IP Library › Granted Patent US 10,888,961
Granted Patent B2
US 10,888,961 · App. 16/123,109 · Granted Jan 12, 2021

Joining material and method for manufacturing joined body

Inventor: Yoshihiro Kawaguchi (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
B23K35/262B22F1/0014B22F7/064B23K35/0244B23K35/22B23K35/26B23K35/302C22C1/0483C22C9/06C22C13/00C22C13/02H05K3/3457B22F2301/30B22F2301/40B22F2999/00B23K2101/36B23K2103/12B23K2103/18C22C9/00C22C12/00H05K2201/0272
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Quick Facts
Patent No.
US 10,888,961
App. No.
16/123,109
Granted
Jan 12, 2021
Kind
B2
Abstract

The joining material of the present invention is a joining material which contains a first metal powder and a second metal powder having a higher melting point than the first metal powder, in which the first metal powder is formed of Sn or an alloy containing Sn, the second metal powder is formed of a Cu—Ni alloy in which a proportion of Ni is 5 wt % or more and 30 wt % or less, a Cu—Ni—Co alloy in which a total of a proportion of Ni and a proportion of Co is 5 wt % or more and 30 wt % or less, or a Cu—Ni—Fe alloy in which a total of a proportion of Ni and a proportion of Fe is 5 wt % or more and 30 wt % or less, and a 90% volume grain size D90 of the second metal powder is 0.1 μm or more.

Claims (30)

1. A joining material comprising:

a first metal powder including Sn or an alloy containing Sn; and

a second metal powder having a higher melting point than the first metal powder, the second metal powder including

a Cu—Ni alloy in which a proportion of Ni is 5 wt % to 30 wt %,

a Cu—NiCo alloy in which a total of a proportion of Ni and a proportion of Co is 5 wt % to 30 wt %, or

a Cu—NiFe alloy in which a total of a proportion of Ni and a proportion of Fe is 5 wt % to 30 wt %, and

a 90% volume grain size D90 of the second metal powder is 0.1 μm to 4 μm, and

a proportion of a weight of the second metal powder to a weight of the first metal powder is 0.05 or less.

2. The joining material according to claim 1 , wherein a proportion of a weight of the second metal powder to a weight of the first metal powder is 0.005 to 0.05.

3. The joining material according to claim 1 , wherein a proportion of a weight of the second metal powder to a weight of the first metal powder is 0.01 to 0.04.

4. The joining material according to claim 1 , wherein the alloy containing Sn includes at least of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn, Pd, Si, Sr, Te, or P.

5. The joining material according to claim 1 , wherein an average grain size of the first metal powder is 1 μm to 20 μm.

6. The joining material according to claim 1 , wherein the 90% volume grain size D90 of the second metal powder is 0.5 μm to 3 μm.

7. The joining material according to claim 1 , wherein the joining material further contains a flux.

8. The joining material according to claim 7 , wherein a content of the flux is 7 wt % to 15 wt % to a total weight of the joining material.

9. A method of manufacturing a joined body, the method comprising:

arranging a joining material between a first member and a second member, the joining material comprising:

a first metal powder including Sn or an alloy containing Sn; and

a second metal powder having a higher melting point than the first metal powder, the second metal powder including

a Cu—Ni alloy in which a proportion of Ni is 5 wt % to 30 wt %,

a Cu—Ni—Co alloy in which a total of a proportion of Ni and a proportion of Co is 5 wt % to 30 wt %, or

a Cu—Ni—Fe alloy in which a total of a proportion of Ni and a proportion of Fe is 5 wt % to 30 wt %, and

a 90% volume grain size D90 of the second metal powder is 0.1 μm to 4 μm, and

a proportion of a weight of the second metal powder to a weight of the first metal powder is 0.05 or less; and

heating the joining material arranged between the first member and the second member to join the first member and the second member to each other.

10. The method of manufacturing a joined body according to claim 9 , wherein the first member is an electrode of an electronic component, the second member is an electrode on a substrate, and the electronic component is mounted on the substrate.

11. The method of manufacturing a joined body according to claim 9 , wherein a proportion of a weight of the second metal powder to a weight of the first metal powder is 0.005 to 0.05.

12. The method of manufacturing a joined body according to claim 9 , wherein a proportion of a weight of the second metal powder to a weight of the first metal powder is 0.01 to 0.04.

13. The method of manufacturing a joined body according to claim 9 , wherein an average grain size of the first metal powder is 1 μm to 20 μm.

14. The method of manufacturing a joined body according to claim 9 , wherein the 90% volume grain size D90 of the second metal powder is 0.5 μm to 3 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2018
From: KAWAGUCHI, YOSHIHIRO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 046800/0230 →
Priority Claims (1)
JP 2016-043556 · Mar 7, 2016 · national
Continuity (2)
Continuation PCTJP2017000472 · Jan 10, 2017
Related Publication 20190001444A1 · Jan 3, 2019