Barrier for preventing eutectic break-through in through-substrate vias
A method involving a barrier for preventing eutectic break-through in through-substrate vias is disclosed. The method generally includes steps (A) to (D). Step (A) may form one or more vias through a substrate. The substrate generally comprises a semiconductor. Step (B) may form a first metal layer. Step (C) may form a barrier layer. The barrier layer generally resides between the vias and the first metal layer. Step (D) may form a second metal layer. The second metal layer may be in electrical contact with the first metal layer through the vias and the barrier layer.
1. A device, comprising:
a substrate;
a barrier layer formed on a first side of said substrate;
a first metal layer formed directly on said barrier layer and over said first side of said substrate;
one or more vias formed through said substrate; and
a second metal layer formed directly on a second side of said substrate, into said one or more vias, and directly on sidewalls of said one or more vias, said second metal layer being in direct electrical and physical contact with said second side of said substrate, said sidewalls of said one or more vias, and a bottom surface of said barrier layer formed over said first side of said substrate.
2. The device according to claim 1 , wherein said second metal layer comprises:
a seed layer formed directly on said second side of said substrate, into said one or more vias, directly on said sidewalls of said one or more vias, and directly on said bottom surface of said barrier layer formed over said first side of said substrate within said one or more vias; and
a back-metal layer formed directly on said seed layer and over said second side of said substrate.
3. The device according to claim 1 , wherein said second metal layer comprises gold and said substrate comprises a silicon semiconductor substrate.
4. The device according to claim 1 , further comprising a eutectic alloy formed from said second metal layer and said substrate through heating.
5. The device according to claim 4 , wherein said barrier layer has a composition configured to prevent a breach of said barrier layer by said eutectic alloy and an intermix of said eutectic alloy with said first metal layer caused by said heating.
6. The device according to claim 1 , further comprising:
an epitaxial layer formed directly on said first side of said substrate, wherein:
said barrier layer is formed directly on said epitaxial layer; and
said one or more vias extend from said second side of said substrate, through said substrate, through said epitaxial layer, and to said barrier layer.
7. The device according to claim 1 , further comprising:
an epitaxial layer formed directly on said first side of said substrate, wherein:
said barrier layer is formed over said first side of said substrate and over said one or more vias formed through said substrate.
8. A semiconductor structure, comprising:
a substrate;
a barrier layer formed over a first side of said substrate;
one or more vias that extend from a second side of said substrate, through said substrate, and to said barrier layer over said first side of said substrate; and
a metal layer formed directly on said second side of said substrate, into said one or more vias, directly on sidewalls of said one or more vias, and directly on a bottom surface of said barrier layer formed over said first side of said substrate.
9. The semiconductor structure according to claim 8 , wherein said metal layer comprises:
a seed layer formed directly on said second side of said substrate, into said one or more vias, directly on said sidewalls of said one or more vias, and directly on said bottom surface of said barrier layer formed over said first side of said substrate; and
a back-metal layer formed directly on said seed layer and over said second side of said substrate.
10. The semiconductor structure according to claim 9 , wherein:
said seed layer comprises a titanium-gold layer; and
said back-metal layer comprises a gold layer.
11. The semiconductor structure according to claim 9 , wherein:
said seed layer comprises a sputtered titanium-gold layer; and
said back-metal layer comprises a plated gold layer.
12. The semiconductor structure according to claim 8 , wherein said metal layer comprises gold and said substrate comprises a silicon semiconductor substrate.
13. The semiconductor structure according to claim 8 , wherein said barrier layer comprises titanium over said first side of said substrate.
14. The semiconductor structure according to claim 8 , wherein said barrier layer comprises a plurality of sputtered metal layers over said first side of said substrate.
15. The semiconductor structure according to claim 14 , wherein said barrier layer comprises:
a titanium-tungsten layer;
a titanium-tungsten-nitride layer directly on said titanium-tungsten layer; and
a titanium-gold layer directly on said titanium-tungsten-nitride layer.
16. The semiconductor structure according to claim 8 , further comprising a eutectic alloy formed from said metal layer and said substrate through heating.
17. The semiconductor structure according to claim 16 , further comprising a second metal layer formed directly on said barrier layer and over said first side of said substrate.
18. The semiconductor structure according to claim 17 , wherein said barrier layer prevents an intermix of said eutectic alloy with said second metal layer caused by said heating.
19. The semiconductor structure according to claim 8 , further comprising:
an epitaxial layer formed directly on said first side of said substrate, wherein:
said barrier layer is formed directly on said epitaxial layer; and
said one or more vias extend from said second side of said substrate, through said substrate, through said epitaxial layer, and to said barrier layer.
20. The semiconductor structure according to claim 8 , further comprising:
an epitaxial layer formed directly on said first side of said substrate, wherein:
said barrier layer is formed over said first side of said substrate and over said one or more vias formed through said substrate.