Atomic layer deposition for continuous, high-speed thin films
A temporal Atomic Layer Deposition system and method utilizing precursor pulses applied to a moving substrate. The precursor pulses are self-exhausting.
1. A method for continuous thin film processing by atomic layer deposition, comprising the steps of:
moving a substrate along a substrate travel path from a feed roll to a take-up roll;
flowing a carrier gas over the substrate; and
performing a first atomic layer deposition cycle by:
dispensing a first pulse of precursor A to a plurality of precursor A injectors;
dispensing the first pulse of the precursor A from the plurality of precursor A injectors into a laminar flow of carrier gas on the substrate;
adsorbing the first pulse of precursor A with the substrate to exhaustion to form a plurality of reactive sites;
dispensing a first pulse of precursor B to a plurality of precursor B injectors, the plurality of precursor B injectors arranged in an alternating arrangement transverse the substrate travel path with the plurality of precursor A injectors with one more precursor B injector than precursor A injector;
dispensing the first pulse of the precursor B from the precursor B injector into a laminar flow of carrier gas on the substrate; and
reacting the first pulse of precursor B with the plurality of reactive sites to exhaustion to form a deposited thin film layer;
wherein the first pulse and the second pulse are alternately dispensed at a frequency of at least 5 Hz and further wherein the first pulse is self-extinguishing and the second pulse is self-extinguishing.
2. The method of claim 1 , further comprising forming the thin film layer by atomic layer deposition at a rate of at least 20 Hz.
3. The method of claim 1 , further comprising performing a second additional atomic layer deposition cycle after completion of the first cycle by:
dispensing a second pulse of precursor A to an injector;
dispensing the second pulse of the precursor A from the injector into a laminar flow of carrier gas on the substrate;
adsorbing the second pulse of precursor A with the substrate to exhaustion to form a plurality of reactive sites;
dispensing a second pulse of precursor B to an injector;
dispensing the second pulse of the precursor B from the injector into a laminar flow of carrier gas on the substrate; and
reacting the second pulse of precursor B with the plurality of reactive sites to exhaustion to form a deposited thin film layer.
4. A method for continuous thin film processing by atomic layer deposition, comprising the steps of:
moving a substrate along a substrate travel path from a feed roll to a take-up roll;
flowing a carrier gas over the substrate; and
performing a first atomic layer deposition cycle by:
dispensing a first pulse of precursor A to an injector;
dispensing the first pulse of the precursor A from the injector into a laminar flow of carrier gas on the substrate;
adsorbing the first pulse of precursor A with the substrate to exhaustion to form a plurality of reactive sites;
dispensing a first pulse of precursor B to the injector;
dispensing the first pulse of the precursor B from the injector into a laminar flow of carrier gas on the substrate; and
reacting the first pulse of precursor B with the plurality of reactive sites to exhaustion to form a deposited thin film layer;
wherein dispensing the first pulse of precursor A and dispensing the first pulse of precursor B are temporally separated.
5. The method of claim 4 , wherein dispensing the first pulse of precursor A to the injector comprises dispensing the first pulse of precursor A to a first pathway in the injector;
wherein dispensing the first pulse of precursor B to the injector comprises dispensing the first pulse of precursor B to a second pathway in the injector; and
wherein the first pathway is separate from the second pathway.
6. The method of claim 1 , wherein each precursor A injector of the plurality of precursor A injectors has a distance from each precursor B injector of the plurality of precursor B injectors of about 0 inches to 4 inches.
7. The method of claim 1 , wherein flowing the carrier gas over the substrate comprises dispensing the carrier gas on the substrate along the substrate travel path before the plurality of precursor A injectors and the plurality of precursor B injectors.