IP Library Granted Patent US 11,378,617
Granted Patent B2
US 11,378,617 · App. 16/176,372 · Granted Jul 5, 2022

Apparatus for prediction of failure of a functional circuit

Inventors: Michael Doescher (Hamburg, DE); Jan-Peter Schat (Hamburg, DE)
Assignee: NXP B.V.
G01R31/2884G01R31/2856G01R31/3004G01R31/3016
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Quick Facts
Patent No.
US 11,378,617
App. No.
16/176,372
Granted
Jul 5, 2022
Kind
B2
Abstract

An apparatus comprising: a functional circuit comprising one or more circuit components configured to perform a function based on one or more first input signals; at least one failure-prediction circuit for use in predicting failure of the functional circuit, the failure-prediction circuit comprising a replica of the functional circuit in terms of constituent circuit components; wherein the failure-prediction circuit is configured to be more susceptible to failure than said functional circuit, wherein the apparatus is configured to provide a prediction of failure of the functional circuit based on a determination of failure of the failure-prediction circuit.

Claims (89)

1. An apparatus, comprising:

a first functional circuit comprising one or more first circuit components configured to perform a function based on one or more first input signals;

a first failure-prediction circuit for use in predicting failure of the first functional circuit, the first failure-prediction circuit comprising one or more first replica circuit components of the first circuit components;

wherein the first failure-prediction circuit is configured to be more susceptible to failure than said functional circuit in terms of:

(a) the one or more first replica circuit components having one or more dimensions more susceptible to failure than the corresponding dimensions of the associated first circuit components;

(b) the one or more first replica circuit components having a different shape more susceptible to failure than the corresponding shape of the associated first circuit components; and

(c) the first failure-prediction circuit is positioned relative to the first functional circuit such that, in use, the first failure-prediction circuit experiences a higher operating temperature than the first functional circuit;

wherein the apparatus is configured to provide a prediction of failure of the first functional circuit based on a determination of failure of the first failure-prediction circuit; and

a second failure-prediction circuit for use in predicting failure of the first functional circuit, the second failure-prediction circuit comprising one or more second replica circuit components of the first circuit components,

wherein the second failure-prediction circuit is configured to be more susceptible to failure than said first failure-prediction circuit in terms of the one or more circuit components of the second failure-prediction circuit are fabricated having one or more dimensions more susceptible to failure than the corresponding dimensions of the first failure-prediction circuit, and

wherein the second failure-prediction circuit is configured to be provided with one or more third input signals based on the one or more first input signals, the one or more third input signals comprising at least one property that is greater in magnitude than the corresponding property of the one or more second input signals.

2. The apparatus of claim 1 , wherein the one or more dimensions of the first replica circuit components comprises one or more of:

(a) the area of a junction of a transistor component;

(b) the width of a terminal of an electronic component; and

(c) the thickness of a semi-conductor layer.

3. The apparatus of claim 1 , wherein the first failure-prediction circuit is further configured to be more susceptible to failure than said first functional circuit in terms of the being provided with one or more second input signals based on the one or more first input signals, the one or more second input signals having at least one property that is greater in magnitude than the corresponding property of the one or more first input signals.

4. The apparatus of claim 3 , wherein the one or more second input signals have a property that is greater in magnitude than the corresponding property of the one or more first input signals in terms of having one or more of:

(a) a greater voltage magnitude;

(b) a greater current magnitude;

(c) a greater frequency magnitude;

(d) a greater period magnitude; and

(e) a greater bandwidth magnitude.

5. The apparatus of claim 1 , wherein the apparatus is configured to provide for determination of the failure of the first failure-prediction circuit in accordance one or more of the following time schedules:

(a) at predetermined intervals;

(b) on start-up of the apparatus; and

(c) on receipt of an instruction signal from a device remote from the apparatus.

6. The apparatus of claim 1 , further comprising:

a testing block configured to provide said prediction of failure based on measurement of the failure of the first failure-prediction circuit.

7. The apparatus of claim 1 , wherein the second failure-prediction circuit is configured to be more susceptible to failure than said first failure-prediction circuit in terms of:

(a) the one or more second replica circuit components are fabricated having one or more dimensions more susceptible to failure than the corresponding dimensions of the associated first circuit components; and

(b) the one or more second replica circuit components are fabricated having a different shape more susceptible to failure than the corresponding shape of the associated first circuit components;

wherein the apparatus is further configured to provide a prediction of failure of the first functional circuit based on a determination of failure of the second failure-prediction circuit.

8. The apparatus of claim 7 wherein the second failure-prediction circuit is configured to be more susceptible to failure than the first failure-prediction circuit in terms of:

(a) the one or more circuit components of the second failure-prediction circuit, at least in part, are fabricated having a different shape more susceptible to failure than the corresponding shape of the first failure-prediction circuit;

(b) the second failure-prediction circuit is positioned relative to the first failure-prediction circuit such that, in use, the second failure-prediction circuit experiences a higher operating condition than the first failure-prediction circuit and wherein the higher operating condition is one or more of, in use, a higher operating temperature and a higher local magnetic field strength.

9. The apparatus of claim 7 wherein the second failure-prediction circuit is configured to have the same susceptibility to failure as the first failure-prediction circuit in terms of:

(a) the one or more circuit components of the second failure-prediction circuit are fabricated having one or more dimensions equally susceptible to failure as the corresponding dimensions of the first failure-prediction circuit;

(b) the one or more circuit components of the second failure-prediction circuit are fabricated having a shape equally susceptible to failure as the corresponding shape of the first failure-prediction circuit;

(c) the second failure-prediction circuit is configured to be provided with one or more third input signals based on the one or more first input signals, the one or more third input signals comprising at least one property that is equal in magnitude to the corresponding property of the one or more second input signals; and

(d) the second failure-prediction circuit is positioned relative to the first failure-prediction circuit such that, in use, the second failure-prediction circuit experiences substantially the same operating condition as the functional circuit and wherein the operating condition is one or more of, in use, an operating temperature and a local magnetic field strength.

10. An apparatus, comprising:

a first functional circuit comprising one or more first circuit components configured to perform a function based on one or more first input signals;

a first failure-prediction circuit for use in predicting failure of the first functional circuit, the first failure-prediction circuit comprising one or more first replica circuit components of the first functional circuit;

wherein the failure-prediction circuit is configured to be more susceptible to failure than said functional circuit in terms of:

(a) the one or more first replica circuit components are fabricated having one or more dimensions more susceptible to failure than the corresponding dimensions of the associated first circuit components;

(b) the first failure-prediction circuit being provided with one or more second input signals based on the one or more first input signals, the one or more second input signals comprising at least one property that is greater in magnitude than the corresponding property of the one or more first input signals; and

(c) the first failure-prediction circuit is positioned relative to the first functional circuit such that, in use, the first failure-prediction circuit experiences a higher operating temperature than the first functional circuit;

wherein the electronic device is configured to provide a prediction of failure of the first functional circuit based on a determination of failure of the first failure-prediction circuit; and

a second failure-prediction circuit for use in predicting failure of the first functional circuit, the second failure-prediction circuit comprising one or more second replica circuit components of the first circuit components,

wherein the second failure-prediction circuit is configured to be more susceptible to failure than said first failure-prediction circuit in terms of the one or more circuit components of the second failure-prediction circuit are fabricated having one or more dimensions more susceptible to failure than the corresponding dimensions of the first failure-prediction circuit, and

wherein the second failure-prediction circuit is configured to be provided with one or more third input signals based on the one or more first input signals, the one or more third input signals comprising at least one property that is greater in magnitude than the corresponding property of the one or more second input signals.

11. A method for providing prediction of failure of a functional circuit of an apparatus, the apparatus comprising:

the functional circuit comprising one or more functional circuit components configured to perform a function based on one or more first input signals;

a first failure-prediction circuit for use in predicting failure of the functional circuit, the first failure-prediction circuit comprising one or more first replica circuit components of the functional circuit components;

wherein the first failure-prediction circuit is configured to be more susceptible to failure than said functional circuit in terms of one or more of:

(a) the first failure-prediction circuit is configured to be provided with one or more second input signals based on the one or more first input signals, the one or more second input signals comprising at least one property that is greater in magnitude than the corresponding property of the one or more first input signals;

(b) the first failure-prediction circuit is positioned relative to the functional circuit such that, in use, the first failure-prediction circuit experiences a higher environmental operating condition than the functional circuit; and

(c) the first failure-prediction circuit is positioned relative to the functional circuit such that, in use, the first failure-prediction circuit experiences a higher operating temperature than the first functional circuit;

a second failure-prediction circuit for use in predicting failure of the functional circuit, the second failure-prediction circuit comprising one or more second replica circuit components of the first circuit components,

wherein the second failure-prediction circuit is configured to be more susceptible to failure than said first failure-prediction circuit in terms of the one or more circuit components of the second failure-prediction circuit are fabricated having one or more dimensions more susceptible to failure than the corresponding dimensions of the first failure-prediction circuit, and

wherein the second failure-prediction circuit is configured to be provided with one or more third input signals based on the one or more first input signals, the one or more third input signals comprising at least one property that is greater in magnitude than the corresponding property of the one or more second input signals; and

the method comprising:

determining a failure of the failure-prediction circuit; and

predicting the failure of the functional circuit based on determining the failure of the failure-prediction circuit.

12. The apparatus of claim 1 , wherein the failure-prediction circuit is further configured to be more susceptible to failure than said functional circuit in terms of the being positioned relative to the functional circuit such that, in use, the failure-prediction circuit experiences a higher environmental operating condition than the functional circuit.

13. The apparatus of claim 1 , further comprising:

a second functional circuit comprising one or more second circuit components configured to perform the function based on one or more second input signals, wherein the apparatus is configured to provide a prediction of failure of the second functional circuit based on a determination of failure of the first failure-prediction circuit.

14. The apparatus of claim 10 , wherein the one or more dimensions of the first replica circuit components comprises one or more of:

(a) the area of a junction of a transistor component;

(b) the width of a terminal of an electronic component; and

(c) the thickness of a semi-conductor layer.

15. The apparatus of claim 10 , wherein the one or more second input signals have a property that is greater in magnitude than the corresponding property of the one or more first input signals in terms of having one or more of:

(a) a greater voltage magnitude;

(b) a greater current magnitude;

(c) a greater frequency magnitude;

(d) a greater period magnitude; and

(e) a greater bandwidth magnitude.

16. The apparatus of claim 10 , wherein the apparatus is configured to provide for determination of the failure of the first failure-prediction circuit in accordance one or more of the following time schedules:

(a) at predetermined intervals;

(b) on start-up of the apparatus; and

(c) on receipt of an instruction signal from a device remote from the apparatus.

17. The apparatus of claim 10 , further comprising:

a testing block configured to provide said prediction of failure based on measurement of the failure of the first failure-prediction circuit.

18. The apparatus of claim 10 , wherein the second failure-prediction circuit is configured to be more susceptible to failure than said first failure-prediction circuit in terms of:

the second failure-prediction circuit being provided with one or more second input signals based on the one or more first input signals, the one or more second input signals comprising at least one property that is greater in magnitude than the corresponding property of the one or more first input signals;

wherein the apparatus is further configured to provide a prediction of failure of the first functional circuit based on a determination of failure of the second failure-prediction circuit.

19. The apparatus of claim 10 , wherein the failure-prediction circuit is further configured to be more susceptible to failure than said functional circuit in terms of the being positioned relative to the functional circuit such that, in use, the failure-prediction circuit experiences a higher environmental operating condition than the functional circuit.

20. The apparatus of claim 10 , further comprising:

a second functional circuit comprising one or more second circuit components configured to perform the function based on one or more second input signals, wherein the apparatus is configured to provide a prediction of failure of the second functional circuit based on a determination of failure of the first failure-prediction circuit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2018
From: DOESCHER, MICHAEL; SCHAT, JAN-PETER
To: NXP B.V.
Reel/Frame 047370/0746 →
Priority Claims (1)
EP 17208592 · Dec 19, 2017 · regional
Continuity (1)
Related Publication 20190187204A1 · Jun 20, 2019