IP Library Granted Patent US 10,804,436
Granted Patent B2
US 10,804,436 · App. 16/153,062 · Granted Oct 13, 2020

Light emitting diode containing oxidized metal contacts

Inventors: Fariba Danesh (Los Altos Hills, CA); Tsun Lau (Sunnyvale, CA); Richard P. Schneider, Jr. (Albuquerque, NM); Michael Jansen (Palo Alto, CA); Max Batres (Sunnyvale, CA)
Assignee: GLO AB
H01L33/42H01L25/0753H01L27/1214H01L33/007H01L33/0093H01L33/0095H01L33/06H01L33/32H01L33/46H01L33/62H01L33/24H01L33/405H01L2933/0016H01L2933/0025H01L2933/0066
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Quick Facts
Patent No.
US 10,804,436
App. No.
16/153,062
Granted
Oct 13, 2020
Kind
B2
Abstract

A method of forming a light emitting device includes forming a semiconductor light emitting diode, forming a metal layer stack including a first metal layer and a second metal layer on the light emitting diode, and oxidizing the metal layer stack to form transparent conductive layer including at least one conductive metal oxide.

Claims (29)

1. A direct view display device, comprising:

a first light emitting diode bonded to a backplane; and

a second light emitting diode bonded to the backplane;

wherein:

the first light emitting diode is configured to emit light of a first peak wavelength and comprises a transparent conductive layer located between a first doped semiconductor layer and an aluminum or silver reflector layer; and

the second light emitting diode is configured to emit light of a second peak wavelength longer than the first peak wavelength and comprises a gold reflector layer directly contacting a second doped semiconductor layer.

2. The direct view display device of claim 1 , wherein:

the transparent conductive layer in the first light emitting diode comprises at least one of gold or nickel oxide layers having a thickness in a range from 1 nm to 10 nm;

the gold reflector layer of the second light emitting diode has a thickness of at least 100 nm;

the first light emitting diode is configured to emit blue or green light; and

the second light emitting diode is configured to emit red light.

3. The direct view display device of claim 2 , wherein:

the transparent conductive layer contacts a first gold doped semiconductor region in the first doped semiconductor layer in the first light emitting diode;

the gold reflector layer contacts a second gold doped semiconductor region in the second doped semiconductor layer in the second light emitting diode; and

the gold reflector is configured to shift a center of emission spectrum of light emitted by the second light emitted diode to a longer wavelength.

4. The direct view display device of claim 1 , wherein the transparent conductive layer contacts the aluminum or silver reflector layer.

5. The direct view display device of claim 1 , wherein the transparent conductive layer comprises a transparent conductive metal oxide material.

6. The direct view display device of claim 1 , wherein the first light emitting diode comprises a first gold doped region in the first doped semiconductor layer, and wherein the gold doped region contacts the transparent conductive layer.

7. The direct view display device of claim 6 , wherein the first gold doped region comprises a gold doped III-nitride semiconductor region.

8. The direct view display device of claim 6 , wherein the second light emitting diode comprises a second gold doped region in the second doped semiconductor layer, and wherein the gold doped region contacts the gold reflector layer.

9. The direct view display device of claim 1 , wherein the gold reflector layer comprises gold at an atomic percentage in a range from 90% to 100%.

10. The direct view display device of claim 1 , wherein:

the first light emitting diode is configured to emit blue or green light;

the second light emitting diode is configured to emit red light; and

the gold reflector layer induces red shift of a center of an emission spectrum of light that is emitted from an active region of the second light emitting diode.

11. The direct view display device of claim 1 , wherein:

the first and second light emitting diodes comprise III-V semiconductor, bottom emitting, vertical light emitting diodes;

the transparent conductive layer and the aluminum or silver reflector are formed on the first doped semiconductor layer; and

the gold reflector layer is formed on the second doped semiconductor layer.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2024
From: GLO TECHNOLOGIES LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 068297/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2023
From: SYSONAN, INC.
To: GLO TECHNOLOGIES LLC
Reel/Frame 065178/0210 →
CHANGE OF NAME Recorded Oct 5, 2023
From: NANOSYS, INC.
To: SYSONAN, INC.
Reel/Frame 065156/0416 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT RECORDED AT REEL 059569 / FRAME 0840 Recorded Sep 7, 2023
From: FORTRESS CREDIT CORP.,
To: NANOSYS, INC.
Reel/Frame 064836/0263 →
SECURITY INTEREST Recorded Apr 1, 2022
From: NANOSYS, INC.
To: FORTRESS CREDIT CORP., AS AGENT
Reel/Frame 059569/0840 →
NUNC PRO TUNC ASSIGNMENT Recorded Aug 13, 2021
From: GLO AB
To: NANOSYS, INC.
Reel/Frame 057184/0564 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2020
From: DANESH, FARIBA; LAU, TSUN; SCHNEIDER, RICHARD P., JR; JANSEN, MICHAEL; BATRES, MAX
To: GLO AB
Reel/Frame 053742/0271 →
Continuity (2)
Provisional Application 62569256 · Oct 6, 2017
Related Publication 20190109262A1 · Apr 11, 2019
Cited By (1)
US 12,369,430