Semiconductor package
A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.
1. A semiconductor package, comprises:
a first substrate;
a first layer structure;
a second layer structure;
a first antenna layer formed on at least one of the first layer structure and the second layer structure;
wherein the first layer structure is formed between the first substrate and the second layer structure;
wherein the first antenna layer has an upper surface flush with a layer upper surface of the second layer structure;
wherein no physical conductive element is disposed between the first antenna layer and the first substrate, and the second layer structure is molding compound.
2. The semiconductor package as claimed in claim 1 , further comprises:
a second antenna layer formed on at least one of the first layer structure and the second layer structure.
3. The semiconductor package as claimed in claim 2 , wherein the second layer structure has a layer lower surface, the second antenna layer has an antenna lower surface substantially flush with the layer lower surface.
4. The semiconductor package as claimed in claim 1 , wherein the first layer structure comprises a first package body having a layer upper surface, the second layer structure comprises a second package body having a layer lower surface directly contact the layer upper surface.
5. The semiconductor package as claimed in claim 1 , further comprises:
an electronic component disposed on a substrate upper surface of the first substrate and encapsulated by the first layer structure.
6. The semiconductor package as claimed in claim 1 , further comprises:
an electronic component disposed on a substrate lower surface of the first substrate and exposed from the first substrate.
7. The semiconductor package as claimed in claim 1 , wherein the second layer structure comprises a package body, the first antenna layer is embedded in the package body.
8. The semiconductor package as claimed in claim 1 , wherein the first layer structure comprises a second substrate and a first package body, the second substrate has a receiving portion, and the first package body fills up the receiving portion.
9. The semiconductor package as claimed in claim 8 , further comprises:
an electronic component disposed within the receiving portion and encapsulated by the first package body.
10. The semiconductor package as claimed in claim 8 , further comprises:
an electronic component disposed within the receiving portion and exposed from the first layer structure.
11. A semiconductor package, comprises:
a first substrate;
a first layer structure comprising a conductive pillar layer, wherein the conductive pillar layer comprises a pillar having a lateral surface which is not encapsulated by any physical material;
a second layer structure;
a first antenna layer formed on at least one of the first layer structure and the second layer structure;
wherein the first layer structure is formed between the first substrate and the second layer structure;
wherein the conductive pillar layer electrically connects the second layer structure with the first substrate.
12. The semiconductor package as claimed in claim 11 , wherein the second layer structure has a layer upper surface, the first antenna layer has an antenna upper surface substantially flush with the layer upper surface.
13. The semiconductor package as claimed in claim 11 , further comprises:
a second antenna layer formed on at least one of the second layer structure.
14. The semiconductor package as claimed in claim 13 , wherein the second layer structure has a layer lower surface, the second antenna layer has an antenna lower surface substantially flush with the layer lower surface.
15. The semiconductor package as claimed in claim 11 , further comprises:
an electronic component disposed on a substrate upper surface of the first substrate and surrounded by the conductive pillar layer.
16. The semiconductor package as claimed in claim 11 , further comprises:
an electronic component disposed on a substrate lower surface of the first substrate and exposed from the first substrate.
17. The semiconductor package as claimed in claim 16 , wherein the second layer structure comprises a package body, the first antenna layer is embedded in the package body.