Slider with bondable surface opposite suspension trace
An apparatus includes a slider which includes a slider body with a leading edge and a trailing edge and a plurality of slider bond pads disposed at the trailing edge. The slider bond pads are configured to align opposite to suspension trace bond pads on a suspension to form a solderable gap between the slider bond pads and the suspension trace bond pads.
1. An apparatus comprising:
a slider comprising:
a slider body comprising a leading edge and a trailing edge; and
a plurality of slider bond pads disposed proximate to or at the trailing edge, wherein the slider bond pads are aligned facing and opposed to suspension trace bond pads on a suspension to form a solderable gap between the slider bond pads and the suspension trace bond pads, the solderable gap comprising a recessed portion in the slider body that is open at the trailing edge.
2. The apparatus of claim 1 , and wherein the slider bond pads and the suspension trace bond pads form opposing bond pairs comprising solder impact surfaces.
3. The apparatus of claim 1 , and further comprising solder material in the solderable gap, wherein the slider bond pads and the suspension trace bond pads are connected by the solder material in the solderable gap.
4. The apparatus of claim 1 , and wherein each of the slider bond pads further comprise wrapped metallization which covers the recessed portion with a vertical bond pad connected with a horizontal bond pad.
5. The apparatus of claim 1 , and wherein each of the slider bond pads further comprise island metallization which covers the recessed portion with a vertical bond pad separate from a horizontal bond pad.
6. An apparatus comprising:
a plurality of suspension trace bond pads on a suspension surface;
a slider placed over the suspension surface, the slider comprising:
a slider body comprising a leading edge, a trailing edge and a recessed portion that forms a gap between the slider body and the suspension surface, the gap having an opening at the trailing edge;
a plurality of slider bond pads proximate to or at the trailing edge, the slider bond pads aligned with the suspension trace bond pads, with each slider bond pad aligned opposite to and facing a corresponding suspension trace bond pad to provide an opposing bond pair.
7. The apparatus of claim 6 , and further comprising a conductive material in portions of the gap, the conductive material electrically coupling the slider bond pads to the suspension trace bond pads.
8. The apparatus of claim 7 , and wherein each of the slider bond pads further comprise the opposing bond pad disposed on a horizontal surface of the recessed portion and a vertical bond pad on a vertical surface of the recessed portion.
9. A method of forming an electrical interconnect between a slider and a suspension comprising:
connecting a slider having a plurality of slider bond pads to a suspension having a plurality of suspension trace bond pads, with slider bond pads aligned facing and opposed to the suspension trace bond pads to form a solderable gap between each of the slider bond pads and each of the suspension trace bond pads, the solderable gap initially having no solder material therein; and
after the slider is connected to the suspension to form the solderable gap that initially has no solder material therein, forming a solder joint between each of the slider bond pads and the suspension trace bond pads by introducing the solder material into the solderable gap.
10. The method of claim 9 , and further comprising targeting the solderable gap with a solder sphere to form the solder joint.
11. The method of claim 10 , and wherein the solder sphere is pulled into the solderable gap.