Method for producing electrode foil and method for manufacturing electrolytic capacitor
An electrolytic capacitor has an electrode foil that includes a metal foil containing a first metal, a first dielectric layer disposed on the metal foil, and a second dielectric layer disposed on the first dielectric layer. A method for manufacturing the electrolytic capacitor includes subjecting a roughening treatment to the metal foil and forming the second dielectric layer on a roughened surface of the metal foil by an atomic layer deposition method. The second dielectric layer contains an oxide of a second metal. The method further includes forming the first dielectric layer containing an oxide of the first metal between the metal foil and the second dielectric layer by subjecting the metal foil to an anodization treatment.
1. A method for producing an electrode foil that includes a metal foil containing a first metal, a first dielectric layer disposed on the metal foil, and a second dielectric layer disposed on the first dielectric layer, the method comprising:
subjecting a roughening treatment to the metal foil by etching the metal foil to form an etched region in the metal foil;
forming the second dielectric layer on the etched region in the metal foil by an atomic layer deposition method, the second dielectric layer containing an oxide of a second metal; and
forming, after the forming of the second dielectric layer, the first dielectric layer containing an oxide of the first metal between the metal foil and the second dielectric layer by subjecting the metal foil to an anodization treatment,
wherein in the atomic layer deposition method, the second dielectric layer is formed so that a ratio of concentration C2 to concentration C1 (C2/C1) ranges from 0.5 to 1.2, inclusive, the concentration C1 being a concentration of the second metal in a surface region which is a region having a depth of 0.5 times a depth of the etched region from a top surface of the etched region, the concentration C2 being a concentration of the second metal in a deep region which is a rest of the etched region other than the surface region.
2. The method for producing the electrode foil according to claim 1 , wherein the second dielectric layer contains a composite oxide of the first metal and the second metal.
3. The method for producing the electrode foil according to claim 2 , wherein the composite oxide is formed in the forming of the first dielectric layer.
4. The method for producing the electrode foil according to claim 1 , wherein the first metal is aluminum and the second metal is titanium.
5. The method for producing the electrode foil according to claim 1 , wherein in the subjecting of the roughening treatment to the metal foil, the roughening treatment is executed by any one of direct current etching and alternating current etching.
6. A method for manufacturing an electrolytic capacitor having an electrode foil, the electrode foil including a metal foil containing a first metal, a first dielectric layer disposed on the metal foil, and a second dielectric layer disposed on the first dielectric layer, the method comprising:
subjecting a roughening treatment to the metal foil by etching the metal foil to form an etched region in the metal foil;
forming the second dielectric layer on the etched region in the metal foil by an atomic layer deposition method, the second dielectric layer containing an oxide of a second metal;
preparing the electrode foil by forming, after the forming of the second dielectric layer, the first dielectric layer containing an oxide of the first metal between the metal foil and the second dielectric layer by subjecting the metal foil to an anodization treatment; and
at least one of impregnating of the electrode foil with an electrolyte solution and forming of a solid electrolyte layer on a surface of the second dielectric layer,
wherein in the atomic layer deposition method, the second dielectric layer is formed so that a ratio of concentration C2 to concentration C1 (C2/C1) ranges from 0.5 to 1.2, inclusive, the concentration C1 being a concentration of the second metal in a surface region which is a region having a depth of 0.5 times a depth of the etched region from a top surface of the etched region, the concentration C2 being a concentration of the second metal in a deep region which is a rest of the etched region other than the surface region.