3D semiconductor device and structure
A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors and a first metal layer, where the first metal layer includes interconnecting the first transistors forming, at least in part a plurality of logic gates; a plurality of second transistors overlaying, at least in part the first single crystal layer; a plurality of third transistors overlaying, at least in part the second transistors; a plurality of fourth transistors overlaying, at least in part the third transistors; a second metal layer overlaying, at least in part the fourth transistors; where the fourth transistors are aligned with less than 100 nm misalignment to the first transistors, where at least one of the plurality of vias has a radius of less than 200 nm, where a memory cell includes at least one of the third transistors.
1. A multi-level semiconductor device, the device comprising:
a first level comprising a plurality of single crystal first transistors;
a second level comprising a plurality of second transistors,
wherein said first level is overlaid by said second level;
a third level comprising a plurality of single crystal third transistors,
wherein said second level is overlaid by said third level,
wherein said device comprises Input/Output (“ 1 / 0 ”) circuits for connecting said device to an external device,
wherein at least one of said Input/Output circuits comprises at least one of said third transistors,
wherein at least one of said Input/Output circuits is connected to at least one of said first transistors; and
a plurality of vias providing connections between said first transistors and said second transistors,
wherein said plurality of vias each have a diameter of less than 400 nm and greater than 5 nm wherein said third level comprises a first power distribution grid, wherein said first level comprises a second power distribution grid, wherein said first power distribution grid connectivity is at least double that of said second power distribution grid connectivity.
2. The multi-level semiconductor device according to claim 1 , further comprising:
a metal layer disposed between said third transistors and said second transistors,
wherein said metal layer provides isolation of electronic noise.
3. The multi-level semiconductor device according to claim 1 ,
wherein said first level employs a first voltage to power said first transistors,
wherein said second level employs a second voltage to power said second transistors, and
wherein said first voltage is significantly different from said second voltage.
4. The multi-level semiconductor device according to claim 1 , further comprising:
bonding pads,
wherein said third level comprises said bonding pads.
5. The multi-level semiconductor device according to claim 1 ,
wherein said first transistors comprise a first channel material and said second transistors comprise a second channel material, and
wherein said first channel material is significantly different in composition than said second channel material.
6. The multi-level semiconductor device according to claim 1 , further comprising:
a metal layer disposed between said third transistors and said first transistors,
wherein said metal layer provides heat removal for said device.
7. A multi-level semiconductor device, said device comprising:
a first level comprising a plurality of single crystal first transistors;
a second level comprising a plurality of second transistors,
wherein said first level is overlaid by said second level;
a third level comprising a plurality of single crystal third transistors,
wherein said second level is overlaid by third level,
connectivity circuits for connecting said device to external devices,
wherein at least one of said connectivity circuits comprises at least one of said third transistors,
wherein at least one of said connectivity circuits is connected to at least one of said first transistors; and
a metal layer disposed between said third transistors and said second transistors,
wherein said metal layer provides isolation of electronic noise wherein said third level comprises a first power distribution grid, wherein said first level comprises a second power distribution grid, wherein said first power distribution grid connectivity is at least double that of said second power distribution grid connectivity.
8. The multi-level semiconductor device according to claim 7 , further comprising:
a plurality of vias providing connections between said first transistors and said second transistors, and wherein said plurality of vias each have diameter of less than 400 nm and greater than 5 nm.
9. The multi-level semiconductor device according to claim , wherein said connectivity circuits are Input/Output (“I/O”) circuits for connecting said device to an external device.
10. The multi-level semiconductor device according to claim 7 ,
wherein said first level employs a first voltage to power said first transistors,
wherein said second level employs a second voltage to power said second transistors, and
wherein said first voltage is significantly different than said second voltage.
11. The multi-level semiconductor device according to claim 7 , further comprising:
bonding pads,
wherein said third level comprises said bonding pads.
12. The multi-level semiconductor device according to claim 7 ,
wherein said first transistors comprise a first channel material and said second transistors comprise a second channel material, and
wherein said first channel material is significantly different in composition than said second channel material.
13. A multi-level semiconductor device, said device comprising:
a first level comprising a plurality of single crystal first transistors;
a second level comprising a plurality of second transistors,
wherein said first level is overlaid by second level;
a third level comprising a plurality of single crystal third transistors,
wherein said second level is overlaid by third level,
wherein said third level comprises a first power distribution grid,
wherein said first level comprises a second power distribution grid,
wherein said first power distribution grid connectivity is at least double that of said second power distribution grid connectivity; and
a plurality of connecting paths,
wherein said plurality of connecting paths connects said first power distribution grid to said second power distribution grid.
14. The multi-level semiconductor device according to claim 13 ,
wherein said plurality of connecting paths comprise a plurality of vias, and
wherein said plurality of vias each have a diameter of less than 400 nm and greater than 5 nm.
15. The multi-level semiconductor device according to claim 13 , further comprising:
a metal layer disposed between said third transistors and said second transistors,
wherein said metal layer provides isolation of electronic noise.
16. The multi-level semiconductor device according to claim 13 ,
wherein said first level employs a first voltage to power said first transistors,
wherein said second level employs a second voltage to power said second transistors, and
wherein said first voltage is significantly different than said second voltage.
17. The multi-level semiconductor device according to claim 13 , further comprising:
bonding pads,
wherein said third level comprises said bonding pads.
18. The multi-level semiconductor device according to claim 13 ,
wherein said first transistors comprise a first channel material and said second transistors comprise a second channel material, and
wherein said first channel material is significantly different in composition than said second channel material.