Lift-off embedded micro and nanostructures
A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant from the substrate. An apparatus includes a composite film having structures embedded in an encapsulant. The composite film has a surface with a surface roughness of less than one nm. An apparatus includes an encapsulant film having a surface with indentations formed therein. The surface has a surface roughness apart from the indentations of less than one nm.
1. An apparatus, comprising:
a composite film having structures embedded in an encapsulant, the composite film having a surface with a surface roughness of less than one nm,
wherein a largest dimension of the structures is less than one mm, and
wherein the surface is a surface of the encapsulant and the structures are aligned with a plane of the surface of the encapsulant.
2. The apparatus of claim 1 , wherein the composite film has at least one second structure embedded in the encapsulant and the at least one second structure is offset with respect to the surface.
3. The apparatus of claim 1 , wherein the composite film has at least one second structure embedded in the encapsulant and the at least one second structure is one of the structures is offset with respect to the surface by a distance of less than 100 nm.
4. The apparatus of claim 3 , wherein the distance is less than 10 nm.
5. The apparatus of claim 1 , wherein the composite film further comprises a conductive film disposed on the surface.
6. The apparatus of claim 5 , wherein the conductive film is a metal film.
7. The apparatus of claim 1 , wherein the apparatus comprises at least one nanogap.
8. The apparatus of claim 1 , wherein the surface has a surface roughness of less than 0.8 nm.