IP Library Granted Patent US 11,201,189
Granted Patent B2
US 11,201,189 · App. 16/125,759 · Granted Dec 14, 2021

Semiconductor device having rare earth oxide layer and method of manufacturing the same

Inventors: Youngmin Eeh (Seongnam-si, KR); Toshihiko Nagase (Seoul, KR); Daisuke Watanabe (Seoul, KR); Kazuya Sawada (Seoul, KR); Kenichi Yoshino (Seoul, KR); Tadaaki Oikawa (Seoul, KR); Hiroyuki Ohtori (Seoul, KR)
Assignee: TOSHIBA MEMORY CORPORATION
H01L27/228H01L43/08H01L43/10H01L43/12
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Quick Facts
Patent No.
US 11,201,189
App. No.
16/125,759
Granted
Dec 14, 2021
Kind
B2
Abstract

A semiconductor device includes a first rare earth oxide layer, a first magnetic layer adjacent to the first rare earth oxide layer, a second rare earth oxide layer, a second magnetic layer adjacent to the second rare earth oxide layer, and a nonmagnetic layer. The first magnetic layer is disposed between the first rare earth oxide layer and the nonmagnetic layer and is oriented in a crystal surface which is the same as a crystal surface of the nonmagnetic layer. The second magnetic layer is disposed between the second rare earth oxide layer and the nonmagnetic layer and is oriented in a crystal surface which is the same as a crystal surface of the nonmagnetic layer. The nonmagnetic layer is disposed between the first magnetic layer and the second magnetic layer.

Claims (29)

1. A semiconductor device comprising:

a first rare earth oxide layer;

a first magnetic layer adjacent to the first rare earth oxide layer;

a second rare earth oxide layer;

a second magnetic layer adjacent to the second rare earth oxide layer; and

a nonmagnetic layer,

wherein:

the first magnetic layer is disposed between the first rare earth oxide layer and the nonmagnetic layer and is oriented in a crystal surface which is the same as a crystal surface of the nonmagnetic layer,

the second magnetic layer is disposed between the second rare earth oxide layer and the nonmagnetic layer and is oriented in a crystal surface which is the same as a crystal surface of the nonmagnetic layer,

the nonmagnetic layer is disposed between the first magnetic layer and the second magnetic layer,

the first magnetic layer and the first rare earth oxide layer contain a same element, and

the same element is at least one of B, P, C, Ta, W, Cr, Hf and Ti.

2. The device of claim 1 , wherein:

the second magnetic layer and the second rare earth oxide layer contain a same element, and

the same element is at least one of B, P, C, Mn, Ta, W, Cr, Hf and Ti.

3. The device of claim 1 , wherein:

the first magnetic layer contacts the first rare earth oxide layer, and

the second magnetic layer contacts the second rare earth oxide layer.

4. The device of claim 1 , wherein a material included in the nonmagnetic layer is different from a material included in the first rare earth oxide layer and a material included in the second rare earth oxide layer.

5. The device of claim 4 , wherein the nonmagnetic layer includes at least one of magnesium oxide, aluminum oxide, zinc oxide, titanium oxide, aluminum nitride, boron nitride and lanthanum-strontium-manganese oxide (LSMO).

6. The device of claim 1 , further comprising:

a transistor; and

a plug,

wherein:

the first rare earth oxide layer, the first magnetic layer, the second rare earth oxide layer, the second magnetic layer and the nonmagnetic layer are included in a magnetoresistive element, and

the magnetoresistive element is connected to the transistor via the plug.

7. The device of claim 1 , wherein the first rare earth oxide layer, the first magnetic layer, the second rare earth oxide layer, the second magnetic layer and the nonmagnetic layer form a magnetoresistive element to which data can be written.

8. The device of claim 1 , wherein the first rare earth oxide layer includes at least one of Tb, Gd, Nd, Sm, Pm, Tm, Ce, Eu, Er, Ho, Yb, Lu, and Dy.

9. The device of claim 1 , wherein the second rare earth oxide layer includes at least one of Tb, Gd, Nd, Sm, Pm, Tm, Ce, Eu, Er, Ho, Yb, Lu and Dy.

Assignments (5)
CHANGE OF NAME Recorded Feb 15, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 059110/0850 →
CHANGE OF NAME Recorded Jan 20, 2022
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058711/0088 →
MERGER AND CHANGE OF NAME Recorded Jan 20, 2022
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: K.K. PANGEA
Reel/Frame 058786/0085 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 046822/0469 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2018
From: EEH, YOUNGMIN; NAGASE, TOSHIHIKO; WATANABE, DAISUKE; SAWADA, KAZUYA; YOSHINO, KENICHI; OIKAWA, TADAAKI; OHTORI, HIROYUKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 046822/0475 →
Continuity (3)
Continuation 15445829 · Feb 28, 2017
Provisional Application 62394708 · Sep 14, 2016
Related Publication 20190019841A1 · Jan 17, 2019
Cited By (3)
US 12,329,038 US 12,426,273 US 12,501,837