Optical measurement of a highly absorbing film layer over highly reflective film stacks
Apparatus and methods for performing optically based film thickness measurements of highly absorbing films (e.g., high-K dielectric films) with improved measurement sensitivity are described herein. A highly absorbing film layer is fabricated on top of a highly reflective film stack. The highly reflective film stack includes one or more nominally identical sets of multiple layers of different, optically contrasting materials. The highly reflective film stack gives rise to optical resonance in particular wavelength ranges. The high reflectance at the interface of the highly absorbing film layer and the highly reflective film stack increases measured light intensity and measurement sensitivity. The thickness and optical dispersion of the different material layers of the highly reflective film stack are selected to induce optical resonance in a desired wavelength range. The desired wavelength range is selected to minimize absorption by the highly absorbing film under measurement.
1. An optical metrology system comprising:
one or more illumination sources configured to generate an amount of broadband illumination light;
an illumination optics subsystem configured to direct the amount of illumination light from the illumination source to a measurement spot on a surface of a specimen under measurement, wherein the specimen comprises:
a semiconductor substrate comprising a first material;
one or more substantially identical, repeating layer sets disposed on the substrate, wherein each of the one or more repeating layer sets includes two or more layers of different materials; and
a highly absorbing material layer disposed on the one or more repeating layer sets, wherein the highly absorbing material layer is characterized by an extinction coefficient, K, and a thickness, T, wherein a product K*T is greater than 0.7 micrometers;
a collection optics subsystem configured to collect an amount of collected light from the measurement spot on the surface of the specimen;
a detector configured to detect the amount of collected light and generate an output signal indicative of the detected light; and
a computing system configured to generate an estimated value of a thickness of the highly absorbing material layer under measurement based on the output of the detector.
2. The optical metrology system of claim 1 , wherein the metrology system is configured as any of a spectroscopic ellipsometer and a spectroscopic reflectometer.
3. The optical metrology system of claim 1 , wherein the illumination includes wavelengths in a range between 1000 nanometers and 2500 nanometers.
4. The optical metrology system of claim 1 , wherein the one or more substantially identical, repeating layer sets disposed on the substrate includes at least four substantially identical, repeating layer sets.
5. The optical metrology system of claim 1 , wherein each first layer of each layer set and each second layer of each layer set is the same thickness.
6. The optical metrology system of claim 1 , wherein a thickness of a first layer of each layer set is greater than 1,500 nanometers and a thickness of a second layer of each layer set is greater than 1,500 nanometers.
7. The optical metrology system of claim 1 , wherein each of the one or more layer sets includes a first material layer and a second material layer, wherein the first material layer is an oxide material layer, and wherein the second material layer is a nitride material layer or an amorphous silicon material layer.
8. A semiconductor wafer comprising:
a semiconductor substrate comprising a first material;
one or more substantially identical layer sets disposed on the substrate, wherein each of the one or more layer sets includes two or more layers of different materials, and wherein each of the two or more layers has a thickness greater than 500 nanometers; and
a highly absorbing material layer disposed on the one or more substantially identical layer sets, wherein the highly absorbing material layer is characterized by an extinction coefficient, K, and a thickness, T, wherein a product K*T is greater than 0.7 micrometers.
9. The semiconductor wafer of claim 8 , wherein the one or more substantially identical, repeating layer sets disposed on the substrate includes at least four substantially identical, repeating layer sets.
10. The semiconductor wafer of claim 8 , wherein each first layer of each layer set and each second layer of each layer set is the same thickness.
11. The semiconductor wafer of claim 8 , wherein a thickness of a first layer of each layer set is greater than 1,500 nanometers and a thickness of a second layer of each layer set is greater than 1,500 nanometers.
12. The semiconductor wafer of claim 8 , wherein each of the one or more layer sets includes a first material layer and a second material layer, wherein the first material layer is an oxide material layer, and wherein the second material layer is a nitride material layer or an amorphous silicon material layer.
13. The semiconductor wafer of claim 12 , wherein the highly absorbing material layer is an amorphous carbon material layer.
14. A method comprising:
providing an amount of broadband illumination light;
directing the amount of illumination light to a measurement spot on a surface of a specimen under measurement, wherein the specimen comprises:
a semiconductor substrate comprising a first material;
one or more substantially identical, repeating layer sets disposed on the substrate, wherein each of the one or more repeating layer sets includes two or more layers of different materials; and
a highly absorbing material layer disposed on the one or more repeating layer sets, wherein the highly absorbing material layer is characterized by an extinction coefficient, K, and a thickness, T, wherein a product K*T is greater than 0.7 micrometers;
collecting an amount of collected light from the measurement spot on the surface of the specimen;
detecting the amount of collected light; and
determining an estimated value of a thickness of the highly absorbing material layer under measurement based on the detected amount of collected light.
15. The method of claim 14 , wherein the broadband illumination light includes wavelengths in a range between 1000 nanometers and 2500 nanometers.
16. The method of claim 14 , wherein the one or more substantially identical, repeating layer sets disposed on the substrate includes at least four substantially identical, repeating layer sets.
17. The method of claim 14 , wherein each first layer of each layer set and each second layer of each layer set is the same thickness.
18. The method of claim 14 , wherein a thickness of a first layer of each layer set is greater than 1,500 nanometers and a thickness of a second layer of each layer set is greater than 1,500 nanometers.
19. The method of claim 14 , wherein each of the one or more layer sets includes a first material layer and a second material layer, wherein the first material layer is an oxide material layer, and wherein the second material layer is a nitride material layer or an amorphous silicon material layer.
20. The method of claim 19 , wherein the highly absorbing material layer is an amorphous carbon material layer.