Multilayered flexible electronics platform
A multilayer flexible electronics platform is an apparatus that allows modular thin-film electronics to be integrated into everyday flexible, flat objects such as pieces of clothing, material coatings, or wearable devices. The apparatus includes a flexible water-impermeable envelop, a flexible power-source layer, a flexible printed circuit board (PCB) layer, and a flexible accessory-interfacing layer. The flexible accessory-interfacing layer allows those modular thin-film electronics to be electronically and electrically attached to the apparatus. The flexible PCB layer allows the apparatus to control and manage those modular thin-film electronics. The flexible power-source layer is used to provide electrical power to those modular thin-film electronics. The flexible water-impermeable envelop protectively encloses those modular thin-film electronics and the aforementioned functional layers of the apparatus.
1. A multilayered flexible electronics platform comprises:
at least one functional unit;
the at least one functional unit comprises a flexible water-impermeable envelop, a flexible power-source layer, a flexible printed circuit board (PCB) layer, and a flexible accessory-interfacing layer;
the flexible power-source layer, the flexible PCB layer, and the flexible accessory-interfacing layer being stackably positioned amongst each other;
the flexible power-source layer, the flexible PCB layer, and the flexible accessory-interfacing layer being positioned within the flexible water-impermeable envelop;
the flexible PCB layer being electronically connected to the flexible power-source layer and the flexible accessory-interfacing layer;
the flexible power-source layer being electrically connected to the flexible PCB layer and the flexible accessory-interfacing layer;
a plurality of conductive strips;
the at least one functional unit being a plurality of functional units;
the plurality of functional units being arranged into a grid configuration;
the flexible water-impermeable envelop of each of the plurality of functional units being foldably connected amongst each other; and
the flexible power-source layer of each of the plurality of functional units being electrically connected amongst each other by a corresponding strip from the plurality of conductive strips.
2. The multilayered flexible electronics platform as claimed in claim 1 comprises:
the at least one functional unit further comprises an attachment mechanism; and
the attachment mechanism being externally mounted to the flexible water-impermeable envelop.
3. The multilayered flexible electronics platform as claimed in claim 1 comprises:
the flexible water-impermeable envelop comprises a base liner and a sealant layer;
the flexible power-source layer, the flexible PCB layer, and the flexible accessory-interfacing layer being positioned in between the base liner and the sealant layer; and
the base liner and the sealant layer being perimetrically connected to each other.
4. The multilayered flexible electronics platform as claimed in claim 1 comprises:
the at least one functional unit further comprises an energy-harvesting layer;
the energy-harvesting layer being stackably positioned amongst the flexible power-source layer, the flexible PCB layer, and the flexible accessory-interfacing layer;
the energy-harvesting layer being positioned within the flexible water-impermeable envelop; and
the energy-harvesting layer being electrically connected to the flexible power-source layer.
5. The multilayered flexible electronics platform as claimed in claim 1 comprises:
a wireless charging module;
the wireless charging module being positioned within the flexible water-impermeable envelop; and
the wireless charging module being electrically connected to the flexible power-source layer.
6. The multilayered flexible electronics platform as claimed in claim 1 comprises:
a wireless communication module; and
the wireless communication module being electronically integrated into the flexible PCB layer.
7. The multilayered flexible electronics platform as claimed in claim 4 comprises:
the energy-harvesting layer being a quantity of photoelectric material;
the flexible water-impermeable envelop being transparent; and
the quantity of photoelectric material being distributed throughout the flexible water-impermeable envelop.
8. The multilayered flexible electronics platform as claimed in claim 4 comprises:
the energy-harvesting layer being a quantity of piezoelectric material; and
the quantity of piezoelectric material being distributed throughout the flexible water-impermeable envelop.
9. The multilayered flexible electronics platform as claimed in claim 4 comprises:
the energy-harvesting layer being a quantity of pyroelectric material;
the flexible water-impermeable envelop being thermally conductive; and
the quantity of pyroelectric material being distributed throughout the flexible water-impermeable envelop.
10. The multilayered flexible electronics platform as claimed in claim 4 comprises:
the energy-harvesting layer being a quantity of triboelectric material; and
the quantity of triboelectric material being distributed throughout the flexible water-impermeable envelop.
11. A multilayered flexible electronics platform comprises:
at least one functional unit;
the at least one functional unit comprises a flexible water-impermeable envelop, a flexible power-source layer, a flexible printed circuit board (PCB) layer, a flexible accessory-interfacing layer, an attachment mechanism, and an energy-harvesting layer;
the flexible power-source layer, the flexible PCB layer, and the flexible accessory-interfacing layer being stackably positioned amongst each other;
the flexible power-source layer, the flexible PCB layer, and the flexible accessory-interfacing layer being positioned within the flexible water-impermeable envelop;
the flexible PCB layer being electronically connected to the flexible power-source layer and the flexible accessory-interfacing layer;
the flexible power-source layer being electrically connected to the flexible PCB layer and the flexible accessory-interfacing layer;
the attachment mechanism being externally mounted to the flexible water-impermeable envelop;
the energy-harvesting layer being stackably positioned amongst the flexible power-source layer, the flexible PCB layer, and the flexible accessory-interfacing layer;
the energy-harvesting layer being positioned within the flexible water-impermeable envelop; and
the energy-harvesting layer being electrically connected to the flexible power-source layer.
12. The multilayered flexible electronics platform as claimed in claim 11 comprises:
the flexible water-impermeable envelop comprises a base liner and a sealant layer;
the flexible power-source layer, the flexible PCB layer, and the flexible accessory-interfacing layer being positioned in between the base liner and the sealant layer; and
the base liner and the sealant layer being perimetrically connected to each other.
13. The multilayered flexible electronics platform as claimed in claim 11 comprises:
the energy-harvesting layer being a quantity of photoelectric material;
the flexible water-impermeable envelop being transparent; and
the quantity of photoelectric material being distributed throughout the flexible water-impermeable envelop.
14. The multilayered flexible electronics platform as claimed in claim 11 comprises:
the energy-harvesting layer being a quantity of piezoelectric material; and
the quantity of piezoelectric material being distributed throughout the flexible water-impermeable envelop.
15. The multilayered flexible electronics platform as claimed in claim 11 comprises:
the energy-harvesting layer being a quantity of pyroelectric material;
the flexible water-impermeable envelop being thermally conductive; and
the quantity of pyroelectric material being distributed throughout the flexible water-impermeable envelop.
16. The multilayered flexible electronics platform as claimed in claim 11 comprises:
the energy-harvesting layer being a quantity of triboelectric material; and
the quantity of triboelectric material being distributed throughout the flexible water-impermeable envelop.
17. The multilayered flexible electronics platform as claimed in claim 11 comprises:
a wireless charging module;
the wireless charging module being positioned within the flexible water-impermeable envelop; and
the wireless charging module being electrically connected to the flexible power-source layer.
18. The multilayered flexible electronics platform as claimed in claim 11 comprises:
a wireless communication module; and
the wireless communication module being electronically integrated into the flexible PCB layer.
19. The multilayered flexible electronics platform as claimed in claim 11 comprises:
a plurality of conductive strips;
the at least one functional unit being a plurality of functional units;
the plurality of functional units being arranged into a grid configuration;
the flexible water-impermeable envelop of each of the plurality of functional units being foldably connected amongst each other; and
the flexible power-source layer of each of the plurality of functional units being electrically connected amongst each other by a corresponding strip from the plurality of conductive strips.