Multilayer ceramic capacitor with outer electrodes including resin layers

1. A multilayer ceramic capacitor comprising:

a multilayer body including a plurality of dielectric layers and a plurality of inner electrode layers that are stacked on top of one another, and including a first main surface and a second main surface that face each other in a height direction, a first side surface and a second side surface that face each other in a width direction, which is perpendicular or substantially perpendicular to the height direction, and a first end surface and a second end surface that face each other in a length direction, which is perpendicular or substantially perpendicular to the height direction and the width direction; and

a pair of outer electrodes that are connected to the inner electrode layers and are provided on the end surfaces, a portion of the first main surface, a portion of the second main surface, a portion of the first side surface, and a portion of the second side surface; wherein the second main surface of the multilayer body defines and functions as a mounting surface;

the pair of outer electrodes each include a base electrode layer that includes an electrically conductive metal and a glass component, a resin electrode layer that includes a thermosetting resin and a metal component, and a resin layer that does not include an electrically conductive component;

the base electrode layers respectively extend from the first end surface and the second end surface onto a portion of the first main surface and a portion of the second main surface and onto a portion of the first side surface and a portion of the second side surface;

the resin layers respectively cover the base electrode layers in at least regions located on the second main surface side and respectively extend from the second main surface side onto at least a portion of the first end surface and at least a portion of the second end surface;

the resin electrode layers directly cover the base electrode layers in portions where the resin layers are not located on the first end surface and the second end surface and cover the resin layers;

the resin electrode layers directly cover the base electrode layers at at least center-most portions of the first end surface and the second end surface;

an entirety of each of the resin electrode layers includes a conductive paste having only one composition; and

the conductive paste includes the thermosetting resin and the metal component.

2. The multilayer ceramic capacitor according to claim 1 , wherein the resin layers entirely cover a region of the second main surface where the base electrode layers are not located.

3. The multilayer ceramic capacitor according to claim 1 , wherein a total of a thickness of the resin layer on the base electrode layer located on the first main surface, the second main surface, the first side surface, or the second side surface and a thickness of the resin electrode layer located on the resin layer is the same or substantially the same as a thickness of the resin electrode layer directly provided on the base electrode layer located on the first end surface or the second end surface.

4. The multilayer ceramic capacitor according to claim 1 , wherein plating layers are provided on the resin electrode layers.

5. The multilayer ceramic capacitor according to claim 1 , wherein

the resin layers cover the base electrode layers in at least a region located on the first main surface side; and

the resin electrode layers cover the base electrode layers in portions where the resin layers are not located and cover the resin layers.

6. The multilayer ceramic capacitor according to claim 1 , wherein

the resin layers cover the base electrode layers in regions located on the first side surface side and the second side surface side.

7. The multilayer ceramic capacitor according to claim 6 , wherein

the resin layers are provided on the first side surface side and the second side surface side so as to extend onto at least the portion of the first end surface and at least the portion of the second end surface;

the resin electrode layers are directly connected to the base electrode layers only at center portions of the first end surface and the second end surface and cover the resin layers; and

the center portions of the first end surface and the second end surface include the center-most portions of the first end surface and the second end surface.

8. The multilayer ceramic capacitor according to claim 1 , wherein each of the resin electrode layers includes a first resin electrode layer and a second resin electrode layer.

9. The multilayer ceramic capacitor according to claim 1 , wherein the resin electrode layers completely cover the base electrode layers.

10. The multilayer ceramic capacitor according to claim 1 , wherein the resin electrode layers are shorter than the base electrode layers.

11. The multilayer ceramic capacitor according to claim 1 , wherein the thermosetting resin includes at least one of epoxy resin, a phenol resin, a urethane resin, a silicone resin, and a polyimide resin.

12. The multilayer ceramic capacitor according to claim 1 , wherein the resin electrode layers include a curing agent.

13. The multilayer ceramic capacitor according to claim 1 , wherein the metal component includes one of Ag, Cu, an alloy of Ag, and an alloy of Cu.

14. The multilayer ceramic capacitor according to claim 1 , wherein the metal component includes metal powder particles coated with Ag.

15. The multilayer ceramic capacitor according to claim 14 , wherein the metal powder particles are made of Ni or Cu.

16. The multilayer ceramic capacitor according to claim 1 , wherein the metal component is about 35-75 percent by volume of an entire volume of the resin electrode layers.

17. The multilayer ceramic capacitor according to claim 1 , wherein each of the resin layers includes a first resin layer and a second resin layer.

18. The multilayer ceramic capacitor according to claim 1 , wherein a material of the resin layers includes one of epoxy resin, a phenol resin, a urethane resin, a silicone resin, and a polyimide resin.