Thermal management method and apparatus for high frequency IC with apertured heat sink
An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.
1. An integrated circuit system comprising:
a die containing high frequency circuitry operating at mm-wave frequencies, the die also having a first side and a second side;
a plurality of interfaces on the first side, the plurality of interfaces being in electrical communication with the high frequency circuitry; and
a heat sink having a bottom surface with a first region and an aperture region, the first region being in physical and conductive contact with the die, the aperture region forming a concavity with an inner concave surface that is spaced from the die.
2. The integrated circuit system of claim 1 wherein the aperture region is adjacent to the second side.
3. The integrated circuit system of claim 1 wherein the aperture region forms a concavity having an elliptical shape.
4. The integrated circuit system of claim 1 wherein the aperture region forms a concavity having an irregular shape.
5. The integrated circuit system of claim 1 wherein the aperture region forms a concavity having a non-elliptical shape.
6. The integrated circuit system of claim 1 wherein the first region is substantially planar.