IP Library Granted Patent US 10,454,005
Granted Patent B1
US 10,454,005 · App. 16/109,208 · Granted Oct 22, 2019

Ultraviolet emitting device with shaped encapsulant

Inventors: Faisal Sudradjat (Hayward, CA); Saijin Liu (Hayward, CA); Douglas A. Collins (Hayward, CA)
Assignee: RayVio Corporation
H01L33/54H01L33/486H01L33/52H01L33/56H01L33/60
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Quick Facts
Patent No.
US 10,454,005
App. No.
16/109,208
Granted
Oct 22, 2019
Kind
B1
Abstract

Embodiments of the invention include a light emitting diode (UVLED), the UVLED including a semiconductor structure with an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The UVLED is disposed on a mount. A transparent encapsulant is disposed over the UVLED. The transparent encapsulant has an angled sidewall.

Claims (20)

1. A device comprising:

an ultra-violet light emitting diode (UVLED) comprising a semiconductor structure comprising an active layer disposed between an n-type region and a p-type region, wherein the active layer emits UV radiation;

a mount, wherein the UVLED is disposed on a top surface of the mount; and

an encapsulant disposed over the UVLED, the encapsulant having a top surface and substantially flat sidewalls that have a roughened surface, the roughened surface comprising grooves in the sidewalls substantially perpendicular to the top surface of the mount.

2. The device of claim 1 wherein the roughened surface comprises a corrugated surface.

3. The device of claim 1 wherein the roughened surface comprises ripples.

4. The device of claim 1 wherein the sidewalls are sloped.

5. The device of claim 4 wherein the sidewalls slope outward from the top surface of the mount to the top surface of the encapsulant.

6. The device of claim 4 wherein the sidewalls slope inward from the top surface of the encapsulant to the top surface of the mount.

7. The device of claim 1 wherein the top surface of the encapsulant is also a roughened surface.

8. The device of claim 1 wherein the roughened surface comprises the grooves directly formed in the sidewalls of the encapsulant by removing portions of the encapsulant.

9. The device of claim 1 wherein an index of refraction of the encapsulant varies across a thickness of the encapsulant.

10. The device of claim 1 wherein the encapsulant has a square shape.

11. The device of claim 10 further comprising a trench formed in a top surface of the encapsulant, the trench having a square shape that surrounds the UVLED.

12. The device of claim 10 further comprising a trench formed in a top surface of the encapsulant, the trench having a cross shape.

13. The device of claim 1 wherein the encapsulant comprises a transparent material mixed with one of bubbles and beads.

14. The device of claim 1 wherein a plurality of holes are formed in the encapsulant.

15. The device of claim 1 wherein the encapsulant is pre-formed then mounted over the UVLED.

16. The device of claim 1 wherein the encapsulant is deposited as a liquid or semi-solid over the UVLED and shaped.

17. The device of claim 1 wherein the sidewalls are sloped at a constant angle.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jan 26, 2021
From: PATENT LAW GROUP
To: RAYVIO CORPORATION
Reel/Frame 055032/0023 →
LIEN Recorded Oct 21, 2019
From: RAYVIO CORPORATION
To: PATENT LAW GROUP, LLP
Reel/Frame 050781/0975 →
Continuity (1)
Continuation 15402621 · Jan 10, 2017