Method of manufacturing liquid ejection head and method of manufacturing structure
To manufacture a liquid ejection head, a film having a lower surface free energy than a surface free energy of a substrate is first formed on an inner face of a liquid supply port. Next, a dry film to be a flow path forming member is attached to cover the surface of the substrate, and then a member to be an ejection orifice forming member is provided on the surface of the dry film.
1. A method of manufacturing a liquid ejection head, the liquid ejection head including a substrate having formed a liquid supply port as a through-hole, an ejection orifice forming member having formed an ejection orifice configured to eject a liquid, and a flow path forming member for forming a flow path that communicates with the liquid supply port and the ejection orifice, on a surface of the substrate, the method comprising:
a step of forming, on an inner face of the liquid supply port, a film having a lower surface free energy than a surface free energy of the substrate;
a step of attaching a dry film to be the flow path forming member to the surface of the substrate; and
a step of providing, on a second face of the dry film that is opposite to a first face of the dry film, the first face facing the surface of the substrate, a member to be the ejection orifice forming member,
wherein the dry film is made of a different material than the member to be the ejection orifice forming member, and
wherein in the step of attaching the dry film, the inner face of the liquid supply port is entirely covered by the film.
2. The method according to claim 1 , wherein the substrate is silicon, and the film is a deposited film formed when dry etching is performed to form the liquid supply port.
3. The method according to claim 2 , wherein a part of the film located on a surface side of the substrate is removed.
4. The method according to claim 3 , wherein the liquid supply port is formed by etching using a mask resist provided on the surface of the substrate, and
wherein, the part of the film located on the surface side of the substrate is removed by etching used to remove the mask resist.
5. The method according to claim 1 , wherein the liquid supply port is formed by a Bosch process.
6. The method according to claim 1 , further comprising a step of forming the ejection orifice in the member to be the ejection orifice forming member,
wherein after the forming of the ejection orifice in the member to be the ejection orifice forming member, the film formed on the inner face of the liquid supply port is removed.
7. The method according to claim 6 , wherein the film is removed using a hydrofluoroether.