IP Library Granted Patent US 10,531,192
Granted Patent B2
US 10,531,192 · App. 16/110,666 · Granted Jan 7, 2020

Shielded headphones

Inventors: Mark Russell (Naples, FL); Zhong Gui Bin (DongGuang, CH); Alberto de Lucio (Naples, FL)
Assignee: LINSTOL USA, LLC
H04R3/007C25D7/04H04R1/1033H04R1/1075B64D43/00H04R2201/105
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Quick Facts
Patent No.
US 10,531,192
App. No.
16/110,666
Granted
Jan 7, 2020
Kind
B2
Abstract

A set of shielded headphones ( 1 ) having speaker housings ( 6 ) that are electroplated to provide metallic surfaces to create a Faraday cage around each speaker ( 5 ) contained therein. The protective metallic encasement prevents electromagnetic radiation from interfering with the speakers.

Claims (54)

1. A set of shielded headphones comprising:

at least one ear cup connected to a resilient curved band for pressing the at least one ear cup against a user's head while the set of shielded headphones are being worn;

said at least one ear cup comprising a rigid housing having an inner surface and an outer surface;

a speaker mounted within the rigid housing of said at least one ear cup;

said speaker being connected to at least one audio cable; and

a layer of metal applied to the inner surface of the rigid housing of said at least one ear cup, wherein the layer of metal applied to the inner surface of the rigid housing of said at least one ear cup is applied using electroplating.

2. The shielded set of headphones of claim 1 further comprising:

a layer of metal applied to the outer surface of the rigid housing of said at least one ear cup.

3. The shielded set of headphones of claim 2 wherein:

the layer of metal applied to the outer surface of the rigid housing of said at least one ear cup is applied using electroplating.

4. The shielded set of headphones of claim 1 wherein:

said rigid housing of said at least one ear cup further comprises an inner panel, a perimeter wall and an outer panel.

5. The shielded set of headphones of claim 4 wherein:

said speaker is mounted on the inner panel of the rigid housing of said at least one ear cup.

6. The shielded set of headphones of claim 1 further comprising:

at least one ground wire connected to the rigid housing of the at least one ear cup.

7. The shielded set of headphones of claim 6 further comprising:

said at least one ground wire being connected to said audio cable.

8. The shielded set of headphones of claim 6 further comprising:

said at least one ground wire being connected to the rigid housing via a spring extending upward from a tab.

9. The shielded set of headphones of claim 1 further comprising:

an ear pad located on the at least one ear cup.

10. A set of shielded headphones comprising:

a right ear cup and a left ear cup each connected to a resilient curved band for pressing the at right ear cup and left ear cup against a user's head while the set of shielded headphones are being worn;

said right ear cup comprising a rigid housing having an inner surface and an outer surface;

said left ear cup comprising a rigid housing having an inner surface and an outer surface; a speaker mounted within the rigid housing of said right ear cup;

a speaker mounted within the rigid housing of said left ear cup;

said speaker mounted within the rigid housing of said right ear cup being connected to at least one audio cable; said speaker mounted within the rigid housing of said left ear cup being connected to the at least one audio cable;

a layer of metal applied to the inner surface of the rigid housing of said right one ear cup; and a layer of metal applied to the inner surface of the rigid housing of said left one ear cup, wherein the layer of metal applied to the inner surface of the rigid housing of said right ear cup is applied using electroplating; and

the layer of metal applied to the inner surface of the rigid housing of said left ear cup is applied using electroplating.

11. The shielded set of headphones of claim 10 further comprising:

a layer of metal applied to the outer surface of the rigid housing of said right ear cup; and

a layer of metal applied to the outer surface of the rigid housing of said left ear cup.

12. The shielded set of headphones of claim 11 wherein:

the layer of metal applied to the outer surface of the rigid housing of said right ear cup is applied using electroplating; and

the layer of metal applied to the outer surface of the rigid housing of said left ear cup is applied using electroplating.

13. The shielded set of headphones of claim 10 wherein:

said rigid housing of said right ear cup further comprises an inner panel, a perimeter wall and an outer panel; and

said rigid housing of said left ear cup further comprises an inner panel, a perimeter wall and an outer panel.

14. The shielded set of headphones of claim 13 wherein:

said speaker mounted within the rigid housing of said right ear cup is mounted on the inner panel of the rigid housing of said right ear cup; and

said speaker mounted within the rigid housing of said left ear cup is mounted on the inner panel of the rigid housing of said left ear cup.

15. The shielded set of headphones of claim 10 further comprising:

at least one ground wire connected to the rigid housing of the right ear cup; and

at least one ground wire connected to the rigid housing of the left ear cup.

16. The shielded set of headphones of claim 15 further comprising:

said at least one ground wire connected to the rigid housing of the right ear cup being connected to said audio cable; and

said at least one ground wire connected to the rigid housing of the left ear cup being connected to said audio cable.

17. The shielded set of headphones of claim 6 further comprising:

said at least one ground wire connected to the rigid housing of the right ear cup being connected to the rigid housing via a spring extending upward from a tab; and

said at least one ground wire connected to the rigid housing of the left ear cup being connected to the rigid housing via a spring extending upward from a tab.

18. The shielded set of headphones of claim 10 further comprising:

an ear pad located on the right ear cup; and

an ear pad located on the left ear cup.

Assignments (2)
SECURITY INTEREST Recorded Dec 27, 2022
From: LINSTOL USA, LLC
To: UMB BANK, N.A.
Reel/Frame 062212/0406 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 23, 2018
From: RUSSELL, MARK; GUI BIN, ZHONG; DE LUCIO, ALBERTO
To: LINSTOL USA, LLC
Reel/Frame 046685/0879 →
Continuity (2)
Provisional Application 62655293 · Apr 10, 2018
Related Publication 20190313188A1 · Oct 10, 2019