IP Library › Granted Patent US 11,099,050
Granted Patent B2
US 11,099,050 · App. 16/115,065 · Granted Aug 24, 2021

Waveguide coupling for a fill level radar

Inventors: Daniel Schultheiss (Hornberg, DE); Christoph Mueller (Oppenau, DE); Roland Baur (Koenigsfeld, DE)
Assignee: VEGA GRIESHABER KG
G01F23/284G01S7/03G01S13/88H01P5/08H01Q1/225H01Q13/02H01Q1/2283
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Quick Facts
Patent No.
US 11,099,050
App. No.
16/115,065
Granted
Aug 24, 2021
Kind
B2
Abstract

A waveguide coupling for a fill level radar including a waveguide and a high-frequency chip, which projects at least in part into the waveguide and includes a coupling element for coupling the transmission signal into the waveguide.

Claims (29)

1. A waveguide coupling for a fill level radar, comprising:

a waveguide;

a high-frequency chip, which is arranged at least in part in the waveguide, and configured to generate a high-frequency transmission signal; and

a substrate on which the high-frequency chip is mounted,

wherein the substrate is mounted on the waveguide,

wherein the high-frequency chip includes a coupling element configured to couple the high-frequency chip with the waveguide by feeding the high-frequency transmission signal into the waveguide, and

wherein the waveguide comprises a resonator chamber which is integrated in a cavity in the substrate.

2. The waveguide coupling according to claim 1 ,

wherein the coupling element is designed as a coupling pin.

3. The waveguide coupling according to claim 1 ,

wherein the coupling element is arranged on the an upper face of the high-frequency chip.

4. The waveguide coupling according to either of claim 1 ,

wherein the coupling element is arranged on the lower face of the high-frequency chip.

5. The waveguide coupling according to claim 1 ,

wherein the resonator chamber is filled with a dielectric at least up to a plane in which a bottom surface of the high-frequency chip is arranged.

6. The waveguide coupling according to claim 1 , further comprising:

an antenna horn that is mounted on an end of the waveguide.

7. The waveguide coupling according to claim 1 ,

wherein the high-frequency chip is adhesively bonded to the substrate.

8. A high-frequency radar module for a fill level radar, comprising:

a waveguide coupling for a fill level radar, including:

a waveguide;

a high-frequency chip, which is arranged at least in part in the waveguide, and configured to generate a high-frequency transmission signal; and

a substrate, on which the high-frequency chip is mounted,

wherein the substrate is mounted on the waveguide,

wherein the high-frequency chip includes a coupling element configured to couple the high-frequency chip with the waveguide by feeding the high-frequency transmission signal into the waveguide, and

wherein the waveguide comprises a resonator chamber which is integrated in a cavity in the substrate.

9. A fill level radar comprising:

the high-frequency radar module according to claim 8 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2018
From: SCHULTHEISS, DANIEL; MUELLER, CHRISTOPH; BAUR, ROLAND
To: VEGA GRIESHABER KG
Reel/Frame 047124/0740 →
Priority Claims (1)
EP 17188089 · Aug 28, 2017 · regional
Continuity (1)
Related Publication 20190063983A1 · Feb 28, 2019