Distributed transceiver signal switching circuit
An apparatus include a package, a chip and a plurality of bumps. The package may include (i) a plurality of bonding pads configured to exchange a plurality of radio-frequency signals with an antenna panel and (ii) a plurality of transmission lines configured to exchange the radio-frequency signals with the bonding pads. Two of the transmission lines may be connected to each of the bonding pads. The chip may be disposed in the package and may include (i) a plurality of transceiver channels configured to exchange the radio-frequency signals with the transmission lines and (ii) a plurality of switches configured to switch the radio-frequency signals to a signal ground. The bumps may be configured to exchange the radio-frequency signals between the transmission lines of the package and the transceiver channels of the chip. The transmission lines, the bumps and the switches may form a plurality of transmit/receive switches.
1. An apparatus comprising:
a package comprising (i) a plurality of bonding pads configured to exchange a plurality of radio-frequency signals with an antenna panel and (ii) a plurality of transmission lines configured to exchange said radio-frequency signals with said bonding pads, wherein two of said transmission lines are connected to each of said bonding pads;
a chip disposed in said package and comprising (i) a plurality of transceiver channels configured to exchange said radio-frequency signals with said transmission lines and (ii) a plurality of switches configured to switch said radio-frequency signals to a signal ground; and
a plurality of bumps configured to exchange said radio-frequency signals between said transmission lines of said package and said transceiver channels of said chip, wherein said transmission lines, said bumps and said switches form a plurality of transmit/receive switches.
2. The apparatus according to claim 1 , wherein each of said transmit/receive switches comprises two of said transmission lines in said package, two of said bumps and two of said switches in said chip.
3. The apparatus according to claim 2 , wherein each one of said transmission lines, a corresponding one of said bumps and a corresponding one of said switches form a tuned stub while said corresponding switch is conducting.
4. The apparatus according to claim 2 , wherein said two transmission lines and said two bumps for a Wilkinson circuit.
5. The apparatus according to claim 1 , wherein one said switches is connected to a signal path between each of said bumps and a corresponding one of said transceiver channels.
6. The apparatus according to claim 1 , wherein each of said radio-frequency signals has a frequency of at least one of (i) a radio frequency, (ii) a millimeter-wave frequency, (iii) a microwave frequency or (iv) any combination thereof.
7. The apparatus according to claim 1 , wherein each of said radio-frequency signals has a frequency in a range of 24 gigahertz to 44 gigahertz.
8. The apparatus according to claim 1 , wherein said package and said chip form part of a two-dimensional antenna network.
9. The apparatus according to claim 1 , wherein said package and said chip form part of a fifth-generation wireless communications system.
10. A method for distributed transceiver signal switching, comprising the steps of:
exchanging a plurality of radio-frequency signals between a plurality of bonding pads of a package and an antenna panel;
exchanging said radio-frequency signals between said bonding pads of said package and a plurality of transmission lines of said package, wherein two of said transmission lines are coupled to each of said bonding pads;
exchanging said radio-frequency signals between said transmission lines and a plurality of bumps;
exchanging said radio-frequency signals between said bumps and a plurality of transceiver channels of a chip, wherein said chip is disposed in said package; and
switching said radio-frequency signals to a signal ground with a plurality of switches in said chip, wherein said transmission lines, said bumps and said switches form a plurality of transmit/receive switches.
11. The method according to claim 10 , wherein each of said transmit/receive switches comprises two of said transmission lines in said package, two of said bumps and two of said switches in said chip.
12. The method according to claim 11 , wherein each one of said transmission lines, a corresponding one of said bumps and a corresponding one of said switches form a tuned stub while said corresponding switch is conducting.
13. The method according to claim 11 , wherein said two transmission lines and said two bumps for a Wilkinson circuit.
14. The method according to claim 10 , wherein one said switches is connected to a signal path between each of said bumps and a corresponding one of said transceiver channels.
15. The method according to claim 10 , wherein each of said radio-frequency signals has a frequency of at least one of (i) a radio frequency, (ii) a millimeter-wave frequency, (iii) a microwave frequency or (iv) any combination thereof.
16. The method according to claim 10 , wherein each of said radio-frequency signals has a frequency in a range of 24 gigahertz to 44 gigahertz.
17. The method according to claim 10 , wherein said package and said chip form part of (i) a two-dimensional antenna network, (ii) a fifth-generation wireless communications system or (iii) any combination thereof.
18. An apparatus comprising:
an antenna panel comprising a plurality of antenna elements;
a plurality packages each mounted on said antenna panel at a center of four of said antenna elements, each of said packages comprising (i) a plurality of bonding pads configured to exchange a plurality of radio-frequency signals with said antenna panel and (ii) a plurality of transmission lines configured to exchange said radio-frequency signals with said bonding pads, wherein two of said transmission lines are connected to each of said bonding pads,
a plurality of chips disposed in said packages, each of said chips comprising (i) a plurality of transceiver channels configured to exchange said radio-frequency signals with said transmission lines and (ii) a plurality of switches configured to switch said radio-frequency signals to a signal ground; and
a plurality of bumps configured to exchange said radio-frequency signals between said transmission lines of said packages and said transceiver channels of said chips, wherein said transmission lines, said bumps and said switches form a plurality of transmit/receive switches.