Semiconductor storage device and method of manufacturing the same
According to an embodiment, a semiconductor storage device includes a substrate. A stack is provided above the substrate, and includes a resistance change element and a metal layer provided above the resistance change element. A first insulating layer is provided on a side surface of the stack. A second insulating layer is provided on the first insulating layer. And an electrode is provided on the metal layer and on the first insulating layer so as to extend along a stacking direction in the second insulating layer. A lower surface of the electrode as viewed in the direction has a diameter greater than a diameter of an upper surface of the stack as viewed in the direction. A lowermost portion of the electrode is at a same level as an uppermost portion of the metal layer as viewed in the direction.
1. A semiconductor storage device, comprising:
a substrate;
a stack provided above the substrate, the stack including a resistance change element and a metal layer provided above the resistance change element, wherein the stack includes a magnetic layer adjacent to the metal layer;
a first insulating layer provided on a side surface of the stack;
a second insulating layer provided on the first insulating layer; and
an electrode provided on the metal layer and on the first insulating layer so as to extend along a stacking direction in the second insulating layer, wherein when viewed in the stacking direction, a lower surface of the electrode has a diameter greater than a diameter of an upper surface of the stack, and a lowermost portion of the electrode is at a same level as an uppermost portion of the metal layer.
2. The device according to claim 1 , wherein a lowest-level part of a contact surface between the first insulating layer and the electrode is at a same level as a highest-level part of a contact surface between the metal layer and the electrode.
3. The device according to claim 1 , wherein a lowest-level part of a contact surface between the first insulating layer and the electrode is at a higher level than a highest-level part of a contact surface between the metal layer and the electrode.
4. The device according to claim 1 , wherein the metal layer includes at least one of W, Ta, Ru, Ti, TaN, and TiN.
5. The device according to claim 1 , wherein the first insulating layer includes SiN.
6. The device according to claim 1 , wherein the resistance change element includes the magnetic layer.
7. The device according to claim 1 , wherein the magnetic layer is provided between the resistance change element and the metal layer.
8. The device according to claim 1 , wherein the metal layer is provided on the magnetic layer.
9. The device according to claim 1 , wherein an etching rate of the metal layer is equal to or higher than an etching rate of the first insulating layer with respect to an ion beam etching performed at an ion beam angle relative to the stacking direction.
10. The device according to claim 1 , wherein the metal layer comprises a first material and the electrode comprises a second material that is different from the first material.
11. The device according to claim 1 , wherein a diameter of a lowest surface of the electrode is equal to or greater than a diameter of an upper surface of the metal layer.
12. The device according to claim 1 , wherein the lower surface of the electrode is a lowest surface of the electrode.
13. The device according to claim 1 , wherein the lower surface of the electrode is above a lowest surface of the electrode.