Substrate conductor structure and method
Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.
1. A semiconductor device, comprising:
a semiconductor chip;
a package substrate, including a dielectric core, attached to the semiconductor chip;
a first elongated conductor with rounded corners comprising a conductor extending from a top surface of the substrate to a bottom surface of the substrate through the dielectric core and elongated in a direction within a major plane of the package substrate, forming side walls of the elongated conductor;
first and second plate conductors, each rectangular in shape with rounded corners and elongated in the same direction as the elongated conductor, in contact with opposing ends of the elongated conductor at the top and bottom surface of the substrate; and
a single internal conductor situated between the side walls of the elongated conductor and extending from the top surface of the substrate to the bottom surface of the substrate, the single internal conductor separated from the side walls by the dielectric core, the single internal conductor elongated in a direction within the major plane of the package substrate and including a rectangular cross section with rounded corners in a direction parallel to the major plane of the package substrate and a rectangular cross section in a direction perpendicular to the major plane of the package substrate.
2. The semiconductor device of claim 1 , wherein the single internal conductor is solid, rectangular, and includes rounded ends.
3. The semiconductor device of claim 1 , wherein the elongated conductor includes copper.
4. The semiconductor device of claim 1 , wherein the elongated conductor is configured to transmit electricity between a top surface of the substrate and a bottom surface of the substrate.
5. The semiconductor device of claim 1 , wherein the elongated conductor is configured to shield signal carrying structures adjacent to the elongated conductor.
6. A semiconductor device, comprising:
a substrate comprising a dielectric core;
a first elongated conductor with rounded corners comprising a conductor extending from a top surface of the substrate to a bottom surface of the substrate through the dielectric core and elongated in a direction within a major plane of the package substrate, forming side walls of the elongated conductor;
first and second plate conductors, each rectangular in shape with rounded corners and elongated in the same direction as the elongated conductor, in contact with opposing ends of the elongated conductor at the top and bottom surface of the substrate; and
a single internal conductor situated between the side walls of the elongated conductor and extending from the top surface of the substrate to the bottom surface of the substrate, the single internal conductor separated from the side walls by the dielectric core, the single internal conductor elongated in a direction within the major plane of the substrate and including a rectangular cross section with rounded corners in a direction parallel to the major plane of the substrate and a rectangular cross section in a direction perpendicular to the major plane of the substrate.
7. The semiconductor device of claim 6 , wherein the dielectric core includes a polymer resin.
8. The semiconductor device of claim 6 , wherein the elongated conductor includes copper.
9. The semiconductor device of claim 6 , wherein the single internal conductor carries power.
10. The semiconductor device of claim 6 , wherein the single internal conductor transmits a data signal.
11. The semiconductor device of claim 6 , wherein the single internal conductor is solid, rectangular, and includes rounded ends.