Electronic component and manufacturing method for the same
A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.
1. A manufacturing method for an electronic component, the method comprising:
preparing a first composite magnetic section provided with a first composite magnetic layer containing magnetic particles and resin, and at least one marker layer disposed on the first composite magnetic layer and containing non-conductive particles, the marker layer being disposed above an uppermost surface of the first composite magnetic layer;
preparing a second composite magnetic section provided with a second composite magnetic layer containing magnetic particles and resin, and at least one coil which is formed by winding a conductive wire and is buried in the second composite magnetic layer with part of the coil being exposed;
obtaining a multilayer body by disposing the first composite magnetic section in such a manner that a surface on an opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section where the part of the coil is exposed; and
obtaining a molded body having a marker area formed with the non-conductive particles in the marker layer being pressed into the first composite magnetic layer by compression molding of the multilayer body, such that the marker layer becomes embedded in alignment with or below the uppermost surface of the first composite magnetic layer as a result of the compression molding.
2. The manufacturing method according to claim 1 , wherein
the molded body incorporates a plurality of coils, and the first composite magnetic section includes a plurality of marker layers, and
the manufacturing method further includes dividing the molded body incorporating the plurality of coils to obtain a plurality of divided bodies, each including one of the coils and a respective marker area including one of the marker layers.
3. The manufacturing method according to claim 1 , further comprising:
forming an outer electrode to connect to the coil.
4. The manufacturing method according to claim 3 , wherein
the forming forms the outer electrode spaced from the marker area.
5. The manufacturing method according to claim 3 , wherein
the forming forms the outer electrode covering a portion of a surface of the molded body including the marker area.
6. The manufacturing method according to claim 1 , wherein the magnetic particles are metal magnetic particles.
7. The manufacturing method according to claim 1 , wherein the non-conductive particles are metallic oxide particles.