IP Library › Granted Patent US 10,665,422
Granted Patent B2
US 10,665,422 · App. 16/132,618 · Granted May 26, 2020

Electron beam image acquisition apparatus, and electron beam image acquisition method

Inventor: Hidekazu Takekoshi (Kanagawa, JP)
Assignee: NUFLARE TECHNOLOGY, INC.
H01J37/268G06T7/001H01J37/22H01J37/265H01J37/28H01J2237/082H01J2237/1501H01J2237/2817
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Quick Facts
Patent No.
US 10,665,422
App. No.
16/132,618
Granted
May 26, 2020
Kind
B2
Abstract

An electron beam image acquisition apparatus includes a deflector to deflect an electron beam, a deflection control system to control the deflector, a measurement circuitry to measure, while moving a stage for placing thereon a substrate on which a figure pattern is formed, an edge position of a mark pattern arranged on the stage by scanning the mark pattern with an electron beam, a delay time calculation circuitry to calculate, using information on the edge position, a deflection control delay time which is a delay time to start deflection control occurring in the deflection control system, a correction circuitry to correct, using the deflection control delay time, a deflection position of the electron beam, and an image acquisition mechanism to include the deflector and acquire an image of the figure pattern at a corrected deflection position on the substrate.

Claims (22)

1. An electron beam image acquisition apparatus comprising:

a deflector configured to deflect an electron beam;

a deflection control system configured to control the deflector;

a measurement circuitry configured to measure, while moving a stage for placing thereon a substrate on which a figure pattern is formed, an edge position of a mark pattern arranged on the stage by scanning the mark pattern with an electron beam;

a delay time calculation circuitry configured to calculate, using information on the edge position, a deflection control delay time which is a delay time to start deflection control occurring in the deflection control system;

a correction circuitry configured to correct, using the deflection control delay time, a deflection position of the electron beam; and

an image acquisition mechanism configured to include the deflector and acquire an image of the figure pattern at a corrected deflection position on the substrate.

2. The apparatus according to claim 1 , wherein, using multiple beams as the electron beam and using an isolated line pattern of a size smaller than a pitch between beams of the multiple beams as the mark pattern, the isolated line pattern is scanned with one of the multiple beams.

3. The apparatus according to claim 1 , wherein a movement speed of the stage is made variable so as to measure the edge position of the mark pattern obtained at each the movement speed.

4. The apparatus according to claim 1 , wherein, while moving the stage in a positive direction and a negative direction, the edge position of the mark pattern is measured with respect to the positive direction and the negative direction.

5. The apparatus according to claim 4 , further comprising:

an addition circuitry configured to calculate a first sum of both edge positions of the mark pattern in a case where the stage moves in the positive direction at a constant speed.

6. The apparatus according to claim 5 , wherein the addition circuitry calculates a second sum of the both edge positions of the mark pattern in a case where the stage moves in the negative direction at the constant speed.

7. The apparatus according to claim 6 , further comprising:

a difference calculation circuitry configured to calculate a difference by subtracting the second sum from the first sum.

8. The apparatus according to claim 7 , wherein the delay time calculation circuitry calculates the deflection control delay time by using the difference.

9. The apparatus according to claim 1 , wherein the delay time calculation circuitry calculates the deflection control delay time depending on a movement speed of the stage.

10. An electron beam image acquisition method comprising:

measuring, while moving a stage to place thereon a substrate on which a figure pattern is formed, an edge position of a mark pattern arranged on the stage by scanning the mark pattern with an electron beam deflected by a deflector;

calculating, using information on the edge position, a deflection control delay time which is a delay time to start deflection control occurring in a deflection control system to control the deflector;

correcting a deflection position of the electron beam by using the deflection control delay time; and

acquiring an image of the figure pattern at a corrected deflection position on the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2018
From: TAKEKOSHI, HIDEKAZU
To: NUFLARE TECHNOLOGY, INC.
Reel/Frame 046887/0044 →
Priority Claims (1)
JP 2017-187690 · Sep 28, 2017 · national
Continuity (1)
Related Publication 20190096631A1 · Mar 28, 2019
Cited By (1)
US 12,650,652