Semiconductor device packages with direct electrical connections and related methods

1. A method of making a semiconductor device package, comprising:

forming a stack of semiconductor dice on a substrate, an uppermost semiconductor die of the stack of semiconductor dice located on a side of the stack of semiconductor dice opposite the substrate and being a heat-generating component configured to generate more heat than each underlying semiconductor die of the stack located between the uppermost semiconductor die and the substrate, an active surface of the uppermost semiconductor die facing the underlying semiconductor dice;

electrically interconnecting the underlying semiconductor dice to one another and to the uppermost semiconductor die utilizing a first set of vias extending through underlying semiconductor dice located beneath the uppermost semiconductor die;

directly electrically connecting the uppermost semiconductor die to the substrate utilizing a second set of vias extending through the underlying semiconductor dice, the second set of vias located laterally adjacent to the first set of vias; and

at least partially surrounding the stack of semiconductor dice in an encapsulation material, leaving an inactive surface of the uppermost semiconductor die uncovered by the encapsulation material.

2. The method of claim 1 , further comprising refraining from thinning the uppermost semiconductor die from a wafer-level thickness as measured in a direction perpendicular to an active surface of the uppermost semiconductor die.

3. The method of claim 1 , further comprising rendering a size and shape of the uppermost semiconductor die at least substantially equal to a size and shape of each other semiconductor die in the stack of semiconductor dice.

4. The method of claim 1 , further comprising forming the first set of vias and the second set of vias such that the first set of vias is located laterally between subgroupings of the second set of vias.

5. The method of claim 1 , further comprising positioning the second set of vias to extend through portions of the underlying semiconductor dice lacking integrated circuitry.

6. The method of claim 1 , further comprising leaving the uppermost semiconductor die free of vias.

7. The method of claim 1 , further comprising:

placing a passivation material on a side of the uppermost semiconductor die opposite the substrate; and

placing a heat sink over the passivation material.

8. The method of claim 7 , further comprising placing a thermal interface material over the passivation material before placing the heat sink.

9. The method of claim 8 , wherein placing the thermal interface material over the passivation material comprises placing an electrically conductive thermal interface material over the passivation material.

10. A semiconductor device package, comprising:

a substrate;

a stack of semiconductor dice attached to the substrate, an uppermost semiconductor die of the stack of semiconductor dice located on a side of the stack of semiconductor dice opposite the substrate being a heat-generating component configured to generate more heat than underlying semiconductor dice of the stack located between the uppermost semiconductor die and the substrate, an active surface of the uppermost semiconductor die facing the underlying semiconductor dice;

a first set of vias extending through underlying semiconductor dice located beneath the uppermost semiconductor die, the first set of vias electrically interconnecting the underlying semiconductor dice at least to one another and to the substrate;

a second set of vias extending through the underlying semiconductor dice, the second set of vias directly electrically connecting the uppermost semiconductor die to the substrate, the second set of vias located laterally adjacent to the first set of vias; and

an encapsulation material at least partially surrounding the stack of semiconductor dice, an inactive surface of the uppermost semiconductor die remaining uncovered by the encapsulation material.

11. The semiconductor device package of claim 10 , wherein each underlying semiconductor die in the stack of semiconductor dice between the substrate and the uppermost semiconductor die comprises a memory die and the uppermost semiconductor die comprises a logic die.

12. The semiconductor device package of claim 10 , wherein a size and shape of the uppermost semiconductor die is at least substantially equal to a size and shape of each other semiconductor die in the stack of semiconductor dice.

13. The semiconductor device package of claim 10 , wherein a thickness of the uppermost semiconductor die as measured in a direction perpendicular to the active surface of the uppermost semiconductor die is about 200 μm or greater.

14. The semiconductor device package of claim 10 , wherein the second set of vias extend through portions of the underlying semiconductor dice lacking integrated circuitry.

15. The semiconductor device package of claim 10 , wherein the encapsulation material is flush with the inactive surface of the uppermost semiconductor die.

16. The semiconductor device package of claim 10 , wherein the first set of vias is located laterally between subgroupings of the second set of vias.

17. The semiconductor device package of claim 10 , wherein the uppermost semiconductor die is free of vias.

18. The semiconductor device package of claim 10 , further comprising: a heat sink located on a side of the uppermost semiconductor die opposite the substrate; and a passivation material located between the uppermost semiconductor die and the heat sink.

19. The semiconductor device package of claim 18 , further comprising a thermal interface material located between the passivation material and the heat sink.

20. The semiconductor device package of claim 19 , wherein the thermal interface material is electrically conductive.