Dielectric fill for memory pillar elements
A method for fabricating a semiconductor device includes forming one or more encapsulation spacers each about respective ones of one more memory pillar elements to have a geometry, including forming each encapsulation spacer to have a footing of at least about twice a critical dimension of its corresponding pillar, and depositing dielectric material on the one or more memory pillar elements and the one or more encapsulation spacers to form an interlayer dielectric free of voids based on the geometry.
1. A method for fabricating a semiconductor device, comprising:
forming one or more encapsulation spacers each about respective ones of one more memory pillar elements to have a geometry, including forming each encapsulation spacer to have a footing of at least about twice a critical dimension of its corresponding pillar; and
depositing dielectric material on the one or more memory pillar elements and the one or more encapsulation spacers to form an interlayer dielectric free of voids based on the geometry.
2. The method of claim 1 , wherein forming the one or more encapsulation spacers includes depositing encapsulation material on a base structure, and etching back the encapsulation spacer material to form the one or more encapsulation spacers.
3. The method of claim 2 , wherein the encapsulation material is deposited to have a thickness depending on pitch.
4. The method of claim 3 , wherein the encapsulation material is deposited to have a thickness between about 50 nm to about 500 nm depending on the pitch.
5. The method of claim 1 , further comprising forming an additional spacer layer along the one or more memory pillar elements and the one or more encapsulation spacers.
6. The method of claim 1 , further comprising forming one or more contacts on respective ones of the one or more memory pillar elements and the one or more encapsulation spacers.
7. The method of claim 6 , further comprising forming a dielectric cap layer on the interlayer dielectric and the one or more contacts.
8. The method of claim 1 , wherein the one or more memory pillar elements are associated with a magnetoresistive random-access memory (MRAM) device.
9. A method for fabricating a semiconductor device, comprising:
forming a base structure associated with a magnetoresistive random-access memory (MRAM) device;
forming one or more encapsulation spacers about respective ones of one more memory pillar elements of the base structure to have a geometry, including forming each encapsulation spacer to have a footing of at least about twice a critical dimension of its corresponding pillar; and
depositing dielectric material on the one or more memory pillar elements and the one or more encapsulation spacers to form an interlayer dielectric free of voids based on the geometry.
10. The method of claim 9 , wherein forming the one or more encapsulation spacers includes depositing encapsulation material on the base structure, and etching back the encapsulation spacer material to form the one or more encapsulation spacers.
11. The method of claim 10 , wherein the encapsulation material is deposited to have a thickness depending on pitch.
12. The method of claim 11 , wherein the encapsulation material is deposited to have a thickness between about 50 nm to about 500 nm depending on the pitch.
13. The method of claim 9 , further comprising forming an additional spacer layer along the one or more memory pillar elements and the one or more encapsulation spacers.
14. The method of claim 9 , further comprising forming one or more contacts on respective ones of the one or more memory pillar elements and the one or more encapsulation spacers.
15. The method of claim 14 , further comprising forming a dielectric cap layer on the interlayer dielectric and the one or more contacts.
16. A semiconductor device, comprising:
a base structure associated with a memory device; and
one or more encapsulation spacers disposed about respective ones of one more memory pillar elements of the base structure, wherein each encapsulation spacer has a footing that is at least about twice a critical dimension of its corresponding pillar.
17. The device of claim 16 , further comprising an additional spacer layer disposed along the one or more memory pillar elements and the one or more encapsulation spacers.
18. The device of claim 16 , further comprising an interlayer dielectric including dielectric material disposed on the one or more memory pillar elements and the one or more encapsulation spacers.
19. The device of claim 18 , further comprising one or more contacts disposed on respective ones of the one or more memory pillar elements and the one or more encapsulation spacers.
20. The device of claim 19 , further comprising a dielectric cap layer disposed on the interlayer dielectric and the one or more contacts.