Semiconductor apparatus

1. A semiconductor apparatus comprising:

a MOSFET portion;

a diode portion connected in anti-parallel with the MOSFET portion;

a first inductance portion that is connected in series with the MOSFET portion and has inductance which is L a ; and

a second inductance portion that is connected in series with the diode portion and has inductance which is L b , wherein

reverse recovery current flows through the diode portion after reverse recovery current of the MOSFET portion becomes zero, and

the L a of the first inductance portion is lower than the L b of the second inductance portion.

2. The semiconductor apparatus according to claim 1 , wherein the diode portion has a forward voltage lower than a forward voltage of a parasitic diode of the MOSFET portion.

3. The semiconductor apparatus according to claim 1 , wherein

the first inductance portion has one or more first wires,

the second inductance portion has two or more second wires, and

the number of the first wires is smaller than the number of the second wires.

4. The semiconductor apparatus according to claim 1 , wherein

if it is assumed that:

reverse recovery time of the MOSFET portion is T rra ; and

in a parallel circuit portion that has the MOSFET portion and the first inductance portion, and the diode portion and the second inductance portion, and in which the MOSFET portion and the first inductance portion, and the diode portion and the second inductance portion are connected in parallel, voltage applied between a first connection point which is one end of the parallel circuit portion and a second connection point which is another end opposite to the one end of the parallel circuit portion is V DD2 ;

current flowing through the MOSFET portion is I Fa ; and

current flowing through the diode portion is I n ,

I Fa ·L a +T rra ·V DD2 <I Fb ·L b .

5. The semiconductor apparatus according to claim 4 , further comprising:

a third inductance portion that is connected in series with the first connection point of the parallel circuit portion, is constituted by a part of a first lead frame and has inductance which is L x ; and

a fourth inductance portion that is connected in series with the second connection point of the parallel circuit portion, is constituted by a part of a second lead frame and has inductance which is L y , wherein

a sum of the L x and the L y is sufficiently larger than both the L a and the L b .

6. The semiconductor apparatus according to claim 5 , wherein

the first inductance portion has:

a first wire; and

a first region of the first lead frame that is different from the part of the first lead frame and is in contact with the first wire,

the second inductance portion has:

a second wire; and

a second region of the first lead frame that is different from the part and the first region of the first lead frame and is in contact with the second wire, and

a thickness of the first region is larger than a thickness of the second region.

7. The semiconductor apparatus according to claim 5 , wherein

the first inductance portion has a first wire,

the second inductance portion has a second wire,

the fourth inductance portion has a third wire, and

a length of the third wire is longer than both a length of the first wire and a length of the second wire or a diameter of the third wire is smaller than both a diameter of the first wire and a diameter of the second wire.

8. The semiconductor apparatus according to claim 5 , wherein

the first inductance portion has one or more first wires,

the second inductance portion has one or more second wires,

the fourth inductance portion has one or more third wires, and

the number of the third wires is smaller than both the number of the first wires and the number of the second wires.