IP Library › Granted Patent US 10,580,843
Granted Patent B2
US 10,580,843 · App. 16/136,784 · Granted Mar 3, 2020

Substrate and fabrication method thereof, and display device

Inventors: Dejiang Zhao (Beijing, CN); Guangcai Yuan (Beijing, CN); Liwen Dong (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L27/3246H01L51/5203H01L51/5237H01L51/56C23C16/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,580,843
App. No.
16/136,784
Granted
Mar 3, 2020
Kind
B2
Abstract

Embodiments of the present invention provide a substrate and a fabrication method thereof, and a display device. The substrate includes a base and a pixel defining layer in which a plurality of openings are formed, the pixel defining layer includes a first defining layer, a second defining layer and a third defining layer sequentially stacked on the base, wherein, the second defining layer is configured as a conductive layer, and an orthogonal projection of the second defining layer on the base is at least partially located outside an orthogonal projection of a side of the third defining layer close to the base on the base.

Claims (42)

1. A substrate, comprising:

a base;

a pixel defining layer, a plurality of openings being formed in the pixel defining layer, the pixel defining layer including a first defining layer, a second defining layer and a third defining layer sequentially stacked on the base;

wherein, the second defining layer is configured as a conductive layer, and an orthogonal projection of the second defining layer on the base is at least partially located outside an orthogonal projection of a side of the third defining layer close to the base on the base.

2. The substrate according to claim 1 , wherein

an orthogonal projection of the first defining layer on the base coincides with an orthogonal projection of the second defining layer on the base.

3. The substrate according to claim 1 , wherein

the orthogonal projection of the side of the third defining layer close to the base on the base is located within the orthogonal projection of the second defining layer on the base.

4. The substrate according to claim 1 , wherein

the first defining layer includes a lyophobic layer and a lyophilic layer, and the lyophilic layer is located between the lyophobic layer and the base.

5. The substrate according to claim 1 , wherein

in a direction perpendicular to a plane where the base is located, a cross-sectional shape of the third defining layer includes at least one of a regular trapezoid, a rectangle, and an inverted trapezoid.

6. The substrate according to claim 1 , further comprising:

a light-emitting material layer and a first electrode located in the opening, the light-emitting material layer being located between the first electrode and a base, and the first electrode being partially in contact with a surface of the second defining layer away from the base.

7. The substrate according to claim 6 , further comprising:

a first inorganic encapsulation layer, located in the opening, and located on a side of a first electrode away from the base.

8. The substrate according to claim 7 , further comprising:

a second organic encapsulation layer, located on a side of the first inorganic encapsulation layer away from the base, and the second organic encapsulation layer being at least partially located in the opening.

9. The substrate according to claim 8 , wherein

the third defining layer is hydrophobic, and is lyophilic with respect to a material of the second organic encapsulation layer.

10. The substrate according to claim 8 , wherein, the pixel defining layer further includes:

a fourth defining layer, located on a side of the third defining layer away from the base, wherein, the fourth defining layer is hydrophobic, and is lyophobic with respect to a material of the second organic encapsulation layer.

11. A display device, comprising the substrate according to claim 1 .

12. A fabrication method of a substrate, comprising:

providing a base;

forming a pixel defining layer on the base, a plurality of openings being formed in the pixel defining layer;

wherein, the pixel defining layer includes a first defining layer, a second defining layer and a third defining layer sequentially formed on the base, the second defining layer is formed as a conductive layer, and an orthogonal projection of the second defining layer on the base is at least partially located outside an orthogonal projection of a side of the third defining layer close to the base on the base.

13. The fabrication method according to claim 12 , wherein

an orthogonal projection of the first defining layer on the base coincides with the orthogonal projection of the second defining layer on the base.

14. The fabrication method according to claim 12 , wherein

the orthogonal projection of the side of the third defining layer close to the base on the base is located within the orthogonal projection of the second defining layer on the base.

15. The fabrication method according to claim 12 , wherein, the forming the pixel defining layer includes:

depositing a first insulating material thin film on the base and performing a patterning process on the first insulating material thin film to form the first defining layer;

depositing a conductive material thin film on the base and performing a patterning process on the conductive material thin film to form the second defining layer; and

depositing a second insulating material thin film on the base and performing a patterning process on the second insulating material thin film to form the third defining layer.

16. The fabrication method according to claim 12 , further comprising:

performing inkjet printing in the opening, and forming a light-emitting material layer of an organic light emitting device after the ink in the inkjet printing is dried; and

depositing a conductive material on the light-emitting material layer to form a first electrode, the first electrode being partially in contact with a surface of the second defining layer away from the base.

17. The fabrication method according to claim 16 , further comprising:

depositing an inorganic material thin film on the first electrode, to form a first inorganic encapsulation layer; and

depositing an organic material on the first inorganic encapsulation layer and curing the organic material, to form a second organic encapsulation layer;

wherein, the second organic encapsulation layer is at least partially located in the opening.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2018
From: YUAN, GUANGCAI
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 046928/0551 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2018
From: DONG, LIWEN
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 047116/0238 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2018
From: ZHAO, DEJIANG
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 047569/0981 →
Priority Claims (1)
CN 2018 1 0098359 · Jan 31, 2018 · national
Continuity (1)
Related Publication 20190237525A1 · Aug 1, 2019
Cited By (4)
US 12,295,215 US 12,453,252 US 12,616,071 US 12,727,355