IP Library › Granted Patent US 11,416,165
Granted Patent B2
US 11,416,165 · App. 16/160,482 · Granted Aug 16, 2022

Low synch dedicated accelerator with in-memory computation capability

Inventors: Amrita Mathuriya (Portland, OR); Sasikanth Manipatruni (Portland, OR); Victor Lee (Santa Clara, CA); Huseyin Sumbul (Portland, OR); Gregory Chen (Portland, CA); Raghavan Kumar (Hillsboro, OR); Phil Knag (Hillsboro, OR); Ram Krishnamurthy (Portland, OR); Ian Young (Portland, OR); Abhishek Sharma (Hillsboro, OR)
Assignee: Intel Corporation
G06F3/0655G06F3/061G06F3/0683G06F12/0802G06F12/0875G06F12/0897G06F12/1081G06N3/04G06N3/0445G06N3/063G06F2212/621
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Quick Facts
Patent No.
US 11,416,165
App. No.
16/160,482
Granted
Aug 16, 2022
Kind
B2
Abstract

The present disclosure is directed to systems and methods of implementing a neural network using in-memory, bit-serial, mathematical operations performed by a pipelined SRAM architecture (bit-serial PISA) circuitry disposed in on-chip processor memory circuitry. The on-chip processor memory circuitry may include processor last level cache (LLC) circuitry. The bit-serial PISA circuitry is coupled to PISA memory circuitry via a relatively high-bandwidth connection to beneficially facilitate the storage and retrieval of layer weights by the bit-serial PISA circuitry during execution. Direct memory access (DMA) circuitry transfers the neural network model and input data from system memory to the bit-serial PISA memory and also transfers output data from the PISA memory circuitry to system memory circuitry. Thus, the systems and methods described herein beneficially leverage the on-chip processor memory circuitry to perform a relatively large number of vector/tensor calculations without burdening the processor circuitry.

Claims (62)

1. A system comprising:

processor circuitry;

on-chip processor memory circuitry that includes a plurality of static random access memory (SRAM) arrays, each of the SRAM arrays including microcontroller circuitry; and

neural network control circuitry to:

receive instructions that include data representative of a multi-layer neural network model and neural network input data;

form serially coupled, bit-serial, pipelined static random access memory architecture (bit-serial PISA) circuitry using at least a portion of the plurality of SRAM arrays, each of the SRAM arrays included in the portion of the plurality of SRAM arrays to determine a single layer of the multi-layer neural network model;

cause a transfer of one or more subsets of the instructions, each of the one or more subsets representative of a layer of the multi-layer neural network model, to the microcontroller circuitry in a respective one of the portion of the plurality of SRAM arrays;

cause, via one or more high-bandwidth connections, a bidirectional transfer of neural network layer weights between PISA memory circuitry and the portion of the plurality of SRAM arrays included in the serially coupled bit-serial PISA circuitry;

cause a transfer of the neural network input data from the PISA memory circuitry to the serially coupled bit-serial PISA circuitry; and

cause a transfer of output data from the serially coupled bit-serial PISA circuitry to the PISA memory circuitry.

2. The system of claim 1 wherein each of the plurality of SRAM arrays comprises a SRAM array having integer compute capability (C-SRAM) using bit-serial, in-memory, processing.

3. The system of claim 1 wherein the on-chip processor memory circuitry comprises last level cache (LLC) memory.

4. The system of claim 1 wherein the system comprises a multi-chip module that includes the processor circuitry, the on-chip processor memory circuitry, and the neural network control circuitry.

5. The system of claim 1 wherein the system comprises a central processing unit that includes the processor circuitry and the on-chip processor memory circuitry.

6. A non-transitory machine-readable storage medium having instructions that, when executed by neural network control circuitry, cause the neural network control circuitry to:

receive, from communicably coupled processor circuitry, an instruction set architecture (ISA) that includes a multi-layer neural network model and neural network input data;

serially couple a plurality of static random access memory (SRAM) arrays included in on-chip processor memory circuitry to provide bit-serial pipelined SRAM architecture (bit-serial PISA) circuitry, each of the plurality of SRAM arrays to determine a single layer of the multi-layer neural network model and including respective microcontroller circuitry;

cause a transfer of the ISA representative of each layer of the multi-layer neural network model to the microcontroller circuitry in a respective one of the plurality of SRAM arrays;

cause a bidirectional transfer of neural network layer weights between each of the serially connected SRAM arrays forming the bit-serial PISA circuitry and PISA memory circuitry coupled to the bit-serial PISA circuitry via one or more high-bandwidth connections;

cause a transfer of the ISA representative of the neural network input data from the PISA memory circuitry to the bit-serial PISA circuitry;

cause the bit-serial PISA circuitry to perform bit-serial, in-memory, neural network processing using the plurality of SRAM arrays; and

cause a transfer of neural network output data from the bit-serial PISA circuitry to the PISA memory circuitry.

7. The non-transitory machine-readable storage medium of claim 6 wherein the instructions further cause the neural network control circuitry to:

cause direct memory access (DMA) control circuitry to transfer the neural network output data from the PISA memory circuitry to system memory circuitry.

8. The non-transitory machine-readable storage medium of claim 6 wherein the instructions that cause the neural network control circuitry to serially couple a plurality of static random access memory (SRAM) arrays included in on-chip processor memory circuitry to provide pipelined SRAM architecture (bit-serial PISA) circuitry further cause the neural network control circuitry to:

serially couple a plurality of static random access memory (SRAM) arrays included in last level cache (LLC) circuitry coupled to the processor circuitry to provide the bit-serial PISA circuitry.

9. An in-memory neural network processing system, comprising:

means for receiving an instruction set architecture (ISA) from processor circuitry, the ISA including a multi-layer neural network model and neural network input data;

means for serially coupling a plurality of static random access memory (SRAM) arrays included in on-chip processor memory circuitry to provide bit-serial pipelined SRAM architecture (bit-serial PISA) circuitry, each of the plurality of SRAM arrays representing a single layer of the multi-layer neural network model and including respective microcontroller circuitry;

means for causing a transfer of the ISA representative of each layer of the multi-layer neural network model to the microcontroller circuitry in a respective one of the plurality of SRAM arrays;

means for causing a bidirectional transfer of neural network layer weights between each of the serially coupled SRAM arrays forming the bit-serial PISA circuitry and PISA memory circuitry coupled to the bit-serial PISA circuitry via one or more high-bandwidth connections;

means for causing a transfer of the ISA representative of the neural network input data from the PISA memory circuitry to the bit-serial PISA circuitry;

means for causing the bit-serial PISA circuitry to perform bit-serial, in-memory, neural network processing using the plurality of SRAM arrays; and

means for causing a transfer of neural network output data from the bit-serial PISA circuitry to the PISA memory circuitry;

wherein the means for receiving, the means for serially coupling, the means for causing a transfer of the ISA representative, the means for causing a bidirectional transfer, the means for causing the bit-serial PISA circuitry to perform and the means for causing a transfer of neural network output data comprise hardware circuitry.

10. The system of claim 9 , further comprising:

means for causing a direct memory access (DMA) transfer of the neural network output data from the PISA memory circuitry to system memory circuitry.

11. The system of claim 10 , further comprising:

means for receiving the data representative of the multi-layer neural network model and the neural network input values in a high-level language; and

means for compiling the received data representative of the multi-layer neural network model and the neural network input values from the high-level language to the ISA.

12. The system of claim 11 wherein the means for compiling the received data representative of the multi-layer neural network model and the neural network input values from the high-level language to the ISA comprises:

means for compiling the received data representative of the multi-layer neural network model and the neural network input values from the high-level language to an intermediate domain specific language (DSL); and

means for compiling the received data representative of the multi-layer neural network model and the neural network input values from the DSL to the ISA.

13. The system of claim 9 wherein the means for serially coupling a plurality of static random access memory (SRAM) arrays included in on-chip processor memory circuitry to provide pipelined SRAM architecture (bit-serial PISA) circuitry further comprises:

means for serially coupling a plurality of static random access memory (SRAM) arrays included in last level cache (LLC) circuitry coupled to the processor circuitry to provide the bit-serial PISA circuitry.

14. An electronic device, comprising:

a circuit board;

processor circuitry coupled to the circuit board;

on-chip processor memory circuitry that includes a plurality of static random access memory (SRAM) arrays, each of the SRAM arrays including microcontroller circuitry;

system memory circuitry;

direct memory access control circuitry; and

neural network control circuitry to:

receive instructions that include data representative of a multi-layer neural network model and neural network input data;

form serially coupled, bit-serial, pipelined static random access memory architecture (bit-serial PISA) circuitry using at least a portion of the plurality of SRAM arrays, each of the SRAM arrays included in the portion of the plurality of SRAM arrays to determine a single layer of the multi-layer neural network model;

cause a transfer of one or more subsets of the instructions, each of the one or more subsets representative of a layer of the multi-layer neural network model, to the microcontroller circuitry in a respective one of the portion of the plurality of SRAM arrays;

cause, via one or more high-bandwidth connections, a bidirectional transfer of neural network layer weights between PISA memory circuitry and the portion of the plurality of SRAM arrays included in the serially coupled bit-serial PISA circuitry;

cause a transfer of the neural network input data from the PISA memory circuitry to the bit-serial PISA circuitry; and

cause a transfer of output data from the serially coupled bit-serial PISA circuitry to the PISA memory circuitry.

15. The electronic device of claim 14 wherein each of the plurality of SRAM arrays comprises a SRAM array having integer compute capability (C-SRAM) using bit-serial, in-memory, processing.

16. The electronic device of claim 14 wherein the on-chip processor memory circuitry comprises last level cache (LLC) memory.

17. The electronic device of claim 14 wherein the system comprises a multi-chip module that includes the processor circuitry, the on-chip processor memory circuitry, and the neural network control circuitry.

18. The electronic device of claim 14 wherein the system comprises a central processing unit that includes the processor circuitry and the on-chip processor memory circuitry.

Assignments (2)
EMPLOYMENT AGREEMENT Recorded Oct 25, 2021
From: MATHURIYA, AMRITA; MANIPATRUNI, SASIKANTH; LEE, VICTOR
To: INTEL CORPORATION
Reel/Frame 058215/0549 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2021
From: SUMBUL, HUSEYIN; CHEN, GREGORY; KUMAR, RAGHAVAN; KNAG, PHIL; KRISHNAMURTHY, RAM; YOUNG, IAN; SHARMA, ABHISHEK
To: INTEL CORPORATION
Reel/Frame 055564/0524 →
Continuity (1)
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