Adhesive bonding composition and electronic components prepared from the same
A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.
1. An electronic component, comprising: a substrate and one or more electronic elements, and having a lid covering at least a portion of the substrate or a portion of the one or more electronic elements, wherein the lid is attached and sealed with a cured adhesive formed from a curable adhesive composition,
wherein the curable adhesive composition comprises:
an organic vehicle comprising at least one polymerizable monomer,
at least one photo-initiator responsive to a selected wavelength of light; and
at least one energy converting material selected to emit said wavelength of light when exposed to a selected imparted radiation, wherein the at least one energy converting material is a downconverting material.
2. The electronic component of claim 1 , wherein the adhesive is an electrically conductive adhesive.
3. The electronic component of claim 1 , wherein the adhesive is a thermally conductive adhesive.
4. The electronic component of claim 2 , wherein the adhesive is a thermally conductive adhesive.
5. The electronic component of claim 3 , wherein the thermally conductive adhesive is electrically insulating.
6. The electronic component of claim 2 , wherein the electrically conductive adhesive comprises an electrically conductive filler.
7. The electronic component of claim 6 , wherein the electrically conductive filler is an organic filler.
8. The electronic component of claim 6 , wherein the electrically conductive filler is an inorganic filler.
9. The electronic component of claim 7 , wherein the organic filler is carbon.
10. The electronic component of claim 8 , wherein the inorganic filler is finely divided metal particles.
11. The electronic component of claim 10 , wherein the finely divided metal particles are formed of a metal or a metal oxide.
12. The electronic component of claim 11 , wherein the finely divided metal particles are formed of a metal selected from the group consisting of gold, silver, nickel, copper, and alloys containing at least these metals.
13. The electronic component of claim 7 , wherein the organic filler comprises small polymer beads or spheres having a conductive coating thereon.
14. The electronic component of claim 13 , wherein the conductive coating is a thin gold film.
15. The electronic component of claim 1 , wherein the curable adhesive composition further comprises a dielectric material.
16. The electronic component of claim 15 , wherein the dielectric material is a member selected from the group consisting of metal titanates and metal zirconates.
17. The electronic component of claim 1 , wherein the electronic component is a semiconductor component.
18. The electronic component of claim 17 , wherein the cured adhesive is an anisotropically conductive adhesive.
19. The electronic component of claim 1 , wherein the electronic component is an optoelectronic component.
20. The electronic component of claim 1 , wherein the electronic component is a multichip module.
21. The electronic component of claim 1 , wherein the electronic component is an integrated circuit device.
22. The electronic component of claim 21 , wherein the integrated circuit device is an integrated circuit wafer stack.
23. The electronic component of claim 1 , wherein the electronic component is a high density circuit.
24. The electronic component of claim 21 , wherein the integrated circuit device is a flip chip.
25. The electronic component of claim 24 , wherein the at least one energy converting material is a phosphor having absorption characteristics in an X-ray regime, such that inspection of the resulting flip chip can be performed using X-rays.
26. The electronic component of claim 7 , wherein the organic filler comprises anisotropic conductive polymer spheres.
27. The electronic component of claim 21 , wherein the cured adhesive further comprises anisotropic conductive polymer spheres.
28. The electronic component of claim 1 , wherein the at least one energy converting material comprises anisotropic conductive UV emitting polymer spheres.
29. The electronic component of claim 21 , wherein the at least one energy converting material comprises anisotropic conductive UV emitting polymer spheres.
30. The electronic component of claim 1 , wherein the imparted radiation is an ionizing radiation.
31. The electronic component of claim 30 , wherein the ionizing radiation is X-rays.
32. The electronic component of claim 1 wherein said organic vehicle comprises a monomer forming a thermoset resin.
33. The electronic component of claim 32 , wherein said thermoset resin is selected from the group consisting of: acrylics, phenolics, urethanes, epoxies, styrenes, and silicones.
34. The electronic component of claim 1 , wherein said at least one photoinitiator is selected from the group consisting of: benzoin ethers, benzil ketals, α-dialkoxyacetophenones, α-aminoalkylphenones, acylphosphine oxides, benzophenones/amines, thioxanthones/amines, and titanocenes.
35. The electronic component of claim 1 , wherein said wavelength of light is in the UV range and said ionizing radiation comprises X-rays.
36. The electronic component of claim 1 , wherein said downconverting material comprises dispersed inorganic particulates selected from the group consisting of: metal oxides; metal sulfides; doped metal oxides; and mixed metal chalcogenides.
37. The electronic component of claim 1 , wherein said curable adhesive composition further comprises inorganic particulates selected from the group consisting of: metals and metal alloys, ceramics and dielectrics, and metal-coated polymers.
38. The electronic component of claim 1 , wherein said curable adhesive composition further comprises an organic component selected from the group consisting of: solvents, viscosity modifiers, surfactants, dispersants, and plasticizers.
39. The electronic component of claim 1 , wherein the at least one photo-initiator and the at least one energy converting material are chemically tethered to one another.
40. The electronic component of claim 1 , wherein the cured adhesive is in the form of a film.
41. The electronic component of claim 40 , wherein the cured adhesive in the form of a film is partially cured.
42. The cured adhesive of claim 40 , wherein the film has anisotropic properties.
43. The electronic component of claim 17 , wherein the cured adhesive is an isotropically conductive adhesive.
44. A phosphor composition, comprising:
one or more phosphors having on a surface thereof a coating selected from the group consisting of silica, diamond, and diamond-like carbon, said one or more phosphors configured to emit radiation upon interaction with an initiation energy.
45. The phosphor composition of claim 44 , wherein the one or more phosphors comprises one or more of visible emitting phosphors and ultraviolet emitting phosphors.
46. The phosphor composition of claim 44 , wherein the one or more of phosphors comprises a mixture of the phosphors.
47. The phosphor composition of claim 44 , wherein the one or more phosphors further comprises a plasmonics agent including a metallic structure.
48. The phosphor composition of claim 44 , wherein the coating is a diamond-like carbon coating.
49. The phosphor composition of claim 48 , wherein the diamond-like carbon coating is formed by chemical vapor deposition.
50. The phosphor composition of claim 49 , wherein the diamond-like carbon coating is formed by said chemical vapor deposition using hydrogen gas and methane gas.
51. The phosphor composition of claim 44 , wherein the coating is a silica coating.
52. The phosphor composition of claim 51 , wherein the silica coating is formed by a sol-gel process.
53. The phosphor composition of claim 44 , wherein the coating is a diamond coating.
54. The phosphor composition of claim 53 , wherein the diamond coating is formed by chemical vapor deposition.
55. The phosphor composition of claim 54 , wherein the diamond coating is formed by said chemical vapor deposition using hydrogen gas and methane gas.