Copper microcooler structure and fabrication
Techniques that facilitate a copper microcooler structure are provided. In one example, a device includes a first copper microcooler structure and a second copper microcooler structure. The first copper microcooler structure includes a first copper plate and a first set of copper channels attached to the first copper plate. The second copper microcooler structure includes a second copper plate and a second set of copper channels attached to the second copper plate. A surface of the second copper plate associated with the second copper microcooler structure is bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond.
1. A device, comprising:
a first copper microcooler structure that comprises a first silicon substrate, a first copper plate and a first set of copper channels attached to the first copper plate; and
a second copper microcooler structure that comprises a second silicon substrate, a second copper plate and a second set of copper channels attached to the second copper plate, wherein the second set of copper channels associated with the second copper microcooler structure is bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond.
2. The device of claim 1 , wherein the second set of copper channels is approximately aligned with the first set of copper channels.
3. The device of claim 1 , wherein the first silicon substrate of the first copper microcooler structure is attached to the second silicon substrate of the second copper microcooler structure.
4. The device of claim 1 , further comprising:
a third copper microcooler structure bonded to the second copper microcooler structure.
5. The device of claim 4 , wherein the third copper microcooler structure comprises a third set of copper channels.
6. The device of claim 5 , wherein the third set of copper channels is approximately aligned with the second set of copper channels.
7. The device of claim 1 , wherein a width of a channel from the first set of copper channels or the second set of copper channels is less than 250 microns.
8. The device of claim 1 , wherein the second copper microcooler structure is bonded to the first set of copper channels of the first copper microcooler structure to provide improved thermal capacity for the device.
9. A method, comprising:
depositing a first copper liner on a first set of patterned fins fabricated from a first silicon wafer to generate a first copper microcooler structure that comprises the first silicon wafer and a first set of copper channels;
depositing a second copper liner on a second set of patterned fins fabricated from a second silicon wafer to generate a second copper microcooler structure that comprises the second silicon wafer and a second set of copper channels; and
bonding the first copper microcooler structure to the second copper microcooler structure via a fusion bond.
10. The method of claim 9 , further comprising:
planarizing a portion of the first copper microcooler structure; and
planarizing a portion of the second copper microcooler structure.
11. The method of claim 9 , further comprising:
bonding a copper plate to the first set of copper channels.
12. The method of claim 9 , further comprising:
bonding a copper plate to the second set of copper channels.
13. The method of claim 9 , wherein the bonding comprises approximately aligning the second set of copper channels and the first set of copper channels.
14. The method of claim 9 , wherein the bonding comprises providing improved thermal capacity for a microcooler structure associated with the first copper microcooler structure and the second copper microcooler structure.
15. A device, comprising:
a first copper microcooler structure that comprises a first copper plate and a first set of copper channels attached to the first copper plate; and
a second copper microcooler structure that comprises a second copper plate and a second set of copper channels attached to the second copper plate, wherein the second set of copper channels associated with the second copper microcooler structure is bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond.
16. The device of claim 15 , wherein the first copper microcooler structure comprises a first silicon wafer and the second copper microcooler structure comprises a second silicon wafer.
17. The device of claim 15 , wherein the second set of copper channels is approximately aligned with the first set of copper channels.
18. The device of claim 16 , further comprising:
a third copper microcooler structure bonded to the second copper microcooler structure.
19. The device of claim 18 , wherein the third copper microcooler structure comprises a third set of copper channels.
20. The device of claim 15 , wherein a width of a channel from the first set of copper channels or the second set of copper channels is less than 250 microns.