Laser processing apparatus
A laser processing apparatus has a liquid supply mechanism disposed at an upper portion of a holding unit. The liquid supply mechanism includes: a pool adapted to form a layer of a liquid on an upper surface of a workpiece held by a holding table; a transparent plate disposed such as to make contact with the layer of the liquid; a jet nozzle adapted to jet the liquid by positioning a jet port between an upper surface of the workpiece and the transparent plate toward an application position of a laser beam applied to the workpiece through the transparent plate; a liquid supply nozzle adapted to supply the liquid from one side of the pool; and a liquid discharge nozzle adapted to discharge the liquid from the other side of the pool.
1. A laser processing apparatus comprising:
a holding unit including a holding table adapted to hold a plate-shaped workpiece;
a laser beam applying unit adapted to apply a laser beam to the workpiece held by the holding table to process the workpiece; and
a liquid supply mechanism disposed on the holding unit,
wherein the liquid supply mechanism includes:
a pool adapted to form a layer of a liquid on an upper surface of the workpiece held by the holding table;
a transparent plate disposed such as to make contact with the layer of the liquid;
a jet nozzle adapted to jet the liquid toward an application position of the laser beam applied to the workpiece through the transparent plate;
a liquid supply nozzle adapted to supply the liquid from one side of the pool; and
a liquid discharge nozzle adapted to discharge the liquid from other side of the pool.
2. The laser processing apparatus according to claim 1 , wherein the laser beam applying unit includes dispersing means dispersing the laser beam emitted from a laser oscillator.