DIFFUSION BARRIER LAYER FORMATION
A method of forming a titanium nitride (TiN) diffusion barrier includes exposing a deposition surface to a first pulse of a titanium-containing precursor and to a first pulse of a nitrogen-rich plasma to form a first TiN layer with a first nitrogen concentration making a lower portion of the TiN diffusion barrier, the first nitrogen concentration of the first TiN layer is increased by the first pulse of the nitrogen-rich plasma reducing a reactivity of the lower portion of the TiN diffusion barrier to prevent fluorine diffusion. The first TiN layer is exposed to second pulses of the titanium-containing precursor and the nitrogen-rich plasma to form a second TiN layer with a second nitrogen concentration above the first TiN layer making an upper portion of the TiN diffusion barrier, the first pulse of the nitrogen-rich plasma has a substantially longer duration than the second pulse of the nitrogen-rich plasma.
1 . A method of forming a titanium nitride diffusion barrier, the method comprising:
exposing a deposition surface to a first pulse of a titanium-containing precursor gas to initiate a nucleation of the titanium nitride diffusion barrier in the deposition surface, wherein the deposition surface comprises sidewalls and a bottom of a contact opening;
exposing the deposition surface to a first pulse of a nitrogen-rich plasma to form a first titanium nitride layer with a first nitrogen concentration in the deposition surface, the first titanium nitride layer comprises a lower portion of the titanium nitride diffusion barrier, wherein the first nitrogen concentration of the first titanium nitride layer is substantially increased by the first pulse of the nitrogen-rich plasma, the increased nitrogen concentration of the first titanium nitride layer lowers a reactivity of the lower portion of the titanium nitride diffusion barrier to prevent fluorine diffusion; and
exposing the first titanium nitride layer to a second pulse of the nitrogen-rich plasma to form a second titanium nitride layer with a second nitrogen concentration directly above and in contact with the first titanium nitride layer, the second titanium nitride layer comprises an upper portion of the titanium nitride diffusion barrier, wherein the first pulse of the nitrogen-rich plasma has a substantially longer duration than the second pulse of the nitrogen rich plasma,
wherein the titanium nitride diffusion barrier comprises the first and the second titanium nitride layers.
2 . The method of claim 1 , wherein the first pulse and the second pulse of the titanium-containing precursor gas have a duration of approximately 2 seconds.
3 . The method of claim 1 , wherein the first pulse of the nitrogen-rich plasma has a duration of approximately 60 seconds and the second pulse of the nitrogen-rich plasma has a duration of approximately 5 seconds.
4 . The method of claim 1 , wherein the first pulse and the second pulse of the titanium-containing precursor comprises a relatively short and timed injection interval of the titanium-containing precursor and the second pulse of the nitrogen-rich plasma comprises a relatively short and timed injection interval of the nitrogen-rich plasma.
5 . The method of claim 1 , wherein the first pulse of the nitrogen-rich plasma causes nucleation and densification of the titanium nitride diffusion barrier to increase, and lower the reactivity between fluorine and titanium while forming a thinner titanium nitride diffusion barrier for decreasing vertical resistance.
6 . The method of claim 5 , wherein causing the nucleation and densification of the titanium nitride diffusion barrier to increase reduces the amount of deposition cycles required to form the titanium nitride diffusion barrier, and causes oxidation of the titanium nitride diffusion barrier to decrease.