Insulated-gate semiconductor device and method of manufacturing the same
An insulated-gate semiconductor device, which has trenches arranged in a chip structure, the trenches defining both sidewalls in a first and second sidewall surface facing each other, includes: a first unit cell including a main-electrode region in contact with a first sidewall surface of a first trench, a base region in contact with a bottom surface of the main-electrode region and the first sidewall surface, a drift layer in contact with a bottom surface of the base region and the first sidewall surface, and a gate protection-region in contact with the second sidewall surface and a bottom surface of the first trench; and a second unit cell including an operation suppression region in contact with a first sidewall surface and a second sidewall surface of a second trench, wherein the second unit cell includes the second trench located at one end of an array of the trenches.
1. An insulated-gate semiconductor device having a plurality of trenches arranged in a chip structure, the plurality of trenches defining both sidewalls in a first sidewall surface having a first inclination angle with respect to a reference plane of the chip structure and a second sidewall surface facing the first sidewall surface and having a second inclination angle different from the first inclination angle with respect to the reference plane, comprising:
a first unit cell provided with an insulated-gate electrode structure in a first trench included in the plurality of trenches and including a first conductivity type main-electrode region being in contact with a first sidewall surface of the first trench, a second conductivity type base region being in contact with a bottom surface of the main-electrode region and the first sidewall surface, a first conductive type drift layer being in contact with a bottom surface of the base region and the first sidewall surface and having an impurity concentration lower than that of the main-electrode region, and a second conductivity type gate protection-region being in contact with the second sidewall surface and a bottom surface of the first trench and having an impurity concentration higher than that of the base region; and
a second unit cell provided with an insulated-gate electrode structure in a second trench included in the plurality of trenches and including a second conductivity type operation suppression region being buried in an upper portion of the drift layer, being in contact with a first sidewall surface and a second sidewall surface of the second trench, and having an impurity concentration higher than that of the base region,
wherein the second unit cell is arranged so as to include the second trench located at one end of an array of the plurality of trenches.
2. The insulated-gate semiconductor device of claim 1 , wherein the first unit cell is arranged adjacent to the second unit cell, and
the drift layer, the main-electrode region and the base region of the first unit cell exist between the gate protection-region of the first unit cell and the operation suppression region of the second unit cell.
3. The insulated-gate semiconductor device of claim 1 , wherein the first unit cell is arranged adjacent to the second unit cell, and
the gate protection-region of the first unit cell and the operation suppression region of the second unit cell are implemented by a common semiconductor region.
4. The insulated-gate semiconductor device of claim 1 , wherein the second unit cell is arranged so as to include the second trenches located at both ends of the array of the plurality of trenches, respectively.
5. The insulated-gate semiconductor device of claim 1 , wherein a plurality of the second unit cells are arranged adjacent to each other so as to include the adjacent second trenches located at one end of the array of the plurality of trenches, respectively.
6. The insulated-gate semiconductor device of claim 1 , wherein the first sidewall surface is an a-plane.
7. The insulated-gate semiconductor device of claim 1 , wherein the first sidewall surface has a smaller inclination angle to an Si plane side than the second sidewall surface.
8. The insulated-gate semiconductor device of claim 1 , wherein the insulated-gate semiconductor device is an insulated-gate semiconductor device using SiC.