Method of forming deep trench isolation in radiation sensing substrate and image sensor device
A method of forming a deep trench isolation in a radiation sensing substrate includes: forming a trench in the radiation sensing substrate; forming a corrosion resistive layer in the trench, in which the corrosion resistive layer includes titanium carbon nitride having a chemical formula of TiC x N (2-x) , and x is in a range of 0.1 to 0.9; and filling a reflective material in the trench and over the corrosion resistive layer.
1. A method of forming deep trench isolation in a radiation sensing substrate, comprising:
forming a trench in the radiation sensing substrate, the trench extending from a back surface of the radiation sensing substrate into the radiation sensing substrate; and
forming a corrosion resistive layer in the trench, wherein the corrosion resistive layer comprises titanium carbon nitride.
2. The method of claim 1 , wherein the titanium carbon nitride has a chemical formula of TiCxN(2-x).
3. The method of claim 2 , wherein x is in a range of 0.1 to 0.9.
4. The method of claim 3 , comprising:
filling a reflective material over the corrosion resistive layer.
5. The method of claim 1 , comprising:
filling a reflective material over the corrosion resistive layer.
6. The method of claim 1 , comprising:
forming a dielectric material in the trench before forming the corrosion resistive layer in the trench.
7. The method of claim 1 , wherein forming the corrosion resistive layer in the trench comprises:
forming a titanium carbon nitride-containing layer in the trench; and
performing a plasma treatment with hydrogen on the titanium carbon nitride-containing layer to convert the titanium carbon nitride-containing layer to the corrosion resistive layer.
8. The method of claim 1 , comprising:
forming an interconnection structure comprising a conductive line over a front surface of the radiation sensing substrate before forming the trench in the radiation sensing substrate.
9. The method of claim 8 , comprising:
attaching a second substrate to the interconnection structure before forming the trench in the radiation sensing substrate, wherein the interconnection structure is disposed between the radiation sensing substrate and the second substrate.
10. The method of claim 9 , wherein the second substrate comprises an application specific integrated circuit (ASIC).
11. The method of claim 1 , wherein the corrosion resistive layer comprises:
15 to 40 at % carbon,
15 to 40 at % nitrogen, and
20 to 40 at % titanium.
12. The method of claim 1 , wherein forming the corrosion resistive layer in the trench comprises:
forming the corrosion resistive layer using a titanium carbon nitride precursor and ammonia, wherein the titanium carbon nitride precursor comprises at least one of tetrakis(dimethylamino)titanium (TDMAT) or tetrakis(diethylamino)titanium (TDEAT).
13. The method of claim 1 , comprising:
forming a dielectric material in the trench before forming the corrosion resistive layer in the trench, wherein forming the corrosion resistive layer in the trench comprises forming the corrosion resistive layer over the dielectric material to conceal the dielectric material; and
exposing a portion of the dielectric material after forming the corrosion resistive layer in the trench.
14. The method of claim 1 , comprising:
forming a dielectric layer over the corrosion resistive layer;
forming a reflective grid over the dielectric layer, wherein the reflective grid comprises a reflective structure overlying the trench; and
forming a protective layer over the reflective structure.
15. A method of forming deep trench isolation in a radiation sensing substrate, comprising:
forming a trench in the radiation sensing substrate;
forming a titanium carbon nitride-containing layer in the trench; and
performing a plasma treatment with hydrogen on the titanium carbon nitride-containing layer to convert the titanium carbon nitride-containing layer to a corrosion resistive layer.
16. The method of claim 15 , comprising:
forming a reflective grid over the corrosion resistive layer, wherein the reflective grid comprises a reflective structure overlying the trench; and
forming a protective layer over the reflective structure.
17. The method of claim 15 , comprising:
filling a reflective material over the corrosion resistive layer.
18. The method of claim 15 , comprising:
forming a conductive line over a front surface of the radiation sensing substrate before forming the trench in the radiation sensing substrate.
19. A method of forming deep trench isolation in a radiation sensing substrate, comprising:
forming a trench in the radiation sensing substrate;
forming a dielectric layer over the radiation sensing substrate and in the trench; and
forming a corrosion resistive layer in the trench over the dielectric layer to sandwich the dielectric layer between the radiation sensing substrate and the corrosion resistive layer, wherein the corrosion resistive layer comprises titanium carbon nitride.
20. The method of claim 19 , comprising:
forming a second dielectric layer over the corrosion resistive layer, wherein the second dielectric layer contacts the dielectric layer.