Apparatus and methods for integrated MEMS devices

1. A method comprising:

receiving in a receiving stage, a diced wafer having a plurality of integrated devices comprising CMOS and MEMS devices disposed upon an adhesive substrate, wherein the diced wafer is associated with a known good device data associated with the plurality of integrated devices;

removing with a first pick and place device, a first set of integrated devices from the plurality of integrated devices from the adhesive substrate in response to the known good device data;

placing with the first pick and place device, the first set of integrated devices into a plurality of sockets within a socket substrate;

testing with the testing platform, the first set of integrated devices comprising:

while physically stressing with the testing platform, the first set of integrated devices, providing with the plurality of sockets, electrical power to the first set of integrated devices and receiving with the plurality of sockets, electrical response data from the first set of integrated devices;

determining with a processing unit coupled to the testing platform, a second set of integrated devices from the first set of integrated devices, in response to the electrical response data;

removing with a second pick and place device, the second set of integrated devices from the plurality of sockets within the first substrate; and

disposing the second set of integrated devices into a transport tape media.

2. The method of claim 1 wherein a number of integrated devices from the second set of integrated devices is equal to or less than a number of integrated devices from the first set of integrated devices.

3. The method of claim 1

physical stressing the first set of integrated devices comprises shaking the first set of integrated devices; and

wherein the shaking comprises shaking the testing platform in a direction selected from a group consisting of: x-direction, y-direction, z-direction, x-y-direction, x-z-direction, and y-z direction.

4. The method of claim 1

physical stressing the first set of integrated devices comprises rotating the first set of integrated devices; and

wherein the rotating comprises rotating the testing platform along an axis selected from a group consisting of: x-axis, y-axis, z-axis, x-y-axis, x-z-axis, and y-z axis.

5. The method of claim 1 wherein the MEMS devices are selected from a group consisting of: an accelerometer, a gyroscope, a magnetometer and a pressure sensor.

6. The method of claim 1

wherein the determining the second set of integrated devices comprises:

comparing with the processing unit the electrical response data from the first set of integrated devices against threshold data to determine comparison data; and

determining with the processing unit, the second set of integrated devices from the first set of integrated devices, in response to the comparison data.

7. The method of claim 6 wherein the comparison data indicates a stiction condition associated with an integrated device from the first set of integrated devices.

8. The method of claim 6 wherein the comparison data indicates an out of range condition associated with an integrated device from the first set of integrated devices.

9. The method of claim 6 wherein the comparison data indicates a ringing condition associated with an integrated device from the first set of integrated devices.

10. The method of claim 1

removing with the second pick and place device, remaining integrated devices from the first set of integrated devices not within the second set of integrated devices from the socket substrate; and

placing the remaining integrated devices into a disposal region.