Semiconductor device package, optical package, and method for manufacturing the same
A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.
1. A semiconductor package, comprising:
a first substrate having a first surface;
a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface connected to the first surface of the second substrate, a surface area of the first surface of the second substrate being less than a surface area of the second surface, and the first surface of the second substrate being disposed on the first surface of the first substrate; and
a light source on the second surface of the second substrate.
2. The semiconductor package of claim 1 , further comprising a support structure between the first surface of the first substrate and the first surface of the second substrate.
3. The semiconductor package of claim 1 , further comprising a protection element covering the light source and the second substrate.
4. The semiconductor package of claim 3 , further comprising an optical element over the protection element.
5. The semiconductor package of claim 3 , wherein the protection element comprises a molding material, silicone, or glass.
6. The semiconductor package of claim 3 , wherein the protection element is separated from the light source by a space.
7. The semiconductor package of claim 1 , wherein the light source comprises a light-emitting surface opposite to the first surface of the second substrate.
8. The semiconductor package of claim 1 , further comprising a housing, the housing being disposed on the first surface of the first substrate to surround the second substrate and the light source.
9. The semiconductor package of claim 1 , wherein the second substrate comprises a conductive via electrically coupled to the first substrate through a conductive material.
10. The semiconductor package of claim 1 , further comprising an interposer between the second surface of the second substrate and the light source.
11. The optical package structure of claim 1 , wherein the light source comprises a first projection area on the first surface of the first substrate and a second projection area on the second substrate, wherein the first projection area is smaller than the second projection area.
12. An optical package structure, comprising:
a substrate having a first surface;
a light source on the first surface of the substrate, the light source having a light-emitting surface, a first surface opposite to the light-emitting surface, and a second surface between the light-emitting surface and the first surface, the first surface of the light source facing the first surface of the substrate, and
a carrier between the light source and the substrate,
wherein the light source comprises a first projection area on the first surface of the substrate and a second projection area on the carrier, wherein the first projection area is smaller than the second projection area.
13. The optical package structure of claim 12 , further comprising a protection element covering the light source.
14. The optical package structure of claim 13 , wherein the protection element comprises a third surface adjacent to the light-emitting surface of the light source and a fourth surface protruded from the third surface of the protection element.
15. The optical package structure of claim 13 , wherein the protection element comprises a protrusion structure in proximity to the light-emitting surface.
16. A method of manufacturing an optical package structure, comprising:
providing a substrate;
providing an optical module, the optical module comprising:
a carrier having a first surface and a second surface connected to the first surface, a surface area of the second surface being less than a surface area of the first surface;
an edge emitting device on the first surface and electrically coupled to the carrier, the edge emitting device comprising a light emitting surface; and
a protection element covering the edge emitting device and the carrier;
forming a support structure over the substrate; and
integrating the optical module with the substrate via the support structure, the light emitting surface being distal to the substrate.
17. The method of claim 16 , wherein forming the support structure comprises forming a non-conductive layer over the substrate.
18. The method of claim 16 , further comprising:
disposing a conductive bump over the substrate; and
connecting a conductive terminal of the carrier to the conductive bump.
19. The method of claim 16 , wherein forming the protection element comprises forming a molding material surrounding the carrier and the edge-emitting device or disposing a lid to cover the carrier and the edge-emitting device.
20. The optical package structure of claim 16 , wherein the edge emitting device comprises a first projection area on a first surface of the substrate and a second projection area on the carrier, wherein the first projection area is smaller than the second projection area.