Packaging and thermalization of cryogenic dispersive-resistive hybrid attenuators for quantum microwave circuits
View Patent ↗A hybrid microwave attenuator is constructed by forming a circuit and a housing. The circuit has two ports, a resistive component configured to attenuate some frequencies in an input signal (transmitted signal), and a dispersive component configured to attenuate some frequencies within a frequency range. The resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit. The housing includes a closable structure in which the circuit is positioned, the structure being formed of a material that exhibits at least a threshold level of thermal conductivity, where the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The housing further includes a pair of microwave connectors, the pair of connectors being thermally coupled to the housing.
1. A hybrid microwave attenuator comprising:
a circuit having two ports, the circuit comprising:
a resistive component configured to attenuate a plurality of frequencies in an input signal (transmitted signal); and
a dispersive component configured to attenuate a second plurality of frequencies within a frequency range, wherein the resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit, the dispersive component comprising an inductive element configured to provide an electrical-thermal path between a center conductor of the hybrid microwave attenuator and a ground of the hybrid microwave attenuator, the inductive element being formed of a first material that exhibits at least a first threshold level of thermal conductivity, wherein the first threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates; and
a housing, the housing comprising:
a closable structure in which the circuit is positioned, the structure being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at the cryogenic temperature range; and
a pair of microwave connectors, the pair of connectors thermally coupled to the housing.
2. The hybrid microwave attenuator of claim 1 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the dispersive component further comprising:
a capacitive element comprises
a dielectric of a material that exhibits a thermal conductivity which exceeds a required thermal conductivity threshold when operating in the temperature range, and
a pair of plates having an electrical conductivity of greater than a threshold electrical conductivity when operating in the temperature range.
3. The hybrid microwave attenuator of claim 1 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the dispersive component further comprising:
a substrate formed of a material that exhibits a thermal conductivity of greater than a threshold thermal conductivity when operating in the temperature range.
4. The hybrid microwave attenuator of claim 1 , wherein each connector in the pair of connectors is of an identical gender.
5. The hybrid microwave attenuator of claim 1 , wherein each connector in the pair of connectors coupled to a port from the two ports of the circuit.
6. The hybrid microwave attenuator of claim 1 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the pair of connectors is formed of a material that exhibits a thermal conductivity of greater than a threshold thermal conductivity when operating in the temperature range.
7. The hybrid microwave attenuator of claim 1 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the closable structure is formed of a material that exhibits a thermal conductivity of greater than a threshold thermal conductivity when operating in the temperature range.
8. The hybrid microwave attenuator of claim 1 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the inductive element is formed of a material that exhibits an electrical conductivity of greater than a threshold electrical conductivity when operating in the temperature range.
9. The hybrid microwave attenuator of claim 8 , wherein the temperature range is bound by 300 degrees Kelvin (K) and 2 K.
10. The hybrid microwave attenuator of claim 8 , wherein the temperature range is bound by 2 K and 0.000001 K.
11. A fabrication system performing operations comprising:
forming a hybrid microwave attenuator by assembling a circuit having two ports, the circuit comprising:
a resistive component configured to attenuate a plurality of frequencies in an input signal (transmitted signal); and
a dispersive component configured to attenuate a second plurality of frequencies within a frequency range, wherein the resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit, the dispersive component comprising an inductive element configured to provide an electrical-thermal path between a center conductor of the hybrid microwave attenuator and a ground of the hybrid microwave attenuator, the inductive element being formed of a first material that exhibits at least a first threshold level of thermal conductivity, wherein the first threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates; and
forming a housing, the housing comprising:
a closable structure in which the circuit is positioned, the structure being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at the cryogenic temperature range; and
a pair of microwave connectors, the pair of connectors thermally coupled to the housing.
12. A method comprising:
forming a hybrid microwave attenuator by assembling a circuit having two ports, the circuit comprising:
a resistive component configured to attenuate a plurality of frequencies in an input signal (transmitted signal); and
a dispersive component configured to attenuate a second plurality of frequencies within a frequency range, wherein the resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit, the dispersive component comprising an inductive element configured to provide an electrical-thermal path between a center conductor of the hybrid microwave attenuator and a ground of the hybrid microwave attenuator, the inductive element being formed of a first material that exhibits at least a first threshold level of thermal conductivity, wherein the first threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates; and
forming a housing, the housing comprising:
a closable structure in which the circuit is positioned, the structure being formed of a second material that exhibits at least a second threshold level of thermal conductivity, wherein the second threshold level of thermal conductivity is achieved at the cryogenic temperature range; and
a pair of microwave connectors, the pair of connectors thermally coupled to the housing.
13. The method of claim 12 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the dispersive component further comprising:
a capacitive element comprises
a dielectric of a material that exhibits a thermal conductivity which exceeds a predetermined thermal conductivity threshold when operating in the temperature range, and
a pair of plates having an electrical conductivity of greater than a threshold electrical conductivity when operating in the temperature range.
14. The method of claim 12 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the dispersive component further comprising:
a substrate formed of a material that exhibits a thermal conductivity of greater than a threshold thermal conductivity when operating in the temperature range.
15. The method of claim 12 , wherein each connector in the pair of connectors is of an identical gender.
16. The method of claim 12 , wherein each connector in the pair of connectors coupled to a port from the two ports of the circuit.
17. The method of claim 12 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the pair of connectors is formed of a material that exhibits a thermal conductivity of greater than a threshold thermal conductivity when operating in the temperature range.
18. The method of claim 12 , wherein the hybrid microwave attenuator is configured to operate in a temperature range of a refrigeration stage, wherein the inductive element is formed of a material that exhibits an electrical conductivity of greater than a threshold electrical conductivity when operating in the temperature range.
19. The method of claim 18 , wherein the temperature range is bound by 300 degrees Kelvin (K) and 2 K.
20. The method of claim 18 , wherein the temperature range is bound by 2 K and 0.000001 K.