protected circuit disposed on the first surface of the substrate;
a protective layer disposed within the substrate, between the first surface and the second surface, and configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate, the protective layer being continuous over an entirety of the substrate; and
an insulating layer disposed within the substrate, between the first surface and the protective layer in a cross sectional view, and configured to electrically insulate the protected circuit from the protective layer and a portion of the substrate that is on a side of the protective layer that is opposite the insulating layer.
2. The integrated circuit device as claimed in claim 1 , wherein the protective layer is disposed such that removal of the protective layer causes physical damage to the protected circuit.
3. The integrated circuit device as claimed in claim 2 , further comprising intermediate circuitry protruding into the substrate between the protective layer and the insulating layer, wherein the physical damage to the protected circuit is physical damage to the intermediate circuitry.
4. The integrated circuit device as claimed in claim 1 , further comprising detection circuitry configured to detect a change in an electrical property of the integrated circuit device indicative of removal of the protective layer, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled.
5. The integrated circuit device as claimed in claim 4 , wherein the electrical property is capacitance.
6. The integrated circuit device as claimed in claim 4 , wherein the detection circuitry comprises a DRAM cell or a bipolar transistor.
7. The integrated circuit device as claimed in claim 4 , further comprising intermediate detection circuitry protruding into the substrate between the protective layer and the protected circuit.
8. The integrated circuit device as claimed in claim 1 , wherein the protective layer comprises a doped semiconductor.
9. The integrated circuit device as claimed in claim 8 , wherein the doped semiconductor has a dopant concentration of 10 19 cm −3 , 10 20 cm −3 , 5×10 20 cm −3 or 10 21 cm −3 .
10. The integrated circuit device as claimed in claim 1 , wherein the protective layer has a transmittance of the laser radiation that is less than or equal to one of 40%, 20%, 15%, 10%, 5%, or 2%.
11. The integrated circuit device as claimed in claim 1 , wherein the laser radiation is infra-red radiation.
12. The integrated circuit device as claimed in claim 1 , wherein the protective layer has a transmittance of the laser radiation that is less than a transmittance of the laser radiation of the substrate.
13. An integrated circuit device comprising:
a protected circuit on a substrate;
material within the substrate configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate, the material being continuous over an entirety of the substrate;
detection circuitry configured to detect a change in an electrical property of the device indicative of removal of the material from the substrate, and, in response to detecting the change in the electrical property, cause the protected circuit to be disabled; and
an insulating layer disposed within the substrate, between the material and protected circuit in a cross sectional view, and configured to electrically insulate the protected circuit from the material and a portion of the substrate that is on a side of the material that is opposite the insulating layer.
14. An integrated circuit device comprising:
a protected circuit on a substrate;
material within the substrate configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate, the material being continuous over an entirety of the substrate; and
intermediate circuitry protruding into the substrate between the protected circuit and an insulating layer, the device being configured such that removal of the material from the substrate causes physical damage that disables the protected circuit;
wherein the insulating layer is disposed within the substrate, between the material and protected circuit in a cross sectional view, and configured to electrically insulate the protected circuit from the material and a portion of the substrate that is on a side of the material that is opposite the insulating layer,
wherein the physical damage that disables the protected circuit is physical damage to the intermediate circuitry.